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SMOD01 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: SIEMENS BSM 25 GD 100 D IGBT Module Preliminary Data VCE= 1000 V / c = 6 x 3 5 A at r c = 2 5 C / c = 6 x 25 A at Tc = 80 C • Power module • 3-phase full bridge • Including fast free-wheel diodes • Package with insulated metal base plate • Package outlines/Circuit diagram: 31	OCR Scan	C67076-A2501-A2 SMOD015	PDF
GSM11-11 Abstract: ISO7816 LQFP64 TDA8007B TDA8008 TDA8008HL TDA8028AHL TDA8028HL Contextual Info: INTEGRATED CIRCUITS TDA8028, TDA8008 Dual multiprotocol smart card coupler Objective specification v4.0 February 2000 Philips Semiconductors Objective specification v4.0 Dual multiprotocol smart card coupler TDA8028, TDA8008 FEATURES • 8xC51 core with 16kBytes ROM TDA8028 or EPROM (TDA8008), 256Bytes RAM, 512Bytes AUXRAM, Timer 0, 1,	Original	TDA8028, TDA8008 8xC51 16kBytes TDA8028) TDA8008) 256Bytes 512Bytes GSM11-11 ISO7816 LQFP64 TDA8007B TDA8008 TDA8008HL TDA8028AHL TDA8028HL	PDF

Catalog Datasheet

Type

Document Tags

PDF

Contextual Info: SIEMENS BSM 25 GD 100 D IGBT Module Preliminary Data VCE= 1000 V / c = 6 x 3 5 A at r c = 2 5 C / c = 6 x 25 A at Tc = 80 C • Power module • 3-phase full bridge • Including fast free-wheel diodes • Package with insulated metal base plate • Package outlines/Circuit diagram: 31

OCR Scan

C67076-A2501-A2 SMOD015

PDF

GSM11-11

Abstract: ISO7816 LQFP64 TDA8007B TDA8008 TDA8008HL TDA8028AHL TDA8028HL
Contextual Info: INTEGRATED CIRCUITS TDA8028, TDA8008 Dual multiprotocol smart card coupler Objective specification v4.0 February 2000 Philips Semiconductors Objective specification v4.0 Dual multiprotocol smart card coupler TDA8028, TDA8008 FEATURES • 8xC51 core with 16kBytes ROM TDA8028 or EPROM (TDA8008), 256Bytes RAM, 512Bytes AUXRAM, Timer 0, 1,

Original

TDA8028, TDA8008 8xC51 16kBytes TDA8028) TDA8008) 256Bytes 512Bytes GSM11-11 ISO7816 LQFP64 TDA8007B TDA8008 TDA8008HL TDA8028AHL TDA8028HL

PDF