SENJU SOLDER BAR Search Results

Senju M705-GRN360-K2-V

Abstract: Senju M705-GRN360-K2-V solder paste Senju eco solder paste Senju M705-GRN360-K2-V TYPE 4 OZ63-221CM5-42-10 senju type 5
Contextual Info: 0.3 mm Pitch Back-lock FPC Connectors FF12 Series OUTLINE The FF12 series back-lock LIF connector allows for design flexibility by incorporating both an upper contact and a lower contact to interface with a 0.15mm thick FPC at a 0.3mm pitch. The low profile

Contextual Info: 0.5mm Pitch FPC/FFC/Membrane FF14A Series 【Cable Lock Type】 OUTLINE FF14A series is a 0.9mm height connector with a cable lock mechanism, in conformity to FPC of 0.5mm pitch and 0.2mm thick. Applicable cable is 0.2mm thick FPC, FFC and membrane. APPLICATIONS

Senju M705

Abstract: Senju eco solder M705 Senju M705 m705 m705-tva Senju eco solder paste senju m705 solder paste Solder bar of Senju M705 M705-TVA03 Senju m705-tva senju solder bar
Contextual Info: Application Report SWPA156 – February 2009 Part – II Assembly Guidelines for 0.4-mm Package-On-Package Packages Steven Kummerl . OMAP ABSTRACT

senju M705 solder paste

Abstract: Senju M705 senju solder paste M705 senju solder paste M705 solder paste Senju metal solder paste senju solder specification
Contextual Info: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.

senju m705 solder paste

Abstract: senju solder paste Senju M705 Senju metal solder paste Senju M705-221CM5 SENJU 221CM5 senju M705 solder paste data sheet M705 solder paste stiffener
Contextual Info: 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.

Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

senju m705 solder paste

Abstract: Senju M705 SENJU SENJU SOLDER PASTE M705-221CM5 Senju metal solder paste standard ul94v0 plastic paste M705 solder paste
Contextual Info: NEW 0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. FH 25 Series 51pos. type 0.9mm 3.45mm 17 .1m m •Features No exposed contacts 1. Extremely light weight The largest version, with all contacts loaded, weights only 0.11gramms.

senju m705 solder paste

Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4E *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

senju m705 solder paste

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB50GT1C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT1C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT4E *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Senju ESR-250

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2AA50GV6* *:1.2 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QB2C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2AA*QV6F *:27,30,35,40,50,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

56QN50T18080

Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Contextual Info: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

rdl 117

Abstract: SENJU SOLDER PASTE rdl 117-a wcsp reliability IPC9701 MO-211 solder paste senju snpb wcsp package reliability
Contextual Info: Application Report SBVA016 – September 2003 NanoStar Wafer Chip-Scale Package Design Ray Crampton, Jim Rosson High-Performance Analog Products ABSTRACT To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale WCSP package, Texas Instruments has introduced the 170µm NanoStar™ YEQ

OMAP4

Abstract: LASER based Four ZONE security system water filling station circuit diagram Senju eco solder paste mobile nokia circuit diagram eco solder paste primavera OMAP35xx lf4300 solder dipping pop
Contextual Info: Application Report SPRAAV2 – April 2008 PCB Assembly Guidlines for 0.4mm Package-On-Package PoP Packages, Part II Keith Gutierrez and Gerald Coley .

Aluminum Electrolytic Capacitors

Abstract: TAMURA NA-200 Tamura NA200 flux NA200 flux Tamura kaken NRSZ101M100V12.5X20F SAT-5000 NACE NA-200 Tamura senju h63a
Contextual Info: www.niccomp.com | Technical Support: tpmg@niccomp.com February 4, 2009 SUB: Component testing after Long Period on Shelf Reliability testing of solid and liquid type aluminum electrolytic capacitor after long storage The following pages show the reliability of solid and liquid aluminum electrolytic capacitors after long

Senju M705-GRN360-K2-V

Abstract: Senju M705-GRN360-K2-V solder paste solder paste M705-GRN360-K2-V Senju oz 221 pcb warpage after reflow M705-GRN360 senju M705-GRN360-K2 fh4219
Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.3 mm Pitch, 0.65 mm above the board, Top Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors

0.5mm 40 pin fpc connector

Abstract: 0.5mm 30 pin fpc connector 12 pin zif connector 0.5mm FPC 8 pin zif connector 0.3mm FPC notebook flat cable connector 30 pin 0.5mm 60 pin fpc connector sn 0620 FH12 pcb design 0,5 mm pitch PCB stiffener
Contextual Info: High Density FPC Connector 0.3mm/0.4mm/0.5mm Pitch FH16 Series FH16 Series Variation 0.3mm pitch 60 contact 0.3mm pitch 80 contact 0.3mm pitch 90 contact 0.4mm pitch 80 contact 0.5mm pitch 50 contact 0.5mm pitch 64 contact •Features 1. High Density FPC Connector

sn 0620

Abstract: senju solder bar 12 pin zif connector 0.5mm FPC 0.5mm 60 pin fpc connector 0.5mm 30 pin fpc connector FH16M-96S-0.4SHW FPC cable MIL H 5606 0.5mm pitch horizontal FH16H-50S-0.5SHW
Contextual Info: High Density FPC Connector 0.3mm/0.4mm/0.5mm Pitch FH16 Series FH16 Series Variation 0.3mm pitch 60 contact 0.3mm pitch 80 contact 0.3mm pitch 90 contact 0.4mm pitch 80 contact 0.5mm pitch 50 contact 0.5mm pitch 64 contact •Features 1. High Density FPC Connector

M705-GRN360-MZ

Abstract: M705-GRN360 M705-GRN360-M-Z NC257 senju solder bar WLCSP stencil design
Contextual Info: AN11046 DSN0603-2 SOD962 soldering requirements Rev. 1 — 1 June 2012 Application note Document information Info Content Keywords DSN0603-2 (SOD962), 0201 package size, reflow soldering, surface mount, solder paste, solder mask opening, Printed-Circuit Board (PCB),