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Catalog Datasheet	Type	Document Tags	PDF
38.3008 Abstract: NCP500 ON TSOP-5 MAY sc70l Contextual Info: AND8080/D TSOP vs. SC70 Leadless Package Thermal Performance Prepared by David Billings ON Semiconductor Thermal Characterization Laboratory http://onsemi.com APPLICATION NOTE Introduction Leadless packages are becoming a popular method to reduce the size of a package while keeping the same silicon	Original	and8080/d sc70ll r14525 38.3008 +3ncp500 on tsop-5 may sc70l	PDF

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38.3008

Abstract: NCP500 ON TSOP-5 MAY sc70l
Contextual Info: AND8080/D TSOP vs. SC70 Leadless Package Thermal Performance Prepared by David Billings ON Semiconductor Thermal Characterization Laboratory http://onsemi.com APPLICATION NOTE Introduction Leadless packages are becoming a popular method to reduce the size of a package while keeping the same silicon

Original

and8080/d sc70ll r14525 38.3008 +3

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