SIGC08T60 Search Results
SIGC08T60 Datasheets (4)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| SIGC08T60 |
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For drives-, white goods and resonant applications, Trench- and Fieldstop technology | Original | 73.94KB | 4 | ||
| SIGC08T60EX1SA1 |
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IGBT CHIP | Original | 286.68KB | 9 | ||
| SIGC08T60EX1SA2 |
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IGBT 3 CHIP 600V 15A WAFER | Original | 286.68KB | 9 | ||
| SIGC08T60S |
|
IGBT Chips; Package: --; Technology: Fast IGBT 3; VDS (max): 600.0 V; IC (max): 15.0 A; VCE(sat) (max): 2.05 V; VGE(th) (min): 4.1 V; | Original | 73.95KB | 4 |
SIGC08T60 Price and Stock
Infineon Technologies AG SIGC08T60SEX1SA1IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC08T60SEX1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC08T60SEX1SA1 | Waffle Pack | 31,041 |
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Get Quote | ||||||
Infineon Technologies AG SIGC08T60X1SA2- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC08T60X1SA2) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC08T60X1SA2 | Waffle Pack | 453 |
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Get Quote | ||||||
Infineon Technologies AG SIGC08T60SX1SA2- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC08T60SX1SA2) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC08T60SX1SA2 | Waffle Pack | 453 |
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Get Quote | ||||||
Infineon Technologies AG SIGC08T60EX1SA1IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC08T60EX1SA1) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC08T60EX1SA1 | Waffle Pack | 20 Weeks | 31,041 |
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Buy Now | |||||
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SIGC08T60EX1SA1 | 9,866 |
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Get Quote | |||||||
Infineon Technologies AG SIGC08T60SYX1SA2- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC08T60SYX1SA2) |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIGC08T60SYX1SA2 | Waffle Pack | 453 |
|
Get Quote | ||||||
SIGC08T60 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
SIGC08T60Contextual Info: SIGC08T60 3 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE sat • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC08T60 VCE ICn 600V 15A This chip is used for: • power module |
Original |
SIGC08T60 Q67050A4282-A101 L7531A, SIGC08T60 | |
|
Contextual Info: SIGC08T60S 3 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE sat • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC08T60S VCE ICn 600V 15A This chip is used for: |
Original |
SIGC08T60S Q67050A4395-A101 L7531D, | |
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Contextual Info: SIGC08T60 3 IGBT Chip FEATURES: • 600V Trench & Field Stop technology • low VCE sat • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC08T60 VCE ICn 600V 15A This chip is used for: • power module |
Original |
SIGC08T60 Q67050A4282-A101 L7531A, |