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TLP3450S
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Toshiba Electronic Devices & Storage Corporation
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Photorelay (MOSFET output), 1a, 20 V/0.16 A, 500 Vrms, S-VSON4T |
Datasheet
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86503-450HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail. |
PDF
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89883-450LF
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Amphenol Communications Solutions
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Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Top Entry, Double row , 100 Positions, 2.54mm (0.100in) Pitch |
PDF
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68693-450HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in)Pitch.. |
PDF
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10069345-001LF
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Amphenol Communications Solutions
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GIG-Array®, Mezzanine Connectors, 5mm Receptacle 296 Position Lead Free. |
PDF
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