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Catalog Datasheet	Type	Document Tags	PDF
sim block Abstract: amphenol sim block Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under	Original	UL94V0, CAD0601222 sim block amphenol sim block	PDF

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sim block

Abstract: amphenol sim block
Contextual Info: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under

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UL94V0, CAD0601222 sim block amphenol sim block

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