SIDC02D60C8 Search Results
SIDC02D60C8 Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
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SIDC02D60C8X7SA2 |
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DIODE GEN PURP 600V 6A DIE | Original | 52KB | 4 |
SIDC02D60C8 Price and Stock
Infineon Technologies AG
Infineon Technologies AG SIDC02D60C8X7SA2DIODE STANDARD 600V 6A DIE |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIDC02D60C8X7SA2 | Bulk |
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Infineon Technologies AG SIDC02D60C8F1SA1Fast switching diode chip in Emitter Controlled 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC02D60C8F1SA1) |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SIDC02D60C8F1SA1 | Waffle Pack | 20 Weeks | 110,052 |
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SIDC02D60C8F1SA1 | 1,124 |
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SIDC02D60C8 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: SIDC02D60C8 Fast switching diode chip in Emitter Controlled 3 -Technology Features: • 600V Emitter Controlled 3 technology 70 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient A This chip is used for: • Power module |
Original |
SIDC02D60C8 L4012M, |