SD1992 Search Results

HS5930-1

Contextual Info: REV 03 3. FINISH SPECIFICATIONS: CENTER AND OUTER CONTACTS: .000050 MIN GOLD PER ASTM B488 OVER .000050 NICKEL OVER COPPER FLASH ALL OTHER METAL PARTS: .000050 MIN NICKEL PER AMS-QQ-N-290 OVER .000050 MIN COPPER PER ASTM B734 REVISED PER ER20736 BY APPD DATE

TPRF085

Abstract: sd1992
Contextual Info: DESCRIPTION 02 EWR11-ER34061 ER35668 BY APPD DATE DCAM 6. ASSEMBLE TO CABLE USING CAP 6-08 REV KPL 11/02/11 NOTES: UNLESS OTHERWISE SPECIFIED 1. DESIGNED FOR USE WITH TPRF085 CABLE. 2. MATERIAL SPECIFICATIONS: CENTER & INTERMEDIATE CONTACTS: BERYLLIUM COPPERPER ASTM B196

Contextual Info: .tAR i l 1983 93AA46/56/66 M icrochip CMOS Serial Electrically Erasable PROMs DESCRIPTION FEATURES The Microchip Technology Inc. 9 3 A A 4 6 /5 6 /6 6 are 1K, 2K and 4K low voltage serial Electrically Erasable PR O M s. The device m emory is configured a s x 8 o r x 1 6

Contextual Info: 1.53 REF. 1 /2 -2 8 U N E F -2 A TH’ D .116 MAX. PANEL .68 NOTES: 1. FOR USE WITH M1 7 /1 7 6 - 0 0 0 0 2 CABLE. 2. FOR CABLING INSTRUCTION SEE 3 - 4 0 0 . 3. FOR CRIMPING USE DIE K T H -2 1 7 5 . 4. INTERFACE PER M IL -S T D -3 4 8 , FIG. 2 0 1 - 2 . 5. INTERMATEABLE WITH M IL - C - 4 9 1 4 2 /8 & / 1 2