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    S10357 Search Results

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    S10357 Price and Stock

    Samtec Inc

    Samtec Inc HTMS-103-57-G-D

    .050 X .100 High-Temp Through-hole Micro Terminal Strip
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    Samtec Inc HTMS-103-57-G-S-SM

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    Samtec Inc MTMS-103-57-S-D-390

    .050 x .100 Variable Post Height Micro Terminal Strip
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    Newark MTMS-103-57-S-D-390 Bulk 1
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    Samtec Inc MTMS-103-57-L-S-150

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    Samtec Inc HMTMS-103-57-TM-S-205

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    S10357 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    S10357

    Contextual Info: PREVIOUS DATA PHOTODIODE Si photodiode S10356, S10357, S10368 Back-illuminated type photodiodes employing CSP structure S10356, S10357 and S10368 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP Chip Size Package structure. The CSP also allows using multiple devices in a tiled format. S10356 and S10357 are the single-element type


    Original
    s10356s10357s10368se-171 PDF

    S10357-01

    Abstract: S10356-01
    Contextual Info: Si photodiodes S10356-01 S10357-01 Back-illuminated type photodiodes employing CSP structure The S10356-01 and S10357-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.


    Original
    s10356-01s10357-01se-171kspd1075e08 PDF

    Contextual Info: Si photodiodes S10356-01 S10357-01 Back-illuminated type photodiodes employing CSP structure The S10356-01 and S10357-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.


    Original
    s10356-01s10357-01se-171kspd1075e07 PDF

    Contextual Info: Si photodiodes S10355-01 S10356-01 Back-illuminated type photodiodes employing CSP structure The S10356-01 and S10357-01 are back-illuminated type photodiodes designed to minimize the dead areas at the device edges by using a CSP chip size package structure. The CSP also allows using multiple devices in a tiled format.


    Original
    s10355-01s10356-01s10357-01kspd1075e09 PDF

    T11263-16

    Contextual Info: 発行元 〒 430-8587 静岡県浜松市中区砂山町 325-6 日本生命浜松駅前ビル TEL:053-452-2141 FAX:053-456-7889 jp.hamamatsu.com キリトリ線 製品についてのお問合せはお近くの営業所までご連絡ください


    Original
    t11263-16 PDF