SENJU TYPE 5 Search Results

senju solder paste

Abstract: Senju
Contextual Info: !Solder and Flux 1 Solder Paste Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%) For your reference, we are using 'SPT-70-0F-2063', manufactured by SENJU METAL INDUSTRY CO.,

Senju

Abstract: H60A senju h63a Senju Sn Pb 60 40 solder senju solder paste H63A Senju metal solder paste SPT-70-OF-2063 Ultrasonic flow
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

Senju

Abstract: SPT-70-OF-2063 senju h63a senju solder paste Senju flux solder paste H63A Senju metal solder paste H60A
Contextual Info: !Solder and Flux 1 Solder Paste Flow Soldering : Use H60A or H63A. Reflow Soldering : Use RA type cream solder (Sn 60%/Pb 40%) (Type No. of cream solder : SPT-70-OF-2063 by Senju Metal Industrial) (2) Flux : Use Rosin type flux. Do not use acidic flux (with chlorine content exceeding 0.2wt%).

Senju M705-GRN360-K2-V

Abstract: Senju M705-GRN360-K2-V solder paste Senju eco solder paste Senju M705-GRN360-K2-V TYPE 4 OZ63-221CM5-42-10 senju type 5
Contextual Info: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series back-lock LIF connector allows for design flexibility by incorporating both an upper contact and a lower contact to interface with a 0.15mm thick FPC at a 0.3mm pitch. The low profile

Senju

Abstract: OX63-101F senju L1 flux
Contextual Info: LOW Ohm METAL PLATE Current sensing CERAMIC CASE BLR W NE STRUCTURE Ceramic case Termination electrode Resistive element metal plate Cement Heat sink LOW OHM 1 2 3 4 5 Identification produCt code coating color BLR marking None (White Ceramic) Alpha Numeric

Senju M705

Abstract: M705 solder paste senju m705 solder paste
Contextual Info: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices

Senju M705

Abstract: Senju Sn Pb 60 40 solder Senju PASTE Senju
Contextual Info: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices

senju M705 solder paste

Abstract: Senju M705 senju solder paste M705 senju solder paste M705 solder paste Senju metal solder paste senju solder specification
Contextual Info: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.

Contextual Info: 0.5mm Pitch FPC/FFC/Membrane FF14A Series 【Cable Lock Type】 OUTLINE FF14A series is a 0.9mm height connector with a cable lock mechanism, in conformity to FPC of 0.5mm pitch and 0.2mm thick. Applicable cable is 0.2mm thick FPC, FFC and membrane. APPLICATIONS

OZM10-729C-32-11

Abstract: senju type 5
Contextual Info: BILL OF MATERIALS Subject: STEVAL-SPBT3ATV3 Q.TY 1 6 2 CODE REFERENCE 0ADL500D -C40ADL572D -C1-C3-C7-C8-C10-C110ADL306E -C6-C13- DESCRIPTION CHIP CAPACITOR 10nF 50V CHIP CAPACITOR 100nF 16V CHIP CAPACITOR 1uF 10V 0ADL310E CHIP CAPACITOR 10uF p/n C2012X5R0J106K

senju m705 solder paste

Abstract: Senju M705 SENJU mobile actuator ltds senju solder paste
Contextual Info: NEW 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices

Senju M705

Contextual Info: 0.4 mm Contact Pitch, 1.2 mm above the board, Flexible Printed Circuit ZIF Connectors FH 27 Series ●FPC thickness: 0.2±0.03 mm ●1.2 mm Height, actuator fully closed. 54 pos. shown •Overview 1.2mm Continuous miniaturization of personal mobile devices

Senju

Abstract: 15W 50 Ohm Ceramic Resistors
Contextual Info: LOW Ohm METAL PLATE Current sensing CERAMIC CASE BLR STRUCTURE Ceramic case Termination electrode Resistive element metal plate Cement Heat sink LOW OHM 1 2 3 4 5 Identification produCt code coating color marking None BLR (White Ceramic) Alpha Numeric (Type, R-value,

senju m705 solder paste

Abstract: Senju M705 SENJU SENJU SOLDER PASTE M705-221CM5 Senju metal solder paste standard ul94v0 plastic paste M705 solder paste
Contextual Info: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.

Contextual Info: 0.5mm pitch low profile FPC LIF back-lock connector FF14C Series OUTLINE The FF14C series low profile FPC LIF connector has a back-lock mechanism with a 0.5mm contact pitch. It mates with a standard FPC circuit of 0.3mm thick. The upper contact is utilized as the electrical contact for the FPC material.

Senju paste 7100

Abstract: M705-221CM5 40 pin zif connector 1mm FPC LCD 40 pin zif connector 1mm FPC Senju 7100 reflow profile 1mm 30 pin fpc connector Senju 1mm 40 pin fpc connector 32 PIN FPC CONNECTOR FH26-13S-0.3SHW
Contextual Info: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.

senju m705 solder paste

Abstract: 1mm 30 pin fpc connector datasheet 40 pin zif connector 1mm FPC FH26-35S-0.3SHW SN 0203 FPC CONNECTOR SENJU 221CM5 32 PIN FPC CONNECTOR FH26-13S-0.3SHW FH26-39S-0.3SHW
Contextual Info: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.

40 pin zif connector 1mm FPC

Abstract: g3244 M705-221CM5-42-10 Senju flux FH265 senju solder specification
Contextual Info: 0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors FH26 Series 1.0mm ●Space saving 51 pos. shown 3.2mm 16.8mm Metal fittings do no protrude outside of the connector body •Features 1. Extremely light weight ●Can be mounted over conductive traces.

Senju M705-GRN360-K2-V solder paste

Abstract: Senju M705-GRN360-K2-V
Contextual Info: 0.5mm Pitch Back-lock FPC Connectors FF14 Series OUTLINE The FF14 FPC connector utilizes a back-lock mechanism with 0.5mm pitch. This ultra-low profile ZIF connector has a height of only 0.9mm. The FF14 connector series offers flexibility in FPC design as it mates with 0.20mm thick or 0.12mm thick

Contextual Info: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series has a back-lock mechanism connector with a 0.3mm contact pitch. It fits 0.15mm thick FPCs and has upper and lower contacts, but the connector height has a low profile of 0.9mm, making the PCB mounting space the smallest in the market.

Senju M705

Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
Contextual Info: Application Report SWPA156 – February 2009 Part – II Assembly Guidelines for 0.4-mm Package-On-Package Packages Steven Kummerl . OMAP ABSTRACT

Senju

Abstract: MARKING CODE 2l marking code 1L
Contextual Info: POWER TYPE RESISTORS TECHNOLOGY OF TOMORROW METAL PLATE CERAMIC CASE BLR W NE STRUCTURE 1 Ceramic case 2 Termination electrode 3 Resistive element metal plate 4 Cement IDENTIFICATION PRODUCT CODE COATING COLOR MARKING BLR None (White Ceramic) Alpha Numeric

SENJU SOLDER PASTE

Abstract: Senju Senju metal solder paste Senju flux senju solder h63 37wt viscosity senju H63
Contextual Info: gSolder and Flux 1 Solder Paste 1) Flow Soldering : Use H60 (Sn:Pb=60wt%:40wt%) type, H63 (Sn:Pb=63wt%:37wt%) type or equivalent type of solder paste. 2) Reflow Soldering : Use RA type or equivalent type of solder paste (Sn:Pb:Ag=63wt%:35wt%:2wt%, Sn:Pb=60wt%:40wt% or Sn:Pb=63wt%:37wt%)

Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.