S-51850-- Search Results

S-51850-- Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
77313-518-50LF		Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 50 Positions	PDF
65185-001LF		Amphenol Communications Solutions	Din Accessory Latching Frame Modular 2 modules	PDF
54121-809251850LF		Amphenol Communications Solutions	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 25 Positions, 2.54mm (0.100in) Pitch.	PDF
74AC11138NSR		Texas Instruments	3-Line to 8-Line Decoders/Demultiplexers 16-SO -40 to 85
74ACT11008N		Texas Instruments	Quadruple 2-Input Positive-AND Gates 16-PDIP -40 to 85

S-51850-- Price and Stock

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Boyd Corporation OS518-50-B HEATSINK, 3.59°C/W, TO-218/TO-220/TO-251; Thermal Resistance:3.59°C/W; Packages Cooled:TO-218, TO-220, TO-251; External Width - Metric:38mm; External Height - Metric:54mm; External Length - Metric:50mm; External Diameter - Metric:-
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	OS518-50-B	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
MS Screws MS51850-65
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Bisco Industries	MS51850-65		1			1 - 10 - 100 - 1000 - 10000 -	Buy Now