ROBINSON NUGENT 2.0 MM Search Results

Contextual Info: Robinson 2mm Headers /Musent — 2mm Headers, Dual Row P2 Series * * * 9 * * * * High temp, surface mount compatible 2mm pin-to-pin and row-to-row spacing Vertical or right angle through hole product Right angle insulator design with ribs stabilizes connector on PCB

Contextual Info: DIMMPAK Robinson Nuaent — How to Order 8 Byte DIMM Sockets DIMS Series 5.0 volts Synch DRAM DIMS — 168 B SD 5 — TR Product S eries:. -Voltage Option 5 = 5.0 Volts Assembly Configuration: B = Single Row j£ 7 | RN DIMMPAK Plating Code: Specify TR

Contextual Info: HIGH DENSITY Dual Read Out DIMM Sockets 4 DIMS Series 9 Superior shock and vibration performance • User friendly ejector system for easy module removal * High temp material compatible with IR processes How to Order DIMS Series DIMS — XXX — A 5 — R 1 — TR

Contextual Info: DS 1250Y/AB DALLAS DS1250Y/AB 4096K Nonvolatile SRAM SEMICONDUCTOR PIN ASSIGNMENT FEATURES • 10 years minimum data retention in the absence of external power Vcc A15 • Data is automatically protected during power loss A17 • Directly replaces 512K x 8 volatile static RAM

32-PIN

Abstract: 34-PIN DS1250 DS1250AB DS1250Y al229
Contextual Info: D S 1250Y /A B DALLAS DS1250Y/AB 4096K Nonvolatile SRAM s e m ic o n d u c to r FEATURES PIN ASSIGNMENT • 10 years minimum data retention in the absence of external power Vcc • Data is automatically protected during power loss A15 A17 • Directly replaces 512K x 8 volatile static RAM

DS1245V

Contextual Info: DS 1245Y/A B DALLAS DS1245Y/AB 1024K Nonvolatile SRAM SEMICONDUCTOR FEATURES PIN ASSIGNMENT • 10 years minimum data retention in the absence of external power • Data is automatically protected during power loss NC 1 1 A16 A14 • DIP-package devices directly replace 128K x 8 vola­

DALLAS SEMICONDUCTOR Ds1230

Abstract: dallas ds1230 EEPROM 28256 1230Y 34-PIN DS1230 DS1230AB DS1230Y CI 0740 LV 2.8 DS1230Y-150 DALLAS
Contextual Info: DS 1230Y/A B DALLAS DS1230Y/AB SEM ICON DUCTOR FEATURES 256K Nonvolatile SRAM PIN ASSIGNMENT • 10 years minimum data retention in the absence of external power A14 I1 1 • Data is automatically protected during power loss A12 I1 A7 I1 A6 I1 A5 I1 A4 I1

DS1245V

Abstract: 32-PIN 34-PIN DS1245 DS1245AB DS1245Y DS1243AB-100
Contextual Info: D S 1245Y /A B DALLAS s e m ic o n d u c t o r DS1245Y/AB 1024K Nonvolatile SRAM FEATURES PIN ASSIGNM ENT * 1 0 years minimum data retention in the absence of external power 1 1 NC A16 • Data is automatically protected during power loss Í A14 • Dl P-package devices directly replace 128K x 8 vola­

nema 23 stepping motor pin out

Abstract: BERG 65043-032 optocoupler with encoder for speed control MD-CC100-000 nema 24 stepping motor nema 23 stepping motor IDS-C10PK-TR berg electronics 65039-032 BERG STRIP 40*2 Nema 23
Contextual Info: TM FEATURES • • • • • • • • • • • • • Integrated Microstepping Drive/NEMA 23 Motor +12 to +48 or +24 to +75 VDC Input Voltage Low Cost Extremely Compact Optically Isolated Logic Inputs Automatic Current Reduction Configurable: - Motor Run/Hold Current

Contextual Info: DS1745Y DALLAS SEMICONDUCTOR DS1745Y 3-Volt Partitionable 1024K NV SRAM FEATURES PIN ASSIGNMENT • 10 years minimum data retention in the absence of external power • Data is automatically protected during power loss NC | 1 321 A16 1 2 311 I A15 A14 1 3

32-RN

Abstract: 34-PIN
Contextual Info: DS1750Y DALLAS DS1750Y 3-Volt Partitionable 4096K NV SR A M SEMICONDUCTOR FEA TU RES PIN ASSIGNMENT • 10 years minimum data retention in the absence of external power • Data is automatically protected during power loss • Directly replaces 512K x 8 volatile static RAM

EEPROM 28256

Abstract: smt LDR 34-PIN
Contextual Info: DS1730Y DALLAS SEMICONDUCTOR DS1730Y 3-V olt Partitionable 256K NV SRAM PIN ASSIGNM ENT FEATURES • 10 years minimum data retention in the absence of external power v cc WE • Data is automatically protected during power loss A13 • Directly replaces 32K x 8 volatile static RAM or

pfo 131

Abstract: smt LDR 32-PIN 34-PIN 2BL4
Contextual Info: DS1745Y DALLAS DS1745Y 3-Volt Partitionable 1024K NV SRAM SEMICONDUCTOR FEATURES PIN ASSIGNMENT • 10 years minimum data retention in the absence of external power Vcc A15 • Data is automatically protected during power loss NC WE • Directly replaces 128K x 8 volatile static RAM

5bl41

Contextual Info: DS1730Y DALLAS SEMICONDUCTOR DS1730Y 3-V olt Partitionable 256K NV SRAM FEATURES PIN ASSIGNMENT • 10 years minimum data retention in the absence of external power • Data is automatically protected during power loss • Directly replaces 32K x 8 volatile static RAM or

Contextual Info: DS1650Y/AB DALLAS SEMICONDUCTOR DS1650Y/AB Partitionable 4096K NV SRAM PIN ASSIGNMENT FEATURES •10 years minimum data retention in the absence of external power A 18 I| 1 32 1 A 16 I1 2 31 % A 14 11 3 3 0 1 A 17 A 12 I1 4 291 W E A 7 I1 5 2 8 1 A 13 A 6

Contextual Info: DS1750Y DALLAS SEMICONDUCTOR DS1750Y 3-Volt Partitionable 4096K NV SRAM FEATURES PIN ASSIGNMENT • 10 years minimum data retention in the absence of external power A18 I| 1 321 A16 I1 311 A15 • Data is automatically protected during power loss A14 I1 301

Contextual Info: DS1645Y/AB DALLAS SEMICONDUCTOR DS1645Y/AB Partitionable 1024K NV SRAM FEATURES PIN ASSIGNMENT • 10 years minimum data retention in the absence of external power • Data is automatically protected during power loss • Directly replaces 128K x 8 volatile static RAM

ppga package

Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

PQFP 132 PACKAGE DIMENSION intel

Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

asm56300

Abstract: CS4215 DSP56002 DSP56300 DSP56302 MC145407 MC34164 MCM6306 evm30xw IC Module SCHEMATIC chip
Contextual Info: DSP56302EVM User’s Manual Motorola, Incorporated Semiconductor Products Sector DSP Division 6501 William Cannon Drive West Austin, TX 78735-8598 Order this document by: DSP56302EVMUM/AD Introduction This document supports the DSP56302 Evaluation Module DSP56302EVM

NSH-14DB

Abstract: c33740 motorola assembler NOMEX TYPE EVM56303 MCM6306 BL01RN1-A62 Radix-3 FFT CS4215 DSP56300
Contextual Info: DSP56303EVM User’s Manual Rev. 2 Motorola, Incorporated Semiconductor Products Sector DSP Division 6501 William Cannon Drive West Austin, TX 78735-8598 Order this document by: DSP56303EMUM/AD Introduction This document supports the DSP56303 Evaluation Module DSP56303EVM including a

GRM40cog

Abstract: NRC12RF1001TR mex c122 PCS1475CT IN4001 diode C-15 DSP56307 IN6050 miniature 2.1mm DC power jack connector dsp56002 boot
Contextual Info: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. Order this document by DSP56307EVMUM/D Rev. 1.8, 3/1999 DSP56307EVM User’s Manual Motorola, Incorporated Semiconductor Products Sector 6501 William Cannon Drive West Austin TX 78735-8598 For More Information On This Product,

str 6756 diagram

Abstract: D313 base connections STR 6756 C-15 C-16 DSP56603 DSP56303 users manual hp printer board schematic cannon diode asr c70 str 6756 details
Contextual Info: DSP56603EVM User’s Manual Motorola, Incorporated Semiconductor Products Sector DSP Division 6501 William Cannon Drive West Austin, TX 78735-8598 This document and other documents can be viewed on the World Wide Web at http://www.motorola-dsp.com. OnCE is a trademark of Motorola, Inc.

EVM56303

Abstract: CS4215 DSP56002 DSP56300 DSP56302 DSP56303 DSP56303EVM MC145407 MCM6306 dsp56002 boot
Contextual Info: DSP56303EVM User’s Manual Motorola, Incorporated Semiconductor Products Sector DSP Division 6501 William Cannon Drive West Austin, TX 78735-8598 Order this document by: DSP56303EVMUM/AD Introduction This document supports the DSP56303 Evaluation Module DSP56303EVM