SDF1000 Search Results

TIS88A equivalent

Abstract: 2N3456 equivalent J411 fet 2n5952 equivalent 2n3820 equivalent 2N5248 equivalent fet 2N4304 2n5245 equivalent 2N4304 equivalent 2N5454 equivalent
Contextual Info: a t t m ,© O R D E R IN G IN F O R M A T IO N Devices, Inc T O / » © 0© T Q K © K lO tP i M f l® The following is the product code index lor J-FET and MOS FET DIE/WAFERS having 2N, 3N JEDEC prefixes. This product code index is Solitron San Diego's standard for Q. A. production, marketing and sales.

Contextual Info: ATTA[L N-CH ANNEL JU N C TIO N FET CHIP NUMBER CONTACT METALLIZATION Top Contact: > A Aluminum 12,000 .030" (0.762mm Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS .027" (0.686mm) It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.

2N5432

Abstract: 2N5434 P18 fet
Contextual Info: -Æ iitron Devices, Inc. N -C H A N N E L J U N C T IO N FET CHIP NUMBER CONTACT METALLIZATION Top Contact: > 12,000 A Aluminum .030" 0.762mm Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS .027" (0.686mm) It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%.