SGCT Search Results

SGCTJ-08-2-731-8-BK-PX-S-X

Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Housing: Contacts: A 8 9 PBT Polyester UL94V-0, Black 0.35mm Thick Phos-Bronze plated w/ Hard Gold and Gold Flash in Solder Area 0.25mm Thick Copper Alloy, Nickel Plating Shield: A B B C C D D E E F Series SGCTJ Stacked Ganged

Contextual Info: Philips Semiconductors SGCtlOM 3 Package Information Advanced Low-power Schottky Devices ALS CONTENTS S old erin g .

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Contact Material: Contact Plating: Housing: Shield Material: D 0.35mm Thick Phosphor bronze Gold, Tin in solder area PBT Polyester UL94V-0, Black 0.25mm Thick Copper Alloy, Nickel Plating D E F E Series SGCTJ 4 Port

SGCTJ-08-4-733-8-BK-PX

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Housing material: Contact material: Contact plating: PBT, glass filled, UL94V-0 Phosphor bronze 0.35 mm Gold 25µ”, 30µ” or 50µ” D D E E F Series Positions Ports Style Contacts Color Plating SGCTJ 08 XX

Contextual Info: 1 2 Series 3 Positions Contacts X XX Body Style A CTJ Modular jack, single position 4-10 4 XX From catalog Examples: C3 D H HP=Half peg SP=Split peg 2-10 B C Series D Positions GCTJ/SGCTJ 0X Ganged modular jack; 6, 8 Stacked ganged modular jack Ports X 2-10

SGCTJ-08-2-733-8-BK-PX

Abstract: jack p2 3.5mm
Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Contact material: Phosphor bronze .35mm Contact plating: Gold Housing material: PBT glass filled, UL94V-0 D D E F E Series SGCTJ Stacked ganged mod jack RoHS compliant Rev. Description Date Approved G Drawing Name

SGCTJ-08-16-733-8-BK-PX

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C D D PC Board Layout E SPECIFICATIONS Housing material: Contact material: Contact plating: F RoHS compliant Rev. Description Date Approved G Drawing Name Approved Howard Checked Lizzy Drawn Tina 0.0 ± 0.35 1 2 3 Series SGCTJ Stacked

SGCTJ-08-16-733-X-BK-PX

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C D D PC Board Layout E SPECIFICATIONS Housing material: Contact material: Contact plating: F PBT glass filled, UL94V-0 Phosphor bronze 0.35mm Gold 25µ”, 30µ” or 50µ” contacts Tin on solder tails Series SGCTJ Stacked ganged

SGCT

Abstract: mitsubishi SGCT sGCT function WESTINGHOUSE ELECTRIC scr topologies pulse transformer driver IGBT APPLICATION westinghouse power rectifiers international rectifier GTO WESTINGHOUSE RECTIFIERS GTO thyristor 3000V 800A GTO thyristor driver
Contextual Info: 896 IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, VOL. 37, NO. 3, MAY/JUNE 2001 A New Current-Source Converter Using a Symmetric Gate-Commutated Thyristor SGCT Navid R. Zargari, Member, IEEE, Steven C. Rizzo, Member, IEEE, Yuan Xiao, Associate Member, IEEE,

SGCTJ-08-2-733-8-BK-PX-IS

Abstract: jack p2 3.5mm
Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C D D SPECIFICATIONS Contact material: Phosphor bronze .35mm Contact plating: Gold on contact area Tin on solder tails Housing material: PBT glass filled, UL94V-0 E F Series SGCTJ Stacked ganged mod jack RoHS compliant Rev. Description

Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Housing Material: Contact: A Shield: 8 9 PBT Polyester UL94V-0, Black 0.35mm Thick Phos-Bronze Gold Plating, Gold Flash in Solder Area 0.25mm Thick Copper Alloy, Nickel Plating A B B C C D D E E F Series SGCTJ Stacked Ganged Modular Jack

SGCTJ-08-8-731-8-BK-PX-S-PG4

Contextual Info: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Contact Material: Contact Plating: Housing: Shield Material: D 0.35mm Thick Phosphor bronze Gold, Tin in solder area PBT Polyester UL94V-0, Black 0.25mm Thick Copper Alloy, Nickel Plating D E F E Series SGCTJ Stacked

AN1950

Contextual Info: Philips Semiconductors SGCtiOH 7 Line Drivers/Receivers, Modems General Purpose/Linear ICs INDEX MC145406 EIA-232-D/V.28 driver/receiver. 467 NE5170 Octal line d riv e r. 472

SCN2681

Abstract: SCC2691 AN421 TRANSMITTER Philips scc2691
Contextual Info: SGCtiOfl 2 Philips Semiconductors Universal Asynchronous Receiver/Transmitters ICs for Data Communications CONTENTS Asynchronous Communication Product Line U A R T s . 60 SCN2681

M7707

Abstract: rd201 PLD-10 imv D6-11 BV 726 C 1 Converter w5753 fd187 sGCT function PR 161A RD202
Contextual Info: O K I Semiconductor MSM7707 Baseband integration LSI device for PHS GENERAL DESCRIPTION The MSM7707 is an LSI device with an ADPCM CODEC function, jt/4 shift QPSK modulation/ demodulation function and a TDMA-TDD function required for PHS Personal Handy phone

solar inverters circuit diagram

Abstract: solar inverters block diagram Block Diagram sun solar system solar power circuit diagram solar power inverter Circuit diagram "symmetrical gate commutated thyristor" solar inverter circuit OFF GRID SOLAR INVERTER IC solar bipolar circuit diagram ETO thyristor ABB
Contextual Info: Fiber Optics in Solar Energy Applications White Paper By Alek Indra Introduction Solar energy has recently become a popular alternative energy source to meet demands around the world due to the fluctuation of oil/coal prices and global warming issues. Oil is a limited and diminishing resource, and

Contextual Info: Datasheet R2A20057BM Lithium-Ion Battery Switching Charger IC with Auto Load Current Distribution R03DS0069EJ0100 Rev.1.00 Mar 1, 2013 This is a target specification. Some specs are subject to change. Description R2A20057BM is a semiconductor integrated circuit designed for Lithium-ion battery charger control IC.

SGCT

Abstract: sgm switch MSM7586-01TS-K MSM7586-03TS-K P600 P900 TQFP100-P-1414-0 mcu dtmf generator
Contextual Info: E2U0034-28-82 ¡ Semiconductor MSM7586-01/03 ¡ Semiconductor This version: Aug. 1998 MSM7586-01/03 Previous version: Nov. 1996 p/4 Shift QPSK MODEM/ADPCM CODEC GENERAL DESCRIPTION The MSM7586 is a CMOS IC developed for use with digital cordless telephones. The device

MFPC

Abstract: LGCI
Contextual Info: @:2C MS^WS_ ?WOZS`S^ h:2ZZ C\YY\c _VOT` `e]S [Q^SZS[`OY L\`O^e S[Q\RS^ gASO`a^S_ l0VRDPL@J CH@KDRDP a}uKKq 3LLDP CH@KDRDP ME QG@ER axuKKq axwKKo.SQRMKHX@AJDp l,AJD RM HLQR@JJ CHPDBRJW @R KMRMP MP K@BGHLDPW UHRGMSR BMSNJHLF l8MUDP QSNNJW * z</.q vwrwy</. Zzn

sGCT

Abstract: "symmetrical gate commutated thyristor" Allen-Bradley VFD Powerflex 700 thyristor 6-pulse full wave firing circuit siemens VFD availability SGCTs symmetrical gate commutated thyristor sGCT function how a three phase vfd works EN61000-2-4
Contextual Info: Medium Voltage AC Drives Selection Guide PowerFlex 7000 • Direct-to-Drive Technology • Air-Cooled • Liquid-Cooled POWERFLEX 7000 MEDIUM VOLTAGE AC DRIVES Improve efficiency and maximize profitability with a single solution for all your motor control applications from 200 hp to 34,000 hp

LG 1311

Abstract: i1652
Contextual Info: TMS320F243, TMS320F241 DSP CONTROLLERS SPRS064B-D EC EM BER 1997-R E V IS E D FEBRUARY 1999 * • High-Performance Static CMOS Technology Includes the T320C2xx Core CPU I • • • • - Object-Compatible With the TMS320C2xx - Source-Code-Compatible With

TMS320C241

Abstract: 1act0 C241
Contextual Info: TMS320F241, TMS320C241, TMS320C242 DSP CONTROLLERS I • High-Performance Static CMOS Technology • I I I 1 • Includes the T320C2xx Core CPU - Object Compatible With the TMS320C2xx - Source Code Compatible With TMS320C25 - Upwardly Compatible With TMS320C5X

SGCTJ-08-XX-HLX-8-BK-PX-MS-PG

Abstract: Stanyl Stanyl TE250F6
Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Voltage rating: Current rating: Contact material: Contact plating: Housing material: A B Shield material: Shield plating: Insulation resistance: 8 9 150VAC 1.5 amps Phosphor bronze, 0.35mm Gold in contact area, tin in solder area

SGCTJ-08-2-731-8-BK-XX-S

Abstract: 0.35mm right angle modular jack
Contextual Info: 1 2 3 4 5 6 7 SPECIFICATIONS Contact material: Contact plating: A 9 Phosphor bronze 0.35mm Gold in contact area Gold flash on solder tails PBT glass filled, UL94V-0 Copper alloy 0.25mm Nickel Housing material: Shield material: Shield plating B 8 A Cavity conforms to FCC rules and regulations Part 68, Subpart F