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    SIM BLOCK AMPHENOL Search Results

    SIM BLOCK AMPHENOL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SF-SFPP2EPASS-000.5
    		Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-000.5 0.5m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (1.6 ft) PDF
    AV-DPMDPM0000-001
    		Amphenol Cables on Demand Amphenol AV-DPMDPM0000-001 1m DisplayPort Cable - Amphenol DisplayPort 1.1 Certified Cable (3.3ft) 1m (3.3') PDF
    SF-SFPP2EPASS-001
    		Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-001 1m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (3.3 ft) PDF
    SF-SFPP2EPASS-003
    		Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-003 3m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (9.8 ft) PDF
    SF-SFPP2EPASS-005
    		Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-005 5m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (16.4 ft) PDF

    SIM BLOCK AMPHENOL Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    sim card 6PIN

    Contextual Info: Amphenol SIM Card Connector 1. Material: Contacts: Copper Alloy, Switch: Copper Alloy Insulator: High temperature. Thermoplastic, UL94V-0, Black. 2. Finish: Contacts: 30u” Gold plated on contact area,100u” min Matte-Tin on solder tail, Nickel underplated over all.


    Original     		ul94v-05000cyclescad-06-s1-20-1sim card 6pin PDF

    sim card 6PIN

    Abstract: 06S1 sim card
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contacts: Copper Alloy, Switch: Copper Alloy Insulator: High temperature. Thermoplastic, UL94V-0, Black. 2. Finish: Contacts: 30u” Gold plated on contact area,100u” min Matte-Tin on solder tail, Nickel underplated over all.


    Original     		ul94v-05000cyclescad-06-s1-20-1sim card 6pin+206s1sim card PDF

    CAD-0601-262

    Abstract: amphenol sim block
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		ul94v0cad0601262cad-0601-262amphenol sim block PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-182 PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-222 PDF

    amphenol sim block

    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		ul94v0cad0601242amphenol sim block PDF

    CAD-0605-202

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-202 PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-112 PDF

    CAD-0601-302

    Abstract: CAD0601302 amphenol sim block
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		ul94v0cad0601302cad-0601-302amphenol sim block PDF

    amphenol sim block

    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		ul94v0cad0601402amphenol sim block PDF

    SIM READER amphenol

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-162sim reader amphenol PDF

    amphenol sim block

    Abstract: SIM BLOCK
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		ul94v0cad0601382amphenol sim blocksim block PDF

    amphenol sim block

    Abstract: SIM BLOCK
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		ul94v0cad0601342amphenol sim blocksim block PDF

    amphenol sim block

    Abstract: sim block
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		ul94v0cad0601322amphenol sim blocksim block PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-192 PDF

    CAD-0605-122

    Abstract: CAD0605122
    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-122cad0605122 PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-132 PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-172 PDF

    CAD-0605-212

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-212 PDF

    SIM READER amphenol

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-152sim reader amphenol PDF

    amphenol sim block

    Abstract: SIM BLOCK
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		ul94v0cad0601282amphenol sim blocksim block PDF

    sim block

    Abstract: amphenol sim block
    Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		ul94v0cad0601222sim blockamphenol sim block PDF

    Contextual Info: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		ul94v-030vaccad-0605-142 PDF

    sim 300 processor datasheet for gsm modem

    Abstract: free circuit diagram of USB modem using gsm sim motorola G20 sim 300 processor gsm modem datasheet CIRCUIT DIAGRAM FOR gsm modem with sim 300 module sim 300 gsm modem block diagram sim 300 processor gsm modem stk audio power amplifiers stk power audio ics STK power amplifier module overview
    Contextual Info: Developer's Guide Motorola g20 Cellular Engine Module Description 98-08901C66-B REVISION HISTORY Revision Date Purpose O 30 June 2003 Initial release A 05 November 2003 Minor corrections to the manual B 15 February 2004 Updated book version Updated section 2.3, Product Specifications


    Original     		98-08901c66-brs232sim 300 processor datasheet for gsm modemfree circuit diagram of usb modem using gsm sim+8motorola g20sim 300 processor gsm modem datasheetcircuit diagram for gsm modem with sim 300module sim 300 gsm modem block diagramsim 300 processor gsm modemstk audio power amplifiersstk power audio icsstk power amplifier module overview PDF