S7C3256K Search Results

351N

Abstract: FBGA-F
Contextual Info: Advance information •■ I l A S7C3256K36Z A S7C3256K32Z I 3.3V 2 5 6 K x 3 2 /3 6 synchronous burst SRAM with ZB T1 Features • • • • • • • • • M ultiple p ackagin g op tion s - Econom ical 100-pin TQFP package - C hip-scale fBGA package for sm allest footprint

Contextual Info: A Advance information •■ I l S7C3256K36Z S7C3256K32Z 3.3V 256Kx32/36 synchronous burst SRAM with NTD Features • • • • • • • • • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint

Contextual Info: Features • M ultiple p ack ag in g o p tion s • O rg an izatio n : 2 6 2 , 1 4 4 w o rd s x 3 2 o r 3 6 bits • Fast clo ck sp eeds to 1 6 6 M H z in LVTTL/LVCM OS - E co n o m ical 1 0 0 -p in TQ FP package • Fast clo ck to data access: 3 . 5 / 3 . 8 / 4 / 5 ns

Contextual Info: Advance information •■ I l S7C3256K16P S7C3256K18P I 3.3V 2 5 6 K x 1 6 /1 8 pipeline burst synchronous SRAM Features • • • • • • • • • • O rg an izatio n : 2 6 2 ,1 4 4 w o rd s x 16 o r 18 bits Fast clock speeds to 166 M H z in LVTTL/LVCMOS

LCD 14X2

Abstract: 14x2 lcd pb sram 1A17
Contextual Info: Advance information •■ I l S7C3256K16Z S7C3256K18Z I 3.3V 256Kx 16/18 synchronous burst SRAM with ZBT1 Features • • • • • • • • • • E conom ical 1 0 0 -p in TQFP package ZZ sleep m o d e fo r lo w e r p o w e r Byte w rite enables

Contextual Info: Advance information Features • B yte w r ite en ab les • C lock e n a b le fo r o p e r a tio n h o ld • O rg a n iz a tio n : 2 6 2 ,1 4 4 w o r d s x 16 o r 18 b its • Fast d o c k sp e e d s to 1 6 6 M H z in LVTTL/LVCMOS • Fast d o c k to d a ta access: 3 . 5 / 3 . 8 / 4 / S ns

Contextual Info: Advance inform ation Features • • • • • • • • • • • • • • • • • • • Organization: 2 6 2 ,1 4 4 w ords x 1 6 /1 8 bits ZBT architecture for efficient bus operation Fast clock speeds to 166 MHz Fast clock to data access: 3 .S / 3 . 8 / 4 / 5 ns