SIII51 Search Results

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Abstract: EPC16 EPCS128 EPCS16 EPCS64 TMs 1122
Contextual Info: 11. Configuring Stratix III Devices SIII51011-1.1 Introduction This chapter contains complete information on the Stratix III supported configuration schemes, how to execute the required configuration schemes, and all the necessary option pin settings. Stratix III devices use SRAM cells to store configuration data. As SRAM

EP3SE50

Abstract: implement 16-bit CRC in transmitter and receiver 2N50
Contextual Info: 15. SEU Mitigation in Stratix III Devices SIII51015-1.1 Introduction In critical applications such as avionics, telecommunications, system control, and military applications, it is important to be able to do the following: • ■ Confirm that the configuration data stored in an Stratix III device is

SECDED

Abstract: EP3SE50
Contextual Info: 4. TriMatrix Embedded Memory Blocks in Stratix III Devices SIII51004-1.8 Introduction TriMatrix embedded memory blocks provide three different sizes of embedded SRAM to efficiently address the needs of Stratix III FPGA designs. TriMatrix memory includes 640- in ROM mode only or 320-bit memory logic array blocks (MLABs),

EP3SE50

Abstract: glitch removing ICs for counter signals
Contextual Info: 6. Clock Networks and PLLs in Stratix III Devices SIII51006-1.1 Introduction Stratix III devices provide a hierarchical clock structure and multiple PLLs with advanced features. The large number of clocking resources, in combination with the clock synthesis precision provided by the PLLs,

diagram remote control receiver and transmitter

Abstract: remote protocol remote system upgrades EPCS64 remote control transmitter and receiver circuit EPCS128 EPCS16
Contextual Info: 12. Remote System Upgrades with Stratix III Devices SIII51012-1.5 This chapter describes the functionality and implementation of the dedicated remote system upgrade circuitry. It also defines several concepts related to remote system upgrade, including factory configuration, application configuration, remote update

verilog code of carry save adder

Abstract: vhdl code of carry save adder 16 bit carry select adder verilog code 3-bit binary multiplier using adder VERILOG verilog code for 16 bit carry select adder 8 bit carry select adder verilog code vhdl code for crossbar switch vhdl for carry save adder vhdl code for carry select adder 8 bit carry select adder verilog code with
Contextual Info: 2. Logic Array Blocks and Adaptive Logic Modules in Stratix III Devices SIII51002-1.5 Introduction This chapter describes the features of the logic array block LAB in the Stratix III core fabric. The logic array block is composed of basic building blocks known as

circuit diagram of half adder

Abstract: datasheet for full adder and half adder half adder 32-bit adder multiplier bit 16 bit full adder 4 bit multiplier barrel shifter block diagram half adder datasheet EP3SE50
Contextual Info: 5. DSP Blocks in Stratix III Devices SIII51005-1.7 Introduction The Stratix III family of devices have dedicated high-performance digital signal processing DSP blocks optimized for DSP applications. These DSP blocks of the Altera® Stratix device family are the third generation of hardwired, fixed function

ic tms 1000

Abstract: ieee 1149 TMS 1100 EP3SE50
Contextual Info: 13. IEEE 1149.1 JTAG Boundary-Scan Testing in Stratix III Devices SIII51013-1.1 Introduction As printed circuit boards (PCBs) become more complex, the need for thorough testing becomes increasingly important. Advances in surface-mount packaging and PCB manufacturing have resulted in

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Abstract: sram 16k8 EP3SE50
Contextual Info: 4. TriMatrix Embedded Memory Blocks in Stratix III Devices SIII51004-1.1 Introduction TriMatrix embedded memory blocks provide three different sizes of embedded SRAM to efficiently address the needs of Stratix III FPGA designs. TriMatrix memory includes 640-bit memory logic array blocks

diagram remote control receiver and transmitter

Abstract: universal remote EPCS128 EPCS16 EPCS64
Contextual Info: 12. Remote System Upgrades With Stratix III Devices SIII51012-1.1 Introduction This chapter describes the functionality and implementation of the dedicated remote system upgrade circuitry. It also defines several concepts related to remote system upgrade, including factory

Contextual Info: 10. Hot Socketing and Power-On Reset in Stratix III Devices SIII51010-1.1 Introduction This document contains information on hot socketing specifications, power-on reset requirements, and their implementation in Stratix III devices. Stratix III devices offer hot socketing, which is also known as hot plug-in

circuit diagram of half adder

Abstract: datasheet for full adder and half adder 32-bit adder BUTTERFLY DSP half adder datasheet EP3SE50 0x0000100
Contextual Info: 5. DSP Blocks in Stratix III Devices SIII51005-1.1 Introduction The Stratix III family of devices have dedicated high-performance digital signal processing DSP blocks optimized for DSP applications. These DSP blocks of the Altera® Stratix device family are the third

SSTL-15

Abstract: SSTL-18 112Rx BGA1152 mini-lvds connector
Contextual Info: 9. High-Speed Differential I/O Interfaces and DPA in Stratix III Devices SIII51009-1.1 Introduction The Stratix III device family offers up to 1.25-Gbps differential I/O capabilities to support source-synchronous communication protocols such as Utopia, Rapid I/O , XSBI, SGMII, SFI, and SPI.

SSTL-15

Abstract: SSTL15 DDR3 SSTL class resistor bank EIA-644 SSTL-18 EP3SE50 SSTL-15 class I
Contextual Info: 7. Stratix III Device I/O Features SIII51007-1.1 Introduction Stratix III I/Os are specifically designed for ease of use and rapid system integration while simultaneously providing the high bandwidth required to maximize internal logic capabilities and produce system-level

Contextual Info: 3. MultiTrack Interconnect in Stratix III Devices SIII51003-1.0 Introduction Stratix III devices contain a two-dimensional row- and column-based architecture to implement custom logic. A series of column and row interconnects of varying length and speed provides signal interconnects

SSTL-15

Abstract: mini-lvds EIA-644 SSTL-18 EP3SL70
Contextual Info: 7. Stratix III Device I/O Features SIII51007-1.9 Stratix III I/Os are specifically designed for ease of use and rapid system integration while simultaneously providing the high bandwidth required to maximize internal logic capabilities and produce system-level performance. Independent modular I/O

ic tms 1000

Abstract: 1.9 TDI TMS 1100 EP3SE50
Contextual Info: 13. IEEE 1149.1 JTAG Boundary-Scan Testing in Stratix III Devices SIII51013-1.9 This chapter discusses how to use the IEEE Std. 1149.1 boundary-scan test (BST) circuitry in Stratix III devices. The BST architecture offers the capability to test efficiently components on PCBs with tight lead spacing. BST architecture tests pin

EP3SGX

Abstract: DDR3 "application note" EP3SE50
Contextual Info: 1. Stratix III Device Family Overview SIII51001-1.1 Introduction The Stratix III family provides the most architecturally advanced, high performance, low power FPGAs in the market place. Stratix III FPGAs lower power consumption through Altera’s innovative

FBGA 1760

Abstract: EP3SE50 1760-Pin Quartus II Handbook version 9.1 image processing
Contextual Info: 1. Stratix III Device Family Overview SIII51001-1.8 The Stratix III family provides one of the most architecturally advanced, high-performance, low-power FPGAs in the marketplace. Stratix III FPGAs lower power consumption through Altera’s innovative Programmable Power Technology, which provides the ability to turn on the

EP3SE50

Abstract: 99115
Contextual Info: 6. Clock Networks and PLLs in Stratix III Devices SIII51006-2.0 This chapter describes the hierarchical clock networks and multiple phase-locked loops PLLs with advanced features in Stratix III devices. The large number of clocking resources, in combination with the clock synthesis precision provided by the

EP3SE50

Contextual Info: 8. External Memory Interfaces in Stratix III Devices SIII51008-1.9 The Stratix III I/O structure has been completely redesigned to provide flexible, high-performance support for existing and emerging external memory standards. These include high-performance double data rate DDR memory standards such as

BGA PACKAGE thermal resistance

Abstract: EP3SE50 EP3SE110
Contextual Info: 17. Stratix III Device Packaging Information SIII51017-1.7 This chapter provides thermal resistance values and package information for Altera Stratix® III devices, including: • “Thermal Resistance” on page 17–2 ■ “Package Outlines” on page 17–2

102 TRANSISTOR

Contextual Info: 10. Hot Socketing and Power-On Reset in Stratix III Devices SIII51010-1.7 This chapter describes information about hot-socketing specifications, power-on reset POR requirements, and their implementation in Stratix III devices. Stratix III devices offer hot socketing, also known as hot plug-in or hot swap, and

EP3SE50

Abstract: implement 16-bit CRC in transmitter and receiver "Error Detection" error detection codes EP3SL260
Contextual Info: 15. SEU Mitigation in Stratix III Devices SIII51015-1.7 This chapter describes how to use the error detection cyclical redundancy check CRC feature when a Stratix III device is in user mode and recovers from CRC errors. The purpose of the error detection CRC feature is to detect a flip in any of the