SENJU M705 SOLDER PASTE DATA SHEET Search Results

senju m705 solder paste

Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*GT4E *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

senju m705 solder paste

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB50GT1C *:50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT1C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QB2C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT4E *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Senju ESR-250

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2AA50GV6* *:1.2 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

QT4c

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2BB*QT4C *:27,30,35,40,45,50,57,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Contextual Info: ZENIGATA LED July 30, 2014 SPECIFICATIONS Pico ZENIGATA-LED GM2AA*QV6F *:27,30,35,40,50,65 Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

tamura solder paste

Abstract: CF-110VH-2A tamura CF-110VH-2A CF-110VH Senju M705 safety senju 533 solder paste
Contextual Info: Classification Issue No. 20090855 REFERENCE SPECIFICATION Part Name LIGHT TOUCH SWITCH Part No. EVPAA402W 1/8 1. Notification Items 1.1 Law and the regulation which are applied ①This product has not been manufactured with ozone depleting chemical controlled under

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

GM1WA55311A

Abstract: GM1WA55311 senju m705 solder paste spec Senju Senju M705 Solder bar of Senju M705 C0806 IR sensor for 40khz diode Cathode indicated by blue band ESR250
Contextual Info: SPEC. N o. DG-072023A SH ARP ISSUE Dec-20-07 COMPOUND SEMICONDUCTOR SYSTEMS DIVISION ELECTRONIC COMPONENTS ELECOM GROUP SHARP CORPORATION SPECIFICATIONS DEVICE SPECIFICATION FOR LIGHT EMITTING DIODE MODEL No. G M 1W A 55311A CUSTOMERS' APPROVAL PRESENTED

ESR250

Contextual Info: V \ j f \ \ /§ ECs-No. DG-07Z008 SHARP I S ^ E /^JÌìnuary 31, 2008 COMPOUND SEMICONDUCTOR SYSTEMS DIVISION ELECTRONIC COMPONENTS ELECOM GROUP SHARP CORPORATION SPECIFICATIONS DEVICE SPECIFICATION FOR LIGHT EMITTING DIODE MODEL No. GM5BW96380A CUSTOMERS’ APPROVAL

GM5BW96385A

Contextual Info: GM5BW96385A GM5BW96385A Light Emitting Diode • Features ■ Agency Approvals/Compliance 1. High brightness 2300 mcd @ IF = 20 mA 2. White Color (achieved via InGaN Blue LED chip in combination with Yellow Phosphor) 3. Similar part to GM5BW96380A, but includes selfprotection against static electricity

Contextual Info: LCD backlight LED device Aug 8, 2014 SPECIFICATIONS LIGHT EMITTING DIODE GM4BN7B3S0A Notice Contents in this technical document be changed without any notice due to the product modification. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any

Solder bar of Senju M705

Abstract: senju m705 solder paste spec senju m705 solder wire Senju M705 solder bar a1249 senju m705 solder paste
Contextual Info: SHARP SPEC. ISSU E ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR LIGHT EMITTING DIODE MODEL No. GM4B W6433 0A CUSTOMERS' APPROVAL PRESENTED Date_ Date C lu r& -¿ * > 7 BZ_ Y.Inada, 1 /

lM 3160

Abstract: MCPD 3000 cd4500 0411 02 027 000 6600K uv photometer design
Contextual Info: Preliminary GM5SAExxP0A Series GM5SAExxP0A (Series) Light Emitting Diode • Features ■ Agency Approvals/Compliance 1. Single-chip device, the given output at IF = 20 mA 2. White Color, high color rendering (achieved via Blue LED chip in combination with red and green

IS02859

Contextual Info: Preliminary GM5BW97331A GM5BW97331A Light Emitting Diode • Features ■ Agency Approvals/Compliance 1. 3-chip device, the given output at IF = 20 mA/chip 2. White Color achieved via InGaN Blue LED chips in combination with Yellow Phosphor 3. Other parts in this family:

senju m705 solder wire

Abstract: Solder bar of Senju M705 senju M705 solder paste senju 533 solder paste spec Senju M705 solder bar GM4BW53340A PL80 senju solder bar C0806 senju m705 silver less solder wire 0.5 mm
Contextual Info: - _ _ • SPEC. No. S H A R P ISSU E May- ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR LIGHT EMITTING DIODE MODEL No. GM4BW53340A CUSTOMERS' APPROVAL PRESENTED Date _ Date M rt, y m :_ f j ; 2&d~7

Contextual Info: Doc. No. DG-132034 ISSUED February 26, 2013 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BT57QV1□ Model No. □： 1，２

Contextual Info: Doc. No. DG-132032 ISSUED February 26, 2013 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BT40QV1□ Model No. □： 1，２

Contextual Info: Doc. No. DG-132033 ISSUED February 26, 2013 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BT50QV1□ Model No. □： 1，２

Contextual Info: Doc. No. DG-132036 ISSUED February 26, 2013 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BT27QV2□ Model No. □： 1，２

Contextual Info: Doc. No. DG-132040 ISSUED February 26, 2013 LIGHTING DEVICE DIVISION ELECTRONIC COMPONENTS AND DEVICES GROUP SHARP CORPORATION 仕様書 SPECIFICATIONS 品名 表面実装型 LED Product name Surface Mount LED 形名 GM2BT50QV2□ Model No. □： 1，２