RZ25 Search Results

1g11

Abstract: KM-17 KW51 KW52 2G21 KM17
Contextual Info: H KM 11 KM 14 KM 17 120 mm 180 mm 300 mm H KM 11 G=2,1 kg KM 14 G=3,1 kg KM 17 G=5,3 kg KM 33 G =2,5 kg Rz25 119 104. ±0.1 M4 119 104. 7.1 M4 7.1 Bohrrille 36 128 200 38±0. 30.5 11 16 38±0. 16 11 M6 M10 300 38±0 38±0. 51 42 38±0 6.6 112±0.1 28 10 KM 23

KM-17

Abstract: Ebenheit diode kg 1015
Contextual Info: SCR / Diode Modules Presspacks Stacks Outlines Accessories Explanations 52 KM 10 ca. 80 44 20 6 125 80 5.3 4.2 35 10 20 6.2 11 135 80±0.1 KM 11 KM 14 KM 17 KM 18 H = 120 mm H = 180 mm H = 300 mm H = 500 mm 5.3 Rz25 96 101.5 110 125 13 15.2 4.2 100±0.8 in diesem Bereich Rz10

EUPEC km 17

Contextual Info: SCR / Diode Modules Presspacks Stacks Outlines Accessories Explanations 52 KM 10 ca. 80 44 20 6 125 80 5.3 4.2 35 10 20 6.2 11 135 80±0.1 KM 11 KM 14 KM 17 KM 18 H = 120 mm H = 180 mm H = 300 mm H = 500 mm 5.3 Rz25 96 101.5 110 125 13 15.2 4.2 100±0.8 in diesem Bereich Rz10

rectifier diode 20 amp 800 volt

Abstract: 80 Amp current 100 volt diode 50 Amp 300 volt diode alternator diode 65 amp alternator diode RZ3524C rectifier diode pressfit zener alternator rectifier 400 amp 20 volt rectifier RZ2524C
Contextual Info: RZ2524C/A - 25 Amp RZ3524C/A - 35 Amp RZ5024C/A - 50 Amp Rectifier/Zener Automotive Alternator Diode Data Sheet Anode Base Suffix "A" Cathode Base Suffix "C" Features * Epi Layer for tight control of parameters * Silicon oxide passivation for superior junction protection

alternator rectifier

Abstract: 100 Amp current 800 volt diode SCD0861-1 RZ2538A RZ2538C RZ3538A RZ3538C RZ5038A RZ5038C
Contextual Info: RZ2538C/A - 25 Amp RZ3538C/A - 35 Amp RZ5038C/A - 50 Amp Rectifier/Zener Automotive Alternator Diode Data Sheet Anode Base Suffix "A" Cathode Base Suffix "C" Features * Epi Layer for tight control of parameters * Silicon oxide passivation for superior junction protection

M5 DIODE

Abstract: DIODE M5 KM18 Ebenheit
Contextual Info: KM 11 KM 14 KM 17 KM 18 G = 2,1 kg G = 3,1 kg G = 5,3 kg G = 8,8 kg KM 33 G = 2,5 kg 37 38 M5 M4 80 5.3 148 2 80 50 54 5.3 15 146 3) 32 Rz25 2.5 1.8 128 136 in diesem Bereich Rz10 Ebenheit 0.02 H 26 H = 120 mm H = 180 mm H = 300 mm H = 500 mm 5 156 96 101.5

Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment

RELAY RZ2 h12

Abstract: RELAY RZ2 G12 transistor k72 t8 transistor bipolar k72 65 k82 TZ62 rz24 relay K117 datasheet rz2 d12 relay k6f y2
Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment

Contextual Info: CONTACT CUSTOMER SERVICE CALL 512-863-5585 x6464 The RZ family of high-density, board-to-board or flex circuit stacking applications is unique, offering users a reliable one-piece contact system. Its solder-less interconnect is compressed or “sandwiched” under pressure between parallel

MPC8245

Abstract: AN2128 LZU200 LZU266 LZU300 LZU333 MPC8240 MPC8241 5056 4pin
Contextual Info: Freescale Semiconductor Application Note Document Number: AN2128 Rev. 5, 10/2006 MPC8240 and MPC8245: Comparison and Compatibility by Esther C. Alexander RISC Application Freescale Semiconductor, Inc. Austin, TX This document compares functional and hardware aspects of

MIL-P-13949

Contextual Info: CONTACT CUSTOMER SERVICE CALL 512-863-5585 x6464 The RZ family of high-density, board-to-board or flex circuit stacking applications is unique, offering users a reliable onepiece contact system. Its solder-less interconnect is compressed or “sandwiched” under pressure between parallel

13949

Abstract: MIL-P-13949
Contextual Info: CONTACT CUSTOMER SERVICE CALL 512-863-5585 x6464 The RZ family of high-density, board-to-board or flex circuit stacking applications is unique, offering users a reliable one-piece contact system. Its solder-less interconnect is compressed or “sandwiched” under pressure between parallel

alpha date code System

Abstract: RZ26 RZ25 eb64 UV-prom
Contextual Info: Alpha Motherboards Software Developer’s Kit and Firmware Update Read Me First Order Number: EC–QERSH–TE Revision/Update Information: This is a revised document. It supersedes the Alpha Motherboards Software Developer’s Kit and Firmware Update Read Me First, EC–QERSG–TE.

MPC8240

Abstract: MPC8245 LZU266 LZU300 PLL 566 motorola 352 transistor
Contextual Info: Order Number: AN2128/D Rev. 0, 4/2001 Semiconductor Products Sector APPLICATION NOTE MPC8240 and MPC8245: Comparison and Compatibility Esther C. Epiphane RISC Application risc10@email.sps.mot.com This document compares functional and hardware aspects of the MPC8240 with that of the MPC8245. It

G547

Abstract: A-LFT-1448 SAE-16 A-LFT-1208 6RZ10 PAF16P10SY2 S20 K25 tube az1 KM10 SKB 12/08
Contextual Info: ST Tank-Mounted Suction Filter 20 gpm 75 L/min OPTIONAL DIRT ALARM OR ELECTRIC SWITCH 4.06 MAX. 103 OUT OUT .12 (3) THICK GASKET 1.88 (48) 6.25 MAX. (159) 45° TYP .44 (11) Ø ON A 6.25 (159) Ø B.C. (4) MOUNTING HOLES 6.38 PORT TO PORT (162) 1K = 8.81 (224)

kda w4

Abstract: 113006 k117 GR transistor k42 THP80 BIPOLAR MOTOROLA k70 RELAY RZ2 G12 msap TBC f54 transistor bipolar k72
Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment

RELAY RZ2 G12

Abstract: rz2 d12 relay RMX911 RELAY RZ2 h12 tr/RELAY RZ2 G12 6F8H RM20 50/RELAY RZ2 h12 din en iso 10664 PTF 10107
Contextual Info: DS3161/DS3162/DS3163/DS3164 Single/Dual/Triple/Quad ATM/Packet PHYs for DS3/E3/STS-1 www.maxim-ic.com FUNCTIONAL DIAGRAM GENERAL DESCRIPTION DS3/E3 LINE INTERFACE APPLICATIONS Access Concentrators SONET/SDH ADM SONET/SDH Muxes PBXs Digital Cross Connect Test Equipment

kuka

Abstract: kd202 GEZ DIODE D5014 KA206 KA204 THY H 75 B 80 GEZ 44 A diode T5726 KE02
Contextual Info: kuka-2006-de-inhalt.qxd 07.02.2006 12:17 Uhr Seite 70 Outlines Heatsinks May 2006 01 K 1.1 - M 12 G = 0,635 kg K 0.55 - FB 54 - A G = 1,760 kg K0.55 - M 12 K0.55 - M 24 x 1,5 G = 1,760 kg G = 1,760 kg 113 11 15 M8 39 135 135 2 39 2 100 96 1 25 120 50 M24x1.5

M24X1

Abstract: KM10 K055 FB54-A Ebenheit K055-M24 KM18
Contextual Info: 113 11 15 2 39 M8 135 50 36 120 M6 36 100 50 68 ° 45 50 61 50 75 3xM8 M12 alternative 5xM8 75 120 90 G = 9kg 50 135 M24x1.5 M12 5xM8 39 2 100 96 1 25 36 K1.1-M 12 G = 0,635kg 36 K0.55-FB54-A K0.55-M24x1.5 K0.55-M12 G = 1,760kg 100 G = 1,76 kg G = 1,760kg

Contextual Info: CONTACT CUSTOMER SERVICE CALL 512-863-5585 x6464 DIMENSIONS VERTICAL COMPRESSION Z-AXIS , OPEN-PIN FIELD A high-density, open-field, vertically-compressed connector utilizing a patented z-axis contact system configured for between-board (board-toboard) compression applications.

transistor SMD k72

Abstract: transistor kA2 smd smd k72 smd K2F JCA Technology low noise amplifier smd k77 k5d transistor smd smd k7a RELAY RZ2 G12 KE6 smd
Contextual Info: DS3181/DS3182/DS3183/DS3184 Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU www.maxim-ic.com The DS3181, DS3182, DS3183, and DS3184 DS318x integrate ATM cell/HDLC packet processor(s) with a DS3/E3 framer(s) and LIU(s) to map/demap ATM cells or packets into as many as

RELAY RZ2 g24

Abstract: marking code je8 RZ2 G24 rz2 h24 transistor bipolar k72 6bc6 rz2 d12 relay k117 GR transistor k42 RELAY RZ2 D12
Contextual Info: DS3166/DS3168/DS31612 6/8/12 ATM/Packet PHYs for DS3/E3/CC52 www.maxim-ic.com FEATURES 6 DS3166 , 8 (DS3168), or 12 (DS31612) ATM/Packet PHYs for DS3, E3, or Clear-Channel Up to 52Mbps Each Port Independently Configurable Interfaces to LIUs or SONET/SDH Devices

TRANSISTOR sync 7580

Abstract: LZU200 LZU266 LZU300 LZU333 MPC8240 MPC8241 MPC8245 5551c
Contextual Info: Application Note AN2128/D Rev. 4, 3/2002 MPC8240 and MPC8245: Comparison and Compatibility Esther C. Epiphane RISC Applications risc10@email. sps.mot.com This document compares functional and hardware aspects of the MPC8240 with that of the MPC8245. It covers the following topics:

transistor SMD K72

Abstract: smd k7a transistor smd k5c k5d transistor smd ka6 transistor smd Y5 smd transistor smd k77 104 k7c rz2 d12 relay K5C capacitor
Contextual Info: DS3181/DS3182/DS3183/DS3184 Single/Dual/Triple/Quad ATM/Packet PHYs with Built-In LIU www.maxim-ic.com The DS3181, DS3182, DS3183, and DS3184 DS318x integrate ATM cell/HDLC packet processor(s) with a DS3/E3 framer(s) and LIU(s) to map/demap ATM cells or packets into as many as