SMD MARKING A8 Search Results

Contextual Info: SRAM AS5C4008 Austin Semiconductor, Inc. 512K x 8 SRAM PIN ASSIGNMENT Top View SRAM MEMORY ARRAY AVAILABLE AS MILITARY SPECIFICATION 32-Pin DIP (CW), 32-Pin LCC (EC) 32-Pin SOJ (ECJ) • SMD 5962-95600 • MIL STD-883 A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1

AS5C4008CW

Contextual Info: SRAM AS5C4008 Austin Semiconductor, Inc. 512K x 8 SRAM PIN ASSIGNMENT Top View SRAM MEMORY ARRAY AVAILABLE AS MILITARY SPECIFICATION 32-Pin DIP (CW), 32-Pin LCC (EC) 32-Pin SOJ (ECJ) • SMD 5962-95600 • SMD 5962-95613 • MIL STD-883 A18 A16 A14 A12 A7

WS27C256L

Abstract: capacitor, 1000 microfarad and 35 volts WS27C256L-12 WS27C256L-12CMB WS27C256L-12DMB WS27C256L-12TMB WS27C256L-15 WS27C256L-15DMB WS27C256L-15TMB WS27C256L-20
Contextual Info: WS27C256L Military 32K x 8 CMOS EPROM KEY FEATURES • High Performance CMOS • Ceramic Leadless Chip Carrier CLLCC • EPI Processing — 120 ns Access Time • Fast Programming • DESC SMD No. 5962-86063 • 300 Mil DIP or Standard 600 Mil DIP — Latch-Up Immunity to 200 mA

SPT0305

Abstract: Q67100-Q1101 q67100-q1102 WCs MARKING SMD MARKING code ASC code marking rah
Contextual Info: 4M x 4-Bit Dynamic RAM 2k & 4k Refresh Hyper Page Mode - EDO HYB 5116405BJ-50/-60 HYB 5117405BJ-50/-60 HYB 3116405BJ/BT(L)-50/-60 HYB 3117405BJ/BT-50/-60 Advanced Information • 4 194 304 words by 4-bit organization • 0 to 70 °C operating temperature

Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Corrected maximum output update rate test, fDAC, in Table I from 2.4 min to 2.4 max. Added differential data interface section in Table I which includes Tsetup, Thold tests. Added delay lock loop (DLL) section in Table I which includes

Contextual Info: REVISIONS LTR DESCRIPTION A DATE YR-MO-DA Changes in accordance with NOR 5962-R142-96. - jb B Update drawing to meet current MIL-PRF-38535 requirements. glg. APPROVED 96-06-10 Michael A. Frye 13-04-12 Charles F. Saffle REV SHEET REV B B SHEET 15 16 REV STATUS

5962-XXXXXZZ

Abstract: QML-38534 qml-38535
Contextual Info: REVISIONS DESCRIPTION LTR DATE 93-04-15 Added device types 02, 03, and 04. Made changes to tables I and II._ APPROVED YR-MO-DA K. Cottongim REV SHEET REV SHEET 15 16 17 REV STATUS OF SHEETS PMIC N/A STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE

HM1E

Abstract: 5962-3829435 IDT7164L70L32B mk48h64 5962-3829407MXX 62l64-45 HC6364 5962-8552505X QML-38535 IDT7164S55DB
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED E Added changes in accordance with NOR 5962-R085-93 93-03-16 M. A. Frye F Added device types 45, 46, and 47. Removed CAGE code 34168 for case outline 8, and added cage code 34168 for case outline 9. Editorial changes throughout.

GDFP2-F28

Abstract: GDIP4-T28 MIL-STD-480 qml-38535
Contextual Info: I I REVISIONS LTR DATE DESCRIPTION APPROVED YR-MO-DA - REV SHEET REV SHEET 15 16 17 REV STATUS OF SHEETS PMIC N/A STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE 18 REV SHEET 1

EA6 SMD

Abstract: smd code EA6
Contextual Info: REVISIONS LTR DATE YR-MO-DA APPROVED A B C Added JTAG information to document. - LTG Update boilerplate to MIL-PRF-38535 requirements. – LTG Update boilerplate to current MIL-PRF-38535 requirements. – CFS DESCRIPTION 00-03-08 01-04-13 07-08-10 Monica L. Poelking

qml-38535

Abstract: GDFP2-F28 GDIP4-T28
Contextual Info: REVISIONS LTR DESCRIPTION APPROVED D A T E YR-HO-DA REV SHEET REV SHEET 15 16 17 REV STATUS OF SHEETS REV 10 SHEET PMIC N/A STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE PREPARED BY

fast page mode dram controller

Abstract: MT4C4001J
Contextual Info: MT4C4001J 883C 1 MEG x 4 DRAM AUSTIN SEMICONDUCTOR, INC. DRAM 1 MEG x 4 DRAM FAST PAGE MODE AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • SMD 5962-90847 • MIL-STD-883 FEATURES • Industry standard x4 pinout, timing, functions and packages

Contextual Info: CC256x www.ti.com SWRS121B – JULY 2012 – REVISED MAY 2013 Bluetooth and Dual Mode Controller 1 FEATURES • Single-Chip Bluetooth Smart Ready Solution Integrating Bluetooth Basic Rate BR /Enhanced Data Rate (EDR)/Low Energy (LE) Features Fully Compliant With the

FW82815EM

Abstract: FW82807A INTEL PENTIUM PROCESSOR MOBILE MODULE FW82815E gfx e4 GFX E6 pentium pro architecture FW82815EM SL4MP FW82815 360-pin BGA IBM
Contextual Info: R Intel 815EM Chipset: 82815EM Graphics and Memory Controller Hub GMCH2-M Datasheet April 2003 Document Reference Number: 290689-002 Intel® 82815EM GMCH R Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

micron ddr3

Contextual Info: 2Gb: x4, x8, x16 DDR3 SDRAM Features DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 Banks MT41J256M8 – 32 Meg x 8 x 8 Banks MT41J128M16 – 16 Meg x 16 x 8 Banks Options1 Features • • • • • • • • • • • • • • • • • • Marking

DATA SHEET M 58655 P

Abstract: PM8354A-NI INDUCTIVE COMPONENTS k5 smd PM8354-NI smd 1Gs PM8354 PM8354A
Contextual Info: QuadPHY 1G ASSP Telecom Standard Product Data Sheet Released PM8354 & PM8354A QuadPHY 1G 4 CHANNEL PHYSICAL LAYER TRANSCEIVER WITH GIGABIT ETHERNET PCS AND TRUNKING FOR 933 Mbit/s TO 1.25 Gbit/s INTERFACES Data Sheet Released Issue No. 5: May 2004 Proprietary and Confidential to PMC-Sierra, Inc., and for its customers’ internal use.