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    SIDC112D170H Price and Stock

    Infineon Technologies AG

    Infineon Technologies AG SIDC112D170HX1SA2

    - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC112D170HX1SA2)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIDC112D170HX1SA2 Waffle Pack 1,026
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    SIDC112D170H Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    chip diode "sawn on foil"

    Abstract: soft solder die bonding infineon 205a
    Contextual Info: SIDC112D170H Fast switching diode Features: • 1700V technology, Emitter Controlled Diode 3th generation, 200 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type SIDC112D170H VR IF 1700V 205A A This chip is used for:


    Original     		sidc112d170hl4502achip diode "sawn on foilsoft solder die bonding+1infineon 205a PDF