SD73 Search Results

G38-87

Contextual Info: [Advance Information] SD732CF64 64K x 32 CMOS Synchronous Burst Flow-Through SRAM Features Functional Description • +3.3V+10%, -5% Power Supply The SD732C64 is a high speed 2M, 65,536 x 32 cell, synchronous burst Flow-Through CMOS Static RAM organized as 64K words by 32 bits that supports high

SD73608

Abstract: SA207596-SHT01 Burndy penetrox Penetrox A-13 WAS19A44N sa2075
Contextual Info: r tv v REV= 1 1 1 991 F I G. L 1 F I G. 2 REV. DESCRIPTION DATE REDRAWN TO BURNDY C S IZ E BY FORMAT P C N 1821 C'K'D. JPG NSP NOTES: h ' . ! 1I !• ■ ; l1 i ■’ ■ 1 t MATERIAL: CAST ALUMINUM ALLOY. WELDING BY CUSTOMER. SEE DRAWING SD73608 FOR WELDING

2SD735

Abstract: USD735 USD740 USD745
Contextual Info: 8 Amp Schottky Rectifiers SD735 - USD745 - c Dim. Inches Minimum —B A B C D E F G H J K L M N P Base Cathode Î •Ji M illim eter Maximum Minimum .390 .045 .180 .245 .550 .139 .100 -.500 .190 .014 .080 .028 .045 .415 .055 .190 .260 .650 .155 .120

05564

Abstract: ZHCS2000 33708 SP6682 5w led power supply LED 5w led 5W 700mA power LED 5W
Contextual Info: SP6682 High Voltage Boost Circuit to Drive 5W Lumileds 1. Schematics L1 Vout SD73-R60M 1 1 DS 2 0.6uH 1 ZHCS2000 SP6682 1 V IN 1 2 2.7-4.2V 1 3 4 R1 1M PWM/EN 1 1 C1 10uF 5 V out C2P C1P C1N V in GND V mode FB C2N EN/PWM 10 9 8 D11 Q1 7 5W LED C3 2.2uF FDC637A

burndy compression die index csa 26

Abstract: AL7CU AL9CU-hv YA46A5 YA34A7 YA39A Burndy penetrox TM A YA25A7 csa compression die index csa 26 35-SEP-9
Contextual Info: n SD73935 CO N N EC TO R CONDUC TOR - NO. OF HOLES 10 7 1 1/4 1/4 #6 STRANDED . 1840 7 1 .62 [16] .75 [19] .53 [13] .47 [12] .75 [19] .75 [19] - - - - - - .75 [19] [2 2 ] .65 [17] .47 [12] 1.19 [30] .75 [19] .88 [22] .88 [22] .80 [20] .80 [20] .87 [22] .75

Schottky Diode 20V 2A

Abstract: RB 34 schottky diode ZHCS2000 FDC637AN MSOP-10 SP6682 SP6682EU diode 20V 2A
Contextual Info: SP6682 High Voltage Boost Board for LumiLED Application L1 Vout SD73-R60M 1 1 Schematics 1 DS 2 0.6uH ZHCS2000 D1 LED SP6682 1 1 2 2.7-4.2V 1 3 4 R1 PWM/EN 1 1 5 C1 10uF C2P C1P C1N Vin GND Vmode C2N FB EN/PWM 10 9 D2 8 LED Q1 7 FDC637AN 6 C2 22uF Ceramic

G38-87

Abstract: SD732C64TQ-5
Contextual Info: [Advance Information] SD732C64 64K x 32 CMOS Synchronous Burst Pipeline SRAM Features Functional Description • +3.3V+10%, -5% Power Supply The SD732C64 is a high speed 2M, 65,536 x 32 cell, synchronous burst Pipeline CMOS Static RAM organized as 64K words by 32 bits that supports high performances

Contextual Info: SD732C32 32K x 32 CMOS Synchronous Burst Pipeline SRAM Features Functional Description • High Speed clock access time: 5/6/7/8ns The SD732C32 is a high speed synchronous burst Pipeline CMOS Static RAM organized as 32,768 words by 32 bits that supports both i486/PentiumTM Interleaved mode

SD73C168

Contextual Info: SD73C168 Semiconductor 8BIT SINGLE CHIP MICROCONTROLLER KSI-W027-000 1 SD73C168 KSI-W027-000 2 SD73C168 SD73C168 KSI-W027-000 3 SD73C168 KSI-W027-000 4 SD73C168 KSI-W027-000 5 SD73C168 SD73C168 KSI-W027-000 6 SD73C168 KSI-W027-000 7 SD73C168 KSI-W027-000 8

Contextual Info: 13 12 10 S E E N O TE N A T E R IA L AN D FIN IS H ES: N O T E : OPTION TO NEW TOOLING FOR IN PRO VIN G O R IE N T A T IO N OF P AC KING B A S E : LCP COLOR: IVO R Y W ILL W IT H S T A N D R E F L O W TENPERATURE C O N TA C T: P H O SP H O R B R O N Z E JIS 5191-SH

Contextual Info: 12 13 10 MATERIALS AND FINISHES 31.52 BODY BRASS PLATED NICKEL 100 MICROINCHES MIN RG316 CABLE CENTER CONTACT BERYLLIUM COPPER PLATED GOLD (30 MICROINCHES MIN) INSULATOR GASKET TEFLON SILICONE RUBBER VSWR: 1.125 MAX (DC TO 3 GHz) INSERTION LOSS: ,35dB MAX

Contextual Info: 12 13 10 MATERIALS AND FINISHES BODY ZINC ALLOY PLATED NICKEL H Z 9 H + 0 HH CENTER CONTACT PHOSPHOR BRONZE PLATED GOLD INSULATOR P0LYPR0PYLENE 9AV2 BNC JACK 75 OHM BOARD LOCK PHOSPHOR BRONZE INTERFACE PLATED TIN SOLDER TAIL COPPER OVER 2TEEL PLATED TIN 12.70 ±0.25

Contextual Info: 13 12 M A T E R IA L S 10 6 .4 9 , REF • A N D F IN IS H E S ' .256 BODY 4 .7 4 , : REF .187 BRASS P LATED SEE TAB LE C E N TER CONTACT P LATED B E R Y L LIU M .5 3 0 -R EF .138 C O P P ER GOLD IN S U L A T O R TEFLO N * 1 2.06 -R E F .081 0.3' .012 R E F

Contextual Info: 13 12 10 WILL WITHSTAND REFLOW MATERIAL AND FINISHES: 0.50 ±0.05 BASE: LCP .020 ±.002 COLOR: IVORY TEMPERATURE OF 265 DEG G ±5 DEG VSWR DC-3GHz: 1.18 MAX CONTACT: PHOSPHOR BRONZEtJIS 5191-SH DC-6GHZ: 1.30 MAX PLATED GOLD 3u'l OVER NICKEL ( 50 u “) z on

Contextual Info: 13 12 10 M A TER IA LS AND FINISHES s nn±n is BODY BRASS P L A T E D GOLD U -CENTER CONTACT BERYLLIUM COPPER • ■ so .156 ±.006 P L A T E D GOLD INSULATOR TEFLO N r 4 0.71 ±0.10 .028 +.004 ' 1.07 ±0.05 ±0.05 166 +.002 PLACES ES-73599-0000-0160

Contextual Info: 13 10 12 31.52 MATERIALS AND FINISHES BODY BRASS PLATED NICKEL 100 MICROINCHES MIN RG316 CABLE CENTER CONTACT BERYLLIUM COPPER PLATED GOLD (30 MICROINCHES MIN) CONTACT BRASS PLATED GOLD (30 MICROINCHES MIN) INSULATOR GASKET TEFLON SILICONE RUBBER VSWR: 1.125 MAX (DC TO 3 GHz)

Contextual Info: 10 13 M A T E R IA LS AND FINISHES BODY: B R ASS P L A T E D NICKEL X CENTER CONTACT:PHOSPHOR BRONZE P L A T E D GOLD , non IN SU LATO R : TE FLO N 21.20 ^RFF ,0 7 3 R EF A P LAC ES PR ESS RING: B R ASS P L A T E D NICKEL j^ H O ef r ef BNC JACK IN TER FAC E

Contextual Info: 13 10 12 MATERIALS AND FINISHES: BODY, JAM NUT: BRASS FINISH: SEE TABLE CENTER CONTACT: BERYLLIUM COPPER PLATED GOLD INSULATOR: TEFLON LOCKWASHER: PHOSPHOR BRONZE FINISH: SEE TABLE 1 50 0 — M'N 5 PLACES TYP RECOMMENDED PANEL CUTOUT 5.08-TYP _ .200 DIM A

Contextual Info: 12 13 10 35.10 + 0.35 MATERIALS AND FINISHES BODY ZINC ALLOY PLATED NICKEL BNC JACK INTERFACE HOUSING PLOYED TER BUTYLENE TEREPHTALATE COLOR: BLACK 1C 7 A CENTER CONTACT PHOSPHOR BRONZE PLATED GOLD INSULATOR POLYPROPYLENE 94-V2 REF MOUNTING POST BRASS PLATED TIN

Contextual Info: 10 13 71 an MATERIALS AND FINISHES BODY ZINC ALLOY P LA T E D NICKEL CENTER CONTACT PHOSPHOR BRONZE BNC JACK P LA T E D GOLD/TIN INTERFACE 9.65 _ REF- '.3 8 0 TOP VIEW INSULATOR POLYPRO PYLENE j ~ ~ l 11.02 REF 8,60 .434 .339 0 H ref 13.00 3 .8 0 ± 0 .0 5

Contextual Info: 13 12 10 14.10 „ REF " .555 M A T E R IA LS AND FINISHES 7.10 REF —H .280 BODY, HOUSING BR ASS P L A T E D GOLD CENTER CONTACT BR ASS P L A T E D GOLD INSU LATO R TE FLO N ^RFF .337 R EF 4 P LAC ES 12.06 R EF .475 I ^ 0 R EF .118 R 4 P LAC ES 5 08 O

Contextual Info: 13 12 10 10.16 .600 REF 5.08 r .200 REF < 0 EE 2 PLACES 10.16 REF .600 28 66 ;- 0 - EE PLACES 256 r .100 REF 5.08-REF ^ .200 PCB HOLE CONFIGURATION CONSTRUCTION: BODY - - ZINC ALLOY HOUSING- - POLYESTER BUTYLENE TEREPHTHALATE BLACK

Contextual Info: 13 10 SEE DETAIL "A" .00 6.70 M2 X 0.4 - 6H THREADED INSERT SECTION 'A-A" W H -SEATING SURFACE STANDOFF - ^ f °" 08 - 0°?6 (68X) 5.20±0.06 2.40 _ i_ - r E=D

Contextual Info: 13 10 12 33 43 MATERIALS AND FINISHES BODY: ZINC ALLOY PLATED NICKEL CONTACT: PHOSPHOR BRONZE PLATED GOLD 0.51 INSULATOR: POLYPROPYLENE 94 V-2 PLATED TIN .020 1.80 0, -.071 2 PLACE JAM NUT: BRASS PLATED NICKEL SOLDER TAIL: COPPER COVERED 9TEEL PLATED TIN