RLDRAM3 Search Results

MT44K32M36

Contextual Info: 1Gb: x18, x36 TwinDie RLDRAM 3 Features TwinDie RLDRAM 3 MT44K64M18 – 2 Meg x 18 x 16 Banks x 2 Ranks MT44K32M36 – 2 Meg x 36 x 16 Banks Features Options Marking • 168-ball FBGA package – 1.25ns and tRC MIN = 10ns (RL3-1600) – 1.25ns and tRC (MIN) = 12ns

QSFP28 I2C

Contextual Info: Arria 10 Device Overview 2013.09.04 AIB-01023 Subscribe Feedback Altera’s Arria FPGAs and SoCs deliver optimal performance and power efficiency in the midrange. By using TSMC's 20-nm process technology on a high-performance architecture, Arria 10 FPGAs and SoCs

MT44K32M36

Abstract: zq 405-MF
Contextual Info: 1.125Gb: x18, x36 TwinDie RLDRAM 3 Features TwinDie RLDRAM 3 MT44K64M18 – 2 Meg x 18 x 16 Banks x 2 Ranks MT44K32M36 – 2 Meg x 36 x 16 Banks Features Options Marking • 168-ball FBGA package – 1.07ns and tRC MIN = 8ns (RL3-1866) – 1.07ns and tRC (MIN) = 10ns

RLDRAM3

Abstract: IS49RL18320 168-FBGA RLDRAM
Contextual Info: 576Mb: x18, x36 RLDRAM 3 Features RLDRAM 3 IS49RL18320 – 2 Meg x 18 x 16 Banks IS49RL36160 – 1 Meg x 36 x 16 Banks Features • 1066 MHz DDR operation 2133 Mb/s/ball data rate • 76.8 Gb/s peak bandwidth (x36 at 1066 MHz clock frequency) • Organization

Contextual Info: ACX-KIT-HD1000-100G Development Kit User Guide UG034, March 11, 2014 UG034, March 11, 2014 1 Copyright Info Copyright 2014 Achronix Semiconductor Corporation. All rights reserved. Achronix is a trademark and Speedster is a registered trademark of Achronix Semiconductor Corporation.

MICRON BGA PART MARKING

Abstract: RTT120 MT44K64M18 MT44K RLDRAM 3 MT44K32M36
Contextual Info: 1Gb: x18, x36 TwinDie RLDRAM 3 Features TwinDie RLDRAM 3 MT44K64M18 – 2 Meg x 18 x 16 Banks x 2 Ranks MT44K32M36 – 2 Meg x 36 x 16 Banks Features Options Marking • 168-ball FBGA package – 1.25ns and tRCmin = 10ns RL3-1600 – 1.25ns and tRCmin = 12ns (RL3-1600)

MICRON BGA PART MARKING

Abstract: MT44K64M18 MT44K32M36 RTT120 micron power 120w MT44K
Contextual Info: 1Gb: x18, x36 TwinDie RLDRAM 3 Features TwinDie RLDRAM 3 MT44K64M18 – 2 Meg x 18 x 16 Banks x 2 Ranks MT44K32M36 – 2 Meg x 36 x 16 Banks Features Options Marking • 168-ball FBGA package – 1.25ns and tRCmin = 10ns RL3-1600 – 1.25ns and tRCmin = 12ns (RL3-1600)

MICRON BGA PART MARKING

Abstract: MT44K32M36 MT44K32M36RCT
Contextual Info: 1Gb: x18, x36 TwinDie RLDRAM 3 - Bittware Addendum Features TwinDie RLDRAM 3 - Addendum MT44K64M18 – 2 Meg x 18 x 16 Banks x 2 Ranks MT44K32M36 – 2 Meg x 36 x 16 Banks Features Options Marking • 168-ball FBGA package – 1.25ns and tRC MIN = 10ns

Contextual Info: 7 Series FPGAs SelectIO Resources User Guide UG471 v1.3 October 31, 2012 The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

Achronix Semiconductor

Abstract: ACX-KIT-HD1000-100G
Contextual Info: PRODUCT BRIEF HD1000 Development Kit HD1000 DEV KIT HIGHLIGHTS Development Board Features • HD1000 22-nm FPGA see below for FPGA details • CFP cage for 100GE line interface –– Adaptable to 2x40GE or 10x10GE • Interlaken interface (AirMax connector pair)