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    SG-BGA-6180 Search Results

    SG-BGA-6180 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202LF
    		Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    74221-201LF
    		Amphenol Communications Solutions 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free PDF
    84500-002
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84500-102
    		Amphenol Communications Solutions 300 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array PDF
    84517-001
    		Amphenol Communications Solutions 200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array PDF

    SG-BGA-6180 Datasheets (1)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SG-BGA-6180
    		Ironwood Electronics GHz BGA Sockets-1.27mm; IC Size X (mm): 45; IC Size Y (mm): 45; IC Array X: 34; IC Array Y: 34; Max Pincount: 1156; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.75; IC Ball Height Max (mm): 0.7; IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.51; Max Package Code: BGA1156; Backing Plate: yes; Cavity Down: no; Heat Sink: no; IC Top Surface: Mold Cap; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF) Original PDF 187.53KB 4