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    38.3008

    Abstract: NCP500 ON TSOP-5 MAY sc70l
    Contextual Info: AND8080/D TSOP vs. SC70 Leadless Package Thermal Performance Prepared by David Billings ON Semiconductor Thermal Characterization Laboratory http://onsemi.com APPLICATION NOTE Introduction Leadless packages are becoming a popular method to reduce the size of a package while keeping the same silicon


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    AND8080/D SC70LL r14525 38.3008 NCP500 ON TSOP-5 MAY sc70l PDF