SD748 Search Results

Contextual Info: I 5.550 + .0 0 5 /-.0 1 0 140.97 + 0 .13/-0.25 5. RECOMMENDED MODULE LAYOUT SHALL BE PER JEDEC MO-161. 6. RECOMMENDED PLATING ON MODULE PADS: 30 MICROINCH/(0.76 MICROMETER) MINIMUM HARD GOLD (Au) OVER 79 MICROINCH/(2.0 MICROMETER) MINIMUM NICKEL (Ni). 7 . SEE CHART FOR FORK/HOLE PRESENCE AND PLATING OPTION.

SD7402

Contextual Info: 13 NOTES: U N LE S S 1. M A T E R IA L S : 2. F IN IS H : II 12 O TH ER W ISE I 74671 S P E C IF IED HO U SIN G - L IQ U ID C R Y S T A L P O L Y M E R (L C P ), G L A S S - F IL L E D , U L 9 4 V - 0 . T E R M IN A L S - HIGH P E R F O R M A N C E C O P P E R A L L O Y .

JEC 0.1 SO

Abstract: LA 5461 74081
Contextual Info: I 5.550 +.0 O 5 /-.O I0 M B.97 +0 .I3 / - 0 .2 5 • 290 (7.37) 5. RECOMMENDED MODULE LAYOUT SHALL BE PER JEDEC MO-161. 6. RECOMMENDED PLATING ON MODULE PADS: 30 MICROINCH/(0.76 MICROMETER) MINIMUM HARD GOLD (Au) OVER 79 MICROINCH/(2.0 MICROMETER) MINIMUM NICKEL (Ni).

s7488

Abstract: SD748
Contextual Info: 12 13 NOTES, 7488 I II UNLESS OTHERWI SE S P E C I F I E D L M AT E R IA LS HOUSING - LIQ UID C R Y S T A L POLYMER (LCP ), G LA SS-FILLED , UL94V-0. TE RM IN AL S - HIGH PERFORMANCE COPPER AL LO Y. FIN IS H; S E L E C T I V E GOLD (Au) IN CONTACT AREA,

Contextual Info: 7488 I M A T E R IA L L MATERIALS^ HOUSING - LIQUID CRYSTAL POLYMER LCP , GLASS-FILLED, UL94V-0. TERMINALS - HIGH PERFORMANCE COPPER ALLOY. 2. FINISH! SELECTIVE GOLD (Au) IN CONTACT AREA, SELECTIVE TIN/LEAD (Sn/Pb)ON PCB TAILS, NICKEL (N!) OVERALL. 3. REFER TO MOLEX PRODUCT SPECIFICATION PS-7403 1-999 FOR