SMD QF Search Results

D164K

Abstract: L69 MARKING CODE 5962-9206203MYX CY7C245-35DMB smd CY 203 CY7C424-40DMB 14LX smd cross reference SMD MARKING CODE UV 5962-85525
Contextual Info: SMD Cross Reference Listed below are the SMDs for which Cypress is an approved source of supply. Please contact your local Cypress representative for the latest SMD update. DESC SMD Standardized Military Drawing Approvals[1] Package[3] SMD Number 84036 84036

Contextual Info: SMD MOLDED WIRE WOUND FERRITE CHIP INDUCTORS SMD MOLDED WIRE WOUND FERRITE CHIP INDUCTORS CF252018 SERIES SMD MOLDED WIRE WOUND FERRITE CHIP INDUCTORS CF252018 SERIES CF252018 SERIES Mechanical Dimensions: Unit:mm Electrical Specification Recommended Patterns

STK and STR integrated circuits

Abstract: transistor smd zG 1e STR-Z4579 Turuta 6 pin TRANSISTOR SMD CODE PA transistor 5d smd ELM85361A STK and STR integrated circuits, 2011 edition 5g smd transistor 15D diode smd code
Contextual Info: SMD-codes DATABOOK Active SMD semiconductor components marking codes • 235.000 SMD-codes for active semiconductor components: • Diodes, Transistors, Thyristors, Integrated Circuits • Case pin assignment • Pinout • Marking style • Schematic diagram

SMD CODE 9Z

Abstract: 80C251 PLCC44 J-STD-20 SMD CODE 9T Smd parts identification 14x14x1.4mm PLCC18 Temic PART DATE CODE moisture sensitive handling and packaging temic ulc products
Contextual Info: Information about SMD Plastic Packages Prepared by: Elisabeth Lamarti Pierre Houzé Quality Department SMD Packaging Contents 1. INTRODUCTION -2 2. GENERALITIES -2

QFP 208

Abstract: QFP-208 RE714001-LF QFP208
Contextual Info: Lötübungsplatine für SMD fine pitch QFP 208 RE714001-LF - Epoxyd FR4 1,50 mm, einseitig 35 µm CU - heißverzinnt HAL-leadfree , Lötstoppmaske und Bestückungsdruck - Lötübungsplatine für SMD fine pitch QFP 208 - die neue Standardtechnologie 0,50 mm

crystal tuning fork quartz 12 MHz

Abstract: 32,768 SMD crystal Component SMD CRYSTALS tc 4069p 4069P Quartz 32.768 Quartz Crystals 32768
Contextual Info: ECX-26X/ECX-15X 32.768 KHz SMD TUNING FORK CRYSTAL The miniature ECX-26X and the sub-miniature ECX-15X are compact, cost effective SMD tuning fork crystals. The slimline molded package requires less space than other SMD tuning fork crystals. FEATURES • Cost effective

ECS SMD 32.768

Abstract: tc 4069p 4069P
Contextual Info: ECX-26/ECX-15 32.768 KHz SMD TUNING FORK CRYSTAL The miniature ECX-26 and the sub-miniature ECX-15 are compact, cost effective SMD tuning fork crystals. The slimline molded package requires less space than other SMD tuning fork crystals. FEATURES • Cost effective

QFP-208

Abstract: MANUAL PCB RE714001-LF
Contextual Info: PCB for Soldering Practice for SMD Fine Pitch QFP 208 RE714001-LF - PCB for solder practices for SMD fine pitch QFP 208 - the new standard technology 0.50 mm - for manual soldering and pick-and-place very well suitable - EPOXY resin FR4 1.50 mm single-sided 35 µm CU

Contextual Info: SMD Nomenclature Book In Plain English Finally an easy-to-understand book on SMD nomenclature, terminology and packaging. This 40 page book starts from the basics and covers the full spectrum of SMD. Ever wonder why some capacitors come on plastic reels while resistors are normally supplied on paper

Contextual Info: SMD Nomenclature Book In Plain English Finally an easy-to-understand book on SMD nomenclature, terminology and packaging. This 40 page book starts from the basics and covers the full spectrum of SMD. Ever wonder why some capacitors come on plastic reels while resistors are normally supplied on paper

03 07 qfn 3x3

Abstract: F QFN 3X3 16 pins qfn 3x3 qfn 3x3 16L XX1000-QT-EV1 XX1000-QT XX1000-QT-0G00 XX1000-QT-0G0T
Contextual Info: 7.5-22.5/15.0-45.0 GHz Active Doubler QFN, 3x3 mm X1000-QT August 2007 - Rev 16-Aug-07 Features +17 dBm Output Power -20 dBc Fundamental Leakage SMD, 3x3 mm QFN Package RoHS Compliant 100% RF, DC and Output Power Testing General Description Mimix Broadband's 7.5-22.5/15.0-45.0 GHz SMD active

20 qfn 3x3

Contextual Info: 7.5-22.5/15.0-45.0 GHz Active Doubler QFN, 3x3 mm X1000-QT January 2008 - Rev 10-Jan-08 Features +18 dBm Output Power -20 dBc Fundamental Leakage SMD, 3x3 mm QFN Package RoHS Compliant 100% RF, DC and Output Power Testing General Description Mimix Broadband's 7.5-22.5/15.0-45.0 GHz SMD active

Frequency Doubler use diode

Abstract: F QFN 3X3 qfn 3x3 16L 28 qfn 3x3 XX1000-QT XX1000-QT-0G00 XX1000-QT-0G0T XX1000-QT-EV1
Contextual Info: 7.5-22.5/15.0-45.0 GHz Active Doubler QFN, 3x3 mm X1000-QT April 2006 - Rev 28-Apr-06 Features +17 dBm Output Power -30 dBc Fundamental Leakage SMD, 3x3 mm QFN Package RoHS Compliant 100% RF, DC and Output Power Testing General Description Mimix Broadband's 7.5-22.5/15.0-45.0 GHz SMD active

XX1000-QT

Abstract: XX1000-QT-0G00 XX1000-QT-0G0T XX1000-QT-EV1 X1000-QT
Contextual Info: 7.5-22.5/15.0-45.0 GHz Active Doubler QFN, 3x3 mm X1000-QT February 2007 - Rev 08-Feb-07 Features +17 dBm Output Power -20 dBc Fundamental Leakage SMD, 3x3 mm QFN Package RoHS Compliant 100% RF, DC and Output Power Testing General Description Mimix Broadband's 7.5-22.5/15.0-45.0 GHz SMD active

SOD80 footprint

Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD

RE714001-LF

Abstract: Re714
Contextual Info: PCBs for SMD Solder Practice RE714001-LF - PCB for solder practices for SMD fine pitch QFP 208 - the new standard technology 0.50 mm - for manual soldering and pick-and-place very well suitable - EPOXY resin FR4 1.50 mm single-sided 35 µm CU - solder side hot air leveling coated HAL-leadfree ; solder stop mask and additional print

Contextual Info: Multiadapter for QFP-SMD RE470 - Epoxy fibre-glass FR4 1.50 mm double-sided 35 µm CU pth - chem. NI/AU with solder stop mask - hole dia 1.00 mm - pad spacings 0.40mm (15,7mil) and 0.50mm (19.7 mil.) - adaption board for 23 different SMD-QFP´s - prescratched rated break point for the separation of individual modules from the

Contextual Info: 0805 2012 drahtgewickelt (AgPdPt Metallisierung) 0805 (2012) wire-wound (AgPdPt Metallisation) - 26 - Allgemeine Eigenschaften und technische Informationen zu den drahtgewickelten SMD-Spulen Bauform 0805 / Baureihe 5508 General Characterisitics and Technical Information of wirewound SMD Inductors

Contextual Info: 0603 1608 drahtgewickelt (AgPd/Ni/Sn Metallisierung) 0603 (1608) wire-wound (AgPd/Ni/Sn Metallisation) - 18 - Allgemeine Eigenschaften zu den drahtgewickelten SMD-Spulen Bauform 0603 / Baureihe 5406 General Characteristics of Wirewound SMD Inductors Size 0603 / Series 5406

Specification Quartz Crystals 1.6 Mhz

Abstract: UN-D1120
Contextual Info: Philips Components Product specification Quartz crystals - HFX ceramic SMD FEATURES • Very high frequencies in fundamental mode • Stringent process control for highly reliable operation • Photolithographic processing in automated facility • Compact SMD package, weld seal

LQW18A

Abstract: LQW18A_00
Contextual Info: Coils/Inductors/Transfomers > Coils SMD > for High Frequency Horizontal Wire Wound Data Sheet Coils(SMD) 1 for High Frequency Horizontal Wire Wound LQW18A Series (0603 Size) • Packaging 0.8±0.2 0.4max ■ Dimension 0.80±0.15 Packaging Minimum Quantity

SMD chip 03015

Contextual Info: Coils/Inductors/Transfomers > Coils SMD > for High Frequency Horizontal Wire Wound Data Sheet Coils(SMD) 1 for High Frequency Horizontal Wire Wound LQW04A Series (03015 Size) • Dimension ■ Packaging 0.4±0.05 0.06 -0.03 +0.07 0.8±0.05 Code Packaging

Contextual Info: - Thi s Documentcan notbe used wi thoutSamsung' s authori zati on - 10. PartList 1 Main Board Main Board Location SEC Code Name Specification Quantity B504 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,- 1 B510 3301-000314 BEAD-SMD 120ohm,1.6x0.8x0.8mm,-,-,-

Soldering guidelines and SMD footprint design

Abstract: SOD87 footprint SMD footprint design Soldering guidelines SOD106 land pattern sod110 land sot89 stencil SC59 SOD110 footprint "msb900"
Contextual Info: CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD footprint design