SN-PB-AG SOLDER PREFORM Search Results

JEDEC J-STD-020d.1

Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
Contextual Info: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined

sn-pb-ag solder preform

Abstract: sn-pb-ag solder preform data sheet AN1908 MRF19090S
Contextual Info: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1908/D AN1908 Solder Mounting Method for the MRF19090S and Similar Packages Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton

AN1908

Abstract: MRF19090S
Contextual Info: MOTOROLA Order this document by AN1908/D SEMICONDUCTOR APPLICATION NOTE AN1908 Solder Mounting Method for the MRF19090S and Similar Packages Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton INTRODUCTION The following document describes a solder mounting

SN96

Contextual Info: AT C H I G H P O W E R R E S I S T I V E P R O D U C T S Attachment Recommendations to Ground Plane for Leaded and Flanged Resistors and Terminations Avoid introducing solder to the entire bond area prior to soldering, i.e. do not use a solder pre-form the same size as the entire resistor chip. Solder pre-form

LMH6321TS

Abstract: 630540 3RD Rail Engineering
Contextual Info: Company URL for Additional Information http://www.national.com/quality/green/ National Semiconductor Contact Gerry Fields Title VP Quality Phone 1-408-721-8435 Part Number MSL Rating Peak Body Temp C MaxTime Sec Cycles 3 235 30 4 Weight (mg) Unit Type LMH6321TS

MRF286

Abstract: MRF286 Motorola AN1673 SOCKET HEAD CAP SCREWS
Contextual Info: MOTOROLA AN1673 Order this document by AN1673/D SEMICONDUCTOR APPLICATION NOTE AN1673 Solder Reflow Mounting Method for the MRF286 and Similar Packages Prepared by: Jeanne Pavio and Jerry Mason Motorola Semiconductor Products Sector MOUNTING METHOD DESIGN

AN1907

Abstract: MRF9045MR1 TO270
Contextual Info: MOTOROLA Order this document by AN1907/D SEMICONDUCTOR APPLICATION NOTE AN1907 Surface Mount Solder Attach Method for the MRF9045MR1 in the TO-270 Plastic RF Package Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton

TO-270

Abstract: Cu-194 AN1907 sn-pb-ag solder preform SOCKET HEAD CAP SCREWS the tom and jerry show MRF9045MR1 copper bond wire motorola MOTOROLA SEMICONDUCTOR
Contextual Info: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN1907/D AN1907 Surface Mount Solder Attach Method for the MRF9045MR1 in the TO-270 Plastic RF Package Freescale Semiconductor, Inc. Prepared by: Wendi Stemmons, Jerry Mason, Rich Wetz, Tom Woods, Mahesh Shah and David Runton

kds9

Abstract: kyocera 48 lead ceramic LCC package stk 0035 n PL0181 stk 014 IDK28F1 ntk 32 lcc package 14CA8 sk9173 JESD97
Contextual Info: Simtek Corporation Product Packaging Data This document is intended to provide Simtek customers with key information as outlined below for package types used for Simtek nvSRAM products. For additional information contact Simtek at appseng@simtek.com. For RoHS Materials

Contextual Info: High Power Resistive Products Resistors and Terminations: Mounting and Attachment Recommendations CHIP ATTACHMENT AND PC BOARD RECOMMENDATIONS For the mounting of chip or leaded devices, it is important to obtain a good solder joint between the device’s ground plane and

Contextual Info: APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has

Ablestik 84-1LMI

Abstract: mil-f-14256* rma h20E induction furnace circuit fiberglass laminate induction furnace circuit board
Contextual Info: APPLICATION NOTES APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has

h20E

Abstract: induction furnace circuit induction furnace circuit board Ablestik 84-1LMI
Contextual Info: APPLICATION NOTES APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has

SN63

Abstract: SN63 PB37 IPC-J-STD-006 sn63pb37 361F ingot
Contextual Info: Sn63/Pb37 ElectropureTM Solder Alloy Features: - High Purity - Reduces Drossing - Melting Temperature 183° C 361°F - Exceeds IPC-J-STD-006 Specifications Description: Sn63/Pb37 ElectropureTM is a high purity alloy that is composed of 63% tin and 37% lead. ElectropureTM is

TS0300

Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Contextual Info: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

ECF564A

Contextual Info: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

Ablestik 84-1LMI

Abstract: gold melting furnace 84-1LMI epoxy adhesive
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

ECF564A

Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Contextual Info: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output

Contextual Info: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

Contextual Info: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.

84-1LMI epoxy adhesive

Abstract: TS0300W3 TS0500W3
Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

ODS-30

Abstract: ODS-134 MA4L031-134 MA4L401-132
Contextual Info: Silicon PIN Limiter Diodes Features • • • • • • Lower Insertion Loss and N.F. Higher Peak and Average Operating Power Various P1dB Input Compression Powers Lower Flat Leakage Power Reliable Silicon Nitride Passivation RoHs Compliant Description and Applications

95Sn5Sb

Abstract: HP 3478A Copper Alloy C151 bts 2140 AN1907 C101 C102 C151 SAC305 ausi die attach
Contextual Info: Freescale Semiconductor Application Note AN1907 Rev. 3, 5/2009 Solder Reflow Attach Method for High Power RF Devices in Over - Molded Plastic Packages By: Keith Nelson, Quan Li, Lu Li, and Mahesh Shah INTRODUCTION TERMINOLOGY DEFINITIONS The purpose of this application note is to provide

5082 schottky

Abstract: 5082-0087 HP 5082-0024 5082-2713 HP 2835 5082-0097 node B 3206 5082-0024
Contextual Info: DE § 4 4 4 7 5 0 4 QDQSñlS S | ~ 4447584 H E WL E T T - P A C K A R D » 58G CMPNTS 02815 D - T - Ö HEW LETT PACKARD SCHOTTKY BARRIER CHIPS FOR HYBRID INTEGRATED CIRCUITS 5082-0009 5082-0013 5082-0023 5082-0024 5082-0029 5082-0031 5082-0041 7 - 0 7 5082-0057