SOAK Search Results

E5CK-TAA1-500

Abstract: E53-R4R4 E5AK omron software E53-C4DR4 E53-Q4R4 E5CK-AA1-500 H301-E3-1 IEC-1010 E53-CK03
Contextual Info: Ramp/Soak Process Controller E5CK-T Advanced, 1/16-DIN Ramp/Soak Process Controllers Ideal for Worldwide Use D D D D D D D D D Offers one pattern of simple programming control, up to four patterns with communications 16 steps per pattern . Water-resistant front face meets IP66/NEMA 4 (indoor

Vapor Phase Soldering tantalum capacitors

Abstract: thermal mass 185-C PREHEAT
Contextual Info: General Technical Information Recommended Soldering Profiles For Surface Mount Tantalum Capacitors Component Land Temperature °C IR and Convection Reflow Assembly exits heat no forced cooldown Additional soak time to allow uniform heating of the substrate

IC Ultrasonic

Abstract: Water soluble flux
Contextual Info: • STANDARD SOLDERING CONDITIONS Sufficient preheating of the product Is required. Temperature difference A T between the soJder tempera­ ture and the part surface is to be within the limit indicated in the table. In case oi quick cooling- soaking in solvent after soldering,

reflow profile

Contextual Info: CD-SP2 Recommended Solder Reflow Profile Parameter Average temperature gradient in preheating Soak Time Time Above 217°C Time Above 230°C Time Above 250°C Peak Temperature in reflow Temperature gradient in cooling Reference soak t1 t2 t3 Tpeak Specification

Contextual Info: CSC32 Series Compact Benchtop Controllers Optional Communications Bundled with Free Software From $ 345 Basic Unit MADE IN USA ߜ Rugged Metal Benchtop Enclosure ߜ 4-Digit Display, 1 or 0.1° Resolution ߜ Full Autotune PID Heat-Cool Control ߜ Single Ramp and Soak Capability

Murata ultrasonic

Contextual Info: !Notice other 1. Cleaning Conditions: The total cleaning time of soaking, ultrasonic and steam methods should be within 5 minutes. Consult with Murata concerning the cleaning solvent. In order to totally abolish ODC (Freon, Trichrolethan), Murata has carried out testing on non-cleaning and water cleaning (watersoluble flux, water-soluble cream solder, water-based cleaning

Contextual Info: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S2745- S- M Solder Soakers - S2745- S- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package

Contextual Info: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S1227- O- M Solder Soakers - S1227- O- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package

Contextual Info: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S2432- O- M Solder Soakers - S2432- O- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package

Contextual Info: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S3219- O- M Solder Soakers - S3219- O- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package

Contextual Info: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S3020- P- M Solder Soakers - S3020- P- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package

Contextual Info: A firm Commitment to excellence with a global perspective and an eye to the future Home » Solder Soakers » S3030- R- M Solder Soakers - S3030- R- M Features: Custom die- cut sponges available minimum quantity 2,500 RoHS Compliant "T"=10 per package "M"=1000 per package

Contextual Info: PID Controllers Temperature Controls T2000 • • • • • • • • • • • • T2000 1/16 DIN and 1/32 DIN NEMA 4X protection Autotune automatically sets PID parameters Single ramp/soak program Heat-cool operation AC or DC power supply Inputs: Thermocouple, RTD, 0-50mV

141-50-FEP

Abstract: 250-50-FEP 141-75-FEP 86-50-FEP 141-35-FEP ECR 86-50 141-60-FEP 14175
Contextual Info: ELCURIGID High screened coaxial RF-cable with tin soaked braid Business Group Industrial Applications 1 Title SN 39 225 E Stand: 24.11.99 Seite 1 v 6 Detail specification for high screened coaxial RF-cable with tin soaked braid 2 Specifications Generic specification:

BD9701CP-V5

Contextual Info: Reliability Test Result DEVICE : BD9701CP-V5 RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat(*2)

Catalog ROHM

Contextual Info: Reliability Test Result DEVICE : BU16027KV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Temperature Cycling(*1) Tstg min (30min) / Tstg max (30min)

VSON008X2030

Contextual Info: Reliability Test Result DEVICE : BR93H□□-W Series RESULT ITEM METHOD CONDITION n pcs pn(pcs) － 77 x 3 Resistance to Soldering Heat (*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (*2)

BU16024KV

Contextual Info: Reliability Test Result DEVICE : BU16024KV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Temperature Cycling(*1) Tstg min (30min) / Tstg max (30min)

BU52013HFV

Contextual Info: Reliability Test Result DEVICE : BU52013HFV RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)

bd9842

Abstract: bd98 BD9842FV
Contextual Info: Reliability Test Result DEVICE : BD9842FV RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat(*2)

Contextual Info: Reliability Test Result DEVICE : BA2903S Family RESULT ITEM METHOD n pn pcs (pcs) − 22 x 3 10sec 22 x 3 CONDITION Resistance to Soldering Heat (#1) Soldering heat stress (IR reflow : peak 260℃) Resistance to Soldering Heat (#1) Soak into solder tub 260±3℃

Contextual Info: Reliability Test Result DEVICE : BD9192GUL RESULT ITEM METHOD n pn pcs (pcs) － 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)

BU52003GUL

Contextual Info: Reliability Test Result DEVICE : BU52003GUL RESULT ITEM METHOD n pn pcs (pcs) − 22 CONDITION Resistance to Soldering Heat(*2) After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260℃) Thermal Shock(*1) 100℃(5min) / 0℃ (5min)

BD9134MUV

Contextual Info: Reliability Test Result DEVICE : BD9134MUV RESULT ITEM Resistance to Soldering Heat *2 METHOD n pn (pcs) (pcs) － 22 CONDITION After the moisture soaking treatment, carry out the soldering heat stress (IR reflow : peak 260°C) Thermal Shock(*1) 100°C (5min) / 0°C (5min)