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    SO16E PACKAGE Search Results

    SO16E PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54ACT825/QKA
    		Rochester Electronics LLC 54ACT825/QKA - Dual marked (5962-9161101MKA), D-Type Flip-Flop, 5V, 24-CFP PDF Buy
    TLP292-4
    		Toshiba Electronic Devices & Storage Corporation Photocoupler (phototransistor output), AC input, 3750 Vrms, 4 channel, SO16 Datasheet
    TLP293-4
    		Toshiba Electronic Devices & Storage Corporation Photocoupler (phototransistor output), DC input, 3750 Vrms, 4 channel, SO16 Datasheet
    TLP294-4
    		Toshiba Electronic Devices & Storage Corporation Photocoupler (phototransistor output), AC input, 3750 Vrms, 4 channel, SO16 Datasheet
    TLP295-4
    		Toshiba Electronic Devices & Storage Corporation Photocoupler (phototransistor output), DC input, 3750 Vrms, 4 channel, SO16 Datasheet

    SO16E PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SO16E

    Abstract: SO16E Package SO20G SO28B
    Contextual Info: 0.025" pitch L 3.18mm [0.125"] Y T 7.01mm [0.276"] Pin1 X 0.025" pitch 10.16mm [0.400"] Top View 1 3.26mm [0.128"] 4.84mm [0.190"] 0.46mm [0.018"] 3 7.62mm [0.300"] 2 End View Side View 2.54mm [0.100"] Bottom View Part Number 1 Substrate: 2.39mm ±0.18mm [0.094" ±0.007"]


    Original     		pc-soic/dip16-05fr4/g10so20gpc-soic/dip24-03+5so24hpc-soic/dip28-05so28bso16eso16e package PDF

    SO16E

    Abstract: SO16E Package PC-SOIC/DIP24-04 SO20G
    Contextual Info: L 0.65mm pitch 3.18mm [0.125"] T Y 7.01mm [0.276"] Pin1 0.025" pitch X 0.33mm [0.013"] Top View 1 3.26mm [0.128"] 17.78mm [0.700"] 4.84mm [0.190"] 0.46mm [0.018"] 3 2 15.24mm [0.600"] End View Side View Side View 2.54mm [0.100"] Bottom View Part Number 1 Substrate: 2.39mm ±0.18mm [0.094" ±0.007"]


    Original     		fr4/g10pc-soic/dip16-06pc-soic/dip20-06so16e+3so20gso16e packagepc-soic/dip24-04 PDF

    SO14E

    Abstract: so8b so6a SO24C so8e so48 SO34A SO16E Package SO8C SO36B
    Contextual Info: Ironwood Electronics Appendix D AP-D.1 APPENDIX D SOIC Chip Package Specifications: • SOIC with Gull Wing Leads . . . . . . . . . . . . . .page AP-D.2 thru AP-D.5 • SOIC with J-Leads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .page AP-D.6


    Original     		so10asoj28csoj28dsoj30a+16soj32asoj32bsoj32csoj36asoj36bsoj40aso14eso8bso6aso24cso8eso48so34aso16e packageso8cso36b PDF

    Si3215-FM

    Abstract: 31353R-02 SO16E Package Silabs CMR1U-02M fsync in PCM js1 sot23 SO16E DB15F JS3 SOT23
    Contextual Info: Si321xPPQx-EVB EVALUATION BOARD FOR THE Description S i 3 2 1 0 / 1 5 / 1 6 P RO SLIC  This document describes the operation of the Silicon Laboratories ProSLIC® device evaluation platform. The devices supported by this document are the Si3210/15/ 16 and Si3210M/15M/16M; both Si3201 and discrete


    Original     		si321xppqx-evbsi3210/15/si3210m/15m/16msi3201+1125-pinsi3215-fm31353r-02so16e packagesilabscmr1u-02mfsync in pcmjs1 sot23so16edb15fjs3 sot23 PDF

    Si3215-FM

    Abstract: si3201-FS SI3210M-FM 31353R-02 TDK NLC322522T-470K si3210-fm Si3216-FM intl PC MOTHERBOARD CIRCUIT diagram CMR1U-02M Si3216
    Contextual Info: Si321xPPQx-EVB EVALUATION BOARD FOR THE Description S i 3 2 1 0 / 1 5 / 1 6 P RO SLIC „ This document describes the operation of the Silicon Laboratories ProSLIC® device evaluation platform. The devices supported by this document are the Si3210/15/ 16 and Si3210M/15M/16M; both Si3201 and discrete


    Original     		si321xppqx-evbsi3210/15/si3210m/15m/16msi3201+10si3215-fmsi3201-fssi3210m-fm31353r-02tdk nlc322522t-470ksi3210-fmsi3216-fmintl pc motherboard circuit diagramcmr1u-02msi3216 PDF