SN63 PB37 Search Results

SN63

Abstract: SN63 PB37 IPC-J-STD-006 sn63pb37 361F ingot
Contextual Info: Sn63/Pb37 ElectropureTM Solder Alloy Features: - High Purity - Reduces Drossing - Melting Temperature 183° C 361°F - Exceeds IPC-J-STD-006 Specifications Description: Sn63/Pb37 ElectropureTM is a high purity alloy that is composed of 63% tin and 37% lead. ElectropureTM is

SN63 PB37

Contextual Info: PART NUMBER SOLDER SUFFIX SOLDER 8 2 0 9 7 -L F 1 15 " Sn63% , Pb37% 82097 S n96% , Ag4% LF1 TAB LOCATES TERM. # 3 - 4 Sn63% , Pb37% 82097U 8 2 0 9 7 U -L F 1 DOT LOCATES TERM #1 S n96% , Ag4% LF1 SIDE SOLDER SUFFIX 1 .0 2 4 MAX. [ 2 6 .0 0 ] LOT CODE & .0 2 5 SQ. 4

WEDPN8M72VR-XBX

Abstract: A108 A113 WEDPN16M64VR-XBX WEDPN16M64V-XBX WEDPN16M72VR-XBX WEDPN16M72V-XBX WEDPN8M64VR-XBX
Contextual Info: WEDPN16M64V-XBX WEDPN16M72V-XBX WEDPN16M64VR-XBX WEDPN16M72VR-XBX WEDPN8M64VR-XBX WEDPN8M72VR-XBX White Electronic Designs 64MB/128MB REGISTERED SDRAM & 128MB SDRAM PBGA MULTI-CHIP PACKAGE CONSTRUCTION ORGANIZATIONS 16M x 64 SDRAM BALLS n n Eutectic solder Sn63/Pb37

MED427A-1

Contextual Info: MED427-A1 High Voltage Half Bridge CARLSBAD DIVISION DATASHEET KEY FEATURES Miniature size, Multi Chip Module, MCM Significant Reduction Component to existing ½ Bridge Design Convenient mounting, Ball Grid Array, BGA Sn63/Pb37 solder bumps 250nA quiescent current

Contextual Info: SMT POWER INDUCTORS Wire Wound Current Rating: Over 22Apk Finish is Tin/Lead Sn63/Pb37 MSL: 1 Max Reflow Temperature: 235ºC Electrical Specifications @ 25°C — Operating Temperature -55°C to +130°C Part Number PL2058 Inductance @0ADC (µH±10%) Inductance

Contextual Info: SMT Current Sense Transformers Height: 5.1mm Max* Footprint: 8.4mm x 7.2mm Max Current Rating: up to 20A Frequency Range: 50kHz to 1MHz Low Primary DCR version of P820X Lead Finish: Sn63/Pb37 Electrical Specifications @ 25°C - Operating Temperature -40°C to +130°C

MED427-A1

Abstract: MED427A-1 LX1801 igbt 0201 a LX1802 MSAGA11F120D VDD800 MD427 IGBT microsemi HALF CONTROLLER BRIDGE notes
Contextual Info: MED427-A1 INTEGRATED PRODUCTS MicroPower High Voltage Half Bridge DATASHEET KEY FEATURES Miniature size, Multi Chip Module, MCM Significant Reduction Component to existing ½ Bridge Design Convenient mounting, Ball Grid Array, BGA Sn63/Pb37 solder bumps 250nA quiescent current

Contextual Info: SMT POWER INDUCTORS Wire Wound Current Rating: Over 22Apk Finish is Tin/Lead Sn63/Pb37 MSL: 1 Max Reflow Temperature: 235ºC Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C Part Number PL2058 Inductance @0ADC (µH±10%) Inductance

Contextual Info: SMT Current Sense Transformers Height: 5.1mm Max* Footprint: 8.4mm x 7.2mm Max Current Rating: up to 20A Frequency Range: 50kHz to 1MHz Low Primary DCR version of P820X Lead Finish: Sn63/Pb37 Electrical Specifications @ 25°C - Operating Temperature -40°C to +130°C

Contextual Info: SMT POWER INDUCTORS Wire Wound Current Rating: Over 22Apk Finish is Tin/Lead Sn63/Pb37 MSL: 1 Max Reflow Temperature: 235ºC Electrical Specifications @ 25°C — Operating Temperature -55°C to +130°C Part Number PL2058 Inductance @0ADC (µH±10%) Inductance

SN63 PB37

Abstract: Sn63 FR4 substrate SO8F
Contextual Info: 0.039"±0.003" 0.030" 0.100" 0.65mm 0.240" 0.300" 2 0.054" 0.050" 0.015" 0.200" 0.134" 0.023" 0.274" 1 Bottom View Top View Side View 1 2 Substrate: 0.0315"±0.007" FR4/G10 or equivalent high temp material. Solder Balls: SN63 PB37. Description: Package Convertor

Contextual Info: SMT Power Inductor Military/Aerospace Grade Height: 7.1mm Max Footprint: 14.6mm x 12.6mm Max Current Rating: up to 15A MSL: 1 Inductance @ Irated µH ±15% Part Number Frequency Range: 50kHz to 500kHz Finish is Tin/Lead (Sn63/Pb37) Storage Temperature: -55ºC to +130ºC

Contextual Info: SMT Power Inductor Military/Aerospace Grade Height: 7.1mm Max Footprint: 14.6mm x 12.6mm Max Current Rating: up to 15A MSL: 1 Inductance @ Irated µH ±15% Part Number Frequency Range: 50kHz to 500kHz Finish is Tin/Lead (Sn63/Pb37) Storage Temperature: -55ºC to +130ºC

A104

Abstract: A108 A113 W332M64V-XBX W332M72V-XBX W3E32M64S-XBX W3E32M72S-XBX Qual 0004x
Contextual Info: W332M64V-XBX W332M72V-XBX W3E32M64S-XBX W3E32M72S-XBX White Electronic Designs 256MB SDRAM and DDR PBGA MULTI-CHIP PACKAGE CONSTRUCTION ORGANIZATIONS BALLS „ 32M x 64 SDRAM „ Eutectic solder Sn63/Pb37 „ 32M x 72 SDRAM „ Diameter = 0.762mm 0.030 Nominal

Contextual Info: RoHS Sn63%, Pb37% No No Sn96%, Ag4% Yes Yes LF1 I CUSTOMER TERMINAL Ld LU II. _Q □_ O < _LUI SOLDER SUFFIX coo .500 MAX. [12.70] UAV .530 MAX. [13.46] DOT LOCATES TERM. #1 SOLDER SUFFIX LOT CODE & DATE CODE CL A A AREA REPRESENTS TERMINAL PAD DIMENSIONS

pal 007

Abstract: PAL 007 c FR4 substrate PAL 007 a SN63 SN63 PB37 FX-QFE100SC-S-F-01
Contextual Info: 0.041" ±0.003" 0.060" 0.050" 0.050" Pin 1 0.670" 0.010" 0.5 mm 0.700" Ø 0.025" Typ. 2 0.700" 1 0.670" Top View Bottom View Side View 1 Substrate: 0.0315"±0.007" FR4/G10 or equivalent high temp material. 2 Solder Balls: SN63 PB37. Description: Custom Adapter

SN62 PB36 ag2

Abstract: SN62 PB36 ag2 kester SN63 PB36 SN63 PB37 gefstoffv PB36 kester 256 omar SN62 MP Sn62Pb36Ag2
Contextual Info: Sida: 1 / 5 Varuinformationsblad Enligt 91/155/EEG Datum för utskriften: 07.11.2002 Omarbetat: 07.11.2002 1 Namnet pä produkten och företaget • Produktuppgifter · Handelsnamn: 256-; 276 Sn62/Pb36/Ag2,Sn63/Pb37 · Artikelnummer: 7087 · Ämnets användning / tillredningen Lödlegering

Contextual Info: I No No Y es Yes * PART MUST INSERT FULLY TO SURFACE A IN RECOMMENDED GRID Ld LÜ c t: Li_ _Q CL LF1 Pb37% S n96% , Ag4% Q Sn63% , RoHS < CUSTOMER TERMINAL _LdI SOLDER SUFFIX DIMENSION MAY BE EXCEEDED WITH P.C . ELECTRICAL SPECIFICATIONS SOLDER ONLY RECOMMENDED

Contextual Info: FL02M652-00 - Rev. J - Page 1 of 3 Construction: •    High Purity Alumina Substrate Nickel alloy thin-film resistive element Epoxy-resin overcoat Available in RoHS Sn95.5/Ag3.8/Cu0.7 or Non-RoHS (Sn63/Pb37)    

Contextual Info: HE02M852.00 - Rev F - Page 1 of 2 Construction: •    High Purity Alumina or Zirconium Substrate Microstrip Transmission Lines BGA Package Available in RoHS Sn96.5/Ag3.0/Cu0.5 or Non-RoHS (Sn63/Pb37)     

82154R-LF1

Abstract: 82154R Midcom BABT E205930
Contextual Info: PART NUMBER SOLDER SUFFIX SOLDER Sn63%, Pb37% 82154R 82154R-LF1 Sn96%, Ag4% LF1 F 1 G> ELECTRICAL SPECIFICATIONS .325 [8.26] I -025 4 [.64] .030(4) [-76] _ £ 1 . 100 ( 2 ) I [2.54] —i- .048(4) J- [1.22] T RECOMMENDED LAND LAYOUT .065(4) [1.65] TERMINAL PAD DIMENSIONS

Contextual Info: SOLDER SUFFIX CUSTOMER TERMINAL RoHS LEAD Pb — FREE Sn63%, Pb37% No No Sn96%, Ag4% Yes Yes LF1 PART MUST INSERT FULLY TO SURFACE A IN RECOMMENDED GRID .025 SQ.(6) .125 MIN. [.64] [3.18] - A - RECESS LOCATES TERM. #1 .700 MAX. [17.78] _ .625 MAX. _ [15.88]

Contextual Info: SOLDER SUFFIX LF1 CUSTOMER TERMINAL Sn63%, Pb37% Sn96%, Ag4% RoHS LEAD Pb —FREE No No Yes Yes IVidcom * DIMENSION MAY BE EXCEEDED WITH SOLDER ONLY WURTH ELEKTRO NIK ELECTRICAL SPECIFICATIONS 25°C u n le ss o th erw ise n o ted : .415 MAX. [1 0.5 4] PARAMETER

Contextual Info: I Ld d L ct:i_ L LF1 RoHS Pb37% S n 9 6 % , Ag4% _Q CL Q Sn63% , < CUSTOMER TERMINAL _LdI SOLDER SUFFIX No No Yes Yes * DIMENSION MAY BE EXCEEDED WITH SOLDER ONLY G> PRI L in e d> <D - <z) & -CD CUSTOMER TO DETERMINE ELECTRICAL SPECIFICATIONS LAND LAYOUT