SAL1 Search Results

Contextual Info: HIGH SPEED MICRO PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SAL1 Mount in pairs on same side or opposite sides for easy signal routing Mates with: 1,60mm .062" or (2,40mm) .093" card A P P L IC A T IO N S

Contextual Info: NOTES: REVISION Q DO NOT SCALE FROM THIS PRINT SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED 1. C REPRESENTS A CRITICAL DIMENSION. IN MILLIMETERS[INCHES] 2. BURR ALLOWANCE: .038[.0015] MAX. 3. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. 4. MAXIMUM ALLOWABLE BOW: .05[.002] INCH/INCH AFTER ASSEMBLY.

Contextual Info: F-213-1 SAL1–120–01–S–S–A–TR SAL1–127–01–S–S–A–TR 1,00 mm .0394" SAL1–140–01–S–S–A–TR SAL1 SERIES HIGH SPEED MICRO PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SAL1

Contextual Info: REVISION K NOTES: DO NOT SCALE FROM THIS PRINT SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] 1. C REPRESENTS A CRITICAL DIMENSION. 2. BURR ALLOWANCE: .038[.0015] MAX. 3. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. 4. MAXIMUM ALLOWABLE BOW: .05[.002] INCH/INCH AFTER ASSEMBLY.

Contextual Info: F-209 PCIE–036–02–F–D–TH PCIE–098–02–F–D–EM2 SAL1–140–01–S–S–A HIGH SPEED MICRO CARD Mates with: .062" 1,60mm Card NO. OF POSITIONS PCIE PLATING OPTION 02 PCIE, SAL1 SERIES D TERMINATION SPECIFICATIONS For complete specifications and

Contextual Info: REVISION L NOTES: DO NOT SCALE FROM THIS PRINT SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] 1. C REPRESENTS A CRITICAL DIMENSION. 2. BURR ALLOWANCE: .038[.0015] MAX. 3. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. 4. MAXIMUM ALLOWABLE BOW: .05[.002] INCH/INCH AFTER ASSEMBLY.

Contextual Info: F-211 SAL1–127–01–S–S–A SAL1–120–01–S–S–A SAL1–140–01–S–S–A 1,00mm .03937" SAL1 SERIES HIGH SPEED MICRO PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SAL1 Insulator Material:

Contextual Info: F-212 SAL1–127–01–S–S–A SAL1–120–01–S–S–A SAL1–140–01–S–S–A 1,00mm .03937" SAL1 SERIES HIGH SPEED MICRO PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SAL1 Insulator Material:

Contextual Info: F-205-1 HIGH SPEED MICRO PLANE I SPECIFICATIONS For complete specifications see www.samtec.com?SAL1 Insulator Material: Black LCP Contact Material: BeCu Plating: Au or Sn over 50m" 1.27pm Ni Operating Temp: -55°C to +125°C Current Rating: 2.3 A @ 80°C

Contextual Info: F-214 SAL1–120–01–S–S–A–TR SAL1–127–01–S–S–A–TR SAL1–140–01–S–S–A–TR 1,00 mm .0394" SAL1 SERIES HIGH SPEED MICRO PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SAL1

Contextual Info: SA L1-127-01-S -S -A SA L1-120-01-S -S -A S A L 1 -1 40-01- S - S - A HIGH SPEED MICRO PLANE SPECIFICATIONS For complete specifications see www.samtec.com?SAL1 Insulator Material: Black LCP Contact Material: BeCu Operating Temp: -65°C to +125°C Plating:

Contextual Info: NOTES: REVISION V SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED 1. C REPRESENTS A CRITICAL DIMENSION. IN MILLIMETERS[INCHES] 2. BURR ALLOWANCE: .038[.0015] MAX. 3. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. 4. MAXIMUM ALLOWABLE BOW: .05[.002] INCH/INCH AFTER ASSEMBLY.

Contextual Info: NOTES: REVISION R DO NOT SCALE FROM THIS PRINT SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED 1. C REPRESENTS A CRITICAL DIMENSION. IN MILLIMETERS[INCHES] 2. BURR ALLOWANCE: .038[.0015] MAX. 3. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. 4. MAXIMUM ALLOWABLE BOW: .05[.002] INCH/INCH AFTER ASSEMBLY.

SAL1

Abstract: SAL175UF3A
Contextual Info: Web Datasheet- Power Rectifier Web Datasheet POWER RECTIFIER PART NUMBER: SAL175UF3A PACKAGE STYLE:304 CONFIGURATION:SINGLE ALL RATINGS ARE @ Tc = 25 °C UNLESS OTHERWISE SPECIFIED. Disclaimer MAXIMUM RATINGS / Conditions SYMBOL MAX PIV 175 Volts MAXIMUM DC OUTPUT CURRENT @ Tc=55 °C

Contextual Info: F-208 SAL1–127–01–S–S–A SAL1–120–01–S–S–A SAL1–140–01–S–S–A HIGH SPEED MICRO PLANE SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SAL1 Insulator Material: Black LCP Contact Material:

Contextual Info: REVISION G NOTES: DO NOT SCALE FROM THIS PRINT SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED 1. C REPRESENTS A CRITICAL DIMENSION. IN MILLIMETERS[INCHES] 2. BURR ALLOWANCE: .038[.0015] MAX. 3. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. 4. MAXIMUM ALLOWABLE BOW: .05[.002] INCH/INCH AFTER ASSEMBLY.

Contextual Info: F-209-1 SAL1–127–01–S–S–A SAL1–120–01–S–S–A SAL1–140–01–S–S–A HIGH SPEED MICRO PLANE SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SAL1 Insulator Material: Black LCP Contact Material:

Contextual Info: REVISION H NOTES: 1. 2. 3. 4. 5. 6. SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] REPRESENTS A CRITICAL DIMENSION. BURR ALLOWANCE: ,038[.0015] MAX. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. MAXIMUM ALLOWABLE BOW: ,05[.002] INCH/INCH AFTER ASSEMBLY.

Contextual Info: SA L1-14 0 -01-S -S -A HIGH SPEED MICRO PLANE SPECIFICATIONS For complete specifications see www.samtec.com?SAL1 'SUB Surface mount Mount in pairs on same side or opposite sides for easy signal routing Mates with: 1,60mm .062" or (2,40mm) ,093"card SAL1

SAL175UF-A

Contextual Info: Web Datasheet- Power Rectifier Web Datasheet POWER RECTIFIER PART NUMBER: SAL175UF-A PACKAGE STYLE:106 CONFIGURATION:SINGLE ALL RATINGS ARE @ Tc = 25 °C UNLESS OTHERWISE SPECIFIED. Disclaimer MAXIMUM RATINGS / Conditions SYMBOL MAX PIV 175 Volts MAXIMUM DC OUTPUT CURRENT @ Tc=55 °C

Contextual Info: F-210-1 SAL1–127–01–S–S–A SAL1–120–01–S–S–A SAL1–140–01–S–S–A 1,00mm .03937" SAL1 SERIES HIGH SPEED MICRO PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SAL1 Insulator Material:

Contextual Info: REVISION X DO NOT SCALE FROM THIS PRINT NOTES: SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED 1. C REPRESENTS A CRITICAL DIMENSION. IN MILLIMETERS[INCHES] 2. BURR ALLOWANCE: .038[.0015] MAX. 3. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. 4. MAXIMUM ALLOWABLE BOW: .05[.002] INCH/INCH AFTER ASSEMBLY.

Contextual Info: F-213 SAL1–127–01–S–S–A SAL1–120–01–S–S–A SAL1–140–01–S–S–A 1,00 mm .0394" SAL1 SERIES HIGH SPEED MICRO PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SAL1 Insulator Material:

Contextual Info: REVISION Z DO NOT SCALE FROM THIS PRINT NOTES: SAL1-1XX-XX-XX-S-A-XX DESIGNED & DIMENSIONED 1. C REPRESENTS A CRITICAL DIMENSION. IN MILLIMETERS[INCHES] 2. BURR ALLOWANCE: .038[.0015] MAX. 3. MINIMUM PUSHOUT FORCE , CONTACTS, AND WELD TABS: .5 LB. 4. MAXIMUM ALLOWABLE BOW: .05[.002] INCH/INCH AFTER ASSEMBLY.