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chip diode "sawn on foil" Abstract: soft solder die bonding infineon 205a Contextual Info: SIDC112D170H Fast switching diode Features: • 1700V technology, Emitter Controlled Diode 3th generation, 200 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type SIDC112D170H VR IF 1700V 205A A This chip is used for:	Original	SIDC112D170H L4502A, chip diode "sawn on foil" soft solder die bonding infineon 205a	PDF

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chip diode "sawn on foil"

Abstract: soft solder die bonding infineon 205a
Contextual Info: SIDC112D170H Fast switching diode Features: • 1700V technology, Emitter Controlled Diode 3th generation, 200 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type SIDC112D170H VR IF 1700V 205A A This chip is used for:

Original

SIDC112D170H L4502A, chip diode "sawn on foil" soft solder die bonding infineon 205a

PDF