SD3022NB Search Results
SD3022NB Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
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Contextual Info: NOTES : 1. PIN PUSH OUT FORCE: 2 LBS. MIN. 2. PIN SOLDERABILITY PER MOLEX ENG. STD. No. 53 3. DIMENSIONS SHOWN ARE MILLIMETERS OVER INCHES MM/IN. STACKABLE SIDE BY SIDE 3H OF WAFER <£0F WAFER (2.50 0.098 STACKABLE END TO END 22- 03-1202 HE-3022-20B 1 -1192 |
OCR Scan |
he-3022-20b022-2bsd3022nbodgnchartsdae-3022 | |
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Contextual Info: NOTES : 1. PIN PUSH OUT FORCE: 2 LBS. MIN. 2. PIN SOLDERABILITY PER MOLEX ENG. STD. No. 53 3. DIMENSIONS SHOWN ARE MILLIMETERS OVER INCHES MM/IN. STACKABLE SIDE BY SIDE OF WAFER <£0F WAFER 2.50 0.098 STACKABLE END TO END 20 1 -1192 -I9B 19 - I8B 18 1 CM |
OCR Scan |
e-3022-20b022-2bsd3022nbae-3022 |