REFLOW PROFILE 245 Search Results

Contextual Info: 1000BASE-T LOW PROFILE MAGNETICS MODULE Designed to Support 1:1 Turns Ratio Transceivers RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C° Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard

Contextual Info: 1000BASE-T LOW PROFILE MAGNETICS MODULE Designed to Support 1:1 Turns Ratio Transceivers RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C° Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard

0501b

Contextual Info: Pb-Free Assembly Reflow Profile AP NOTE: 0501B Page 1 of 2 Figure 5-1 Classification Reflow Profile FREQUENCY CONTROLS, INC. 357 Beloit Street, P.O. Box 457, Burlington, WI 53105-0457 U.S.A. Phone 262/763-3591 FAX 262/763-2881 Email: nelsales@nelfc.com www.nelfc.com

J-STD-020-C

Abstract: J-STD-020C JEDEC J-STD-020c 020C reflow profile JSTD020C JEDEC wave reflow profile 245
Contextual Info: Lead-Free Reflow Profile Recommendation IPC/JEDEC J-STD-020C Reflow Parameter Minimum preheat temperature (TsMIN) Maximum preheat temperature (TsMAX) Preheat time TsMAX to TL ramp-up rate Time above temperature TL (tL ) Peak temperature (TP) Time 25 °C to TP

Contextual Info: 1000Base-T Low Profile Magnetics Module Designed to Support 1:1 Turns Ratios Receivers RoHS-6 peak reflow temperature rating 245°C Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard Electrical Specifications @ 25°C - Operating Temperature 0°C to 70°C

Contextual Info: AN0333 APPLICATION NOTE 0333 REFLOW SOLDER PROFILE RECOMMENDATION Introduction This application note provides guidelines for Diodes semiconductor packages relating to: • the board mounting • recommended reflow solder profiles This guideline based on IPC/JEDEC J-STD-020D.1 March 2008.

pe69012t

Abstract: H0022 H0001 H0002 H0009 H0013 H0019 H0020 H0025 PE-69012
Contextual Info: 10/100 PC CARD LAN MAGNETICS MODULES RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C Low profile packages from .094” 2,39mm to .078” (1,98mm) for PC card and cardbus applications Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C

H5019NL

Abstract: B402 D-71083 H5019NLT H5019
Contextual Info: 1000BASE-T LOW PROFILE MAGNETICS MODULE Designed to Support 1:1 Turns Ratio Transceivers RoHS-6 peak reflow temperature rating 245°C° Low profile package for mobile computer applications Compliant with IEEE 802.3ab standard Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C

Contextual Info: 10/100 PC CARD LAN MAGNETICS MODULES RoHS-5 peak reflow temperature rating 235°C RoHS-6 peak reflow temperature rating 245°C Low profile packages from .094” 2,39mm to .078” (1,98mm) for PC card and cardbus applications Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C

Pb and Pb-free Reflow Soldering Temperature Profiles

Abstract: TB493 JEP-140
Contextual Info: Technical Brief 493 Sn/Pb and Pb-free Reflow Soldering Temperature Profiles TABLE 1. REFLOW PROFILES PROFILE FEATURE SN-PB EUTECTIC ASSEMBLY PB-FREE ASSEMBLY Temperature Min TSMIN 100°C 150°C Temperature Max (TSMAX) 150°C 200°C Preheat/Soak Time (tS) from (TSMIN to TSMAX)

BGA reflow guide

Abstract: pcb warpage* in smt reflow pcb warpage in ipc standard JEDEC SMT reflow profile 324 bga thermal reballing lattice pb-free lattice pb-free products reballing bga
Contextual Info: Solder Reflow Guide for Surface Mount Devices November 2010 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which

H7137NL

Abstract: H7029NL HX7028NL H7137NLT H7019NL MX4C H7037NL H7028NL H7137 HX7028
Contextual Info: 10GBase-T Magnetics Modules Designed to Support 10GBase-T Transceivers Compliant with IEEE 802.3 standard Qualified with top 10Gig PHY Manufacturer RoHS peak reflow temperature rating: 245°C Low profile package for PCI Express Fine-tune magnetics to specific PHY vendors

UT21643S

Abstract: umec
Contextual Info: ISDN S- INTERFACE DUAL TRANSFORMERS/MODULES SMALLEST SMT PACKAGE •Meets CCITT I.430 pulse waveform template and impedance Profile •Excellent longitudinal balance •For RoHS Compliant is designed for reflow soldering at temperature 245oC +0oC/-5oC •Operating temperature range 00C to +700C

H7008NL

Abstract: mx121 H7800NL H7009
Contextual Info: 10GBASE-T MAGNETICS MODULES Designed to Support 10GBASE-T Transceivers Compliant with IEEE 802.3 standard Qualified with top 10Gig PHY Manufacturers RoHS peak reflow temperature rating 245°C Low profile package for PCI Express Fine-tuned magnetics to specific PHY vendors

H7001NL

Abstract: MX315
Contextual Info: 10GBASE-T MAGNETICS MODULE Designed to Support 10GBase-T Transceivers Compliant with IEEE 802.3 standard Qualified with top 10Gig PHY Manufacturers RoHS peak reflow temperature rating 245°C° Low profile package for PCI Express Fine-tuned magnetics to specific PHY vendors

c210q

Contextual Info: RF TRANSFORMER Low Profile Transformer for Wideband RF Applications Miniature surface mount package Under .098” tall; meets PCMCIA requirements Excellent insertion loss RoHS peak reflow temperature rating: 245°C Electrical Specifications @ 25°C — Operating Temperature -40°C to +85°C

ET 7806

Abstract: cw 7806
Contextual Info: T1/CEPT/ISDN-PRI TRANSFORMERS Quad Port SMT Transformer Modules with IC Side Protection RoHS peak reflow temperature rating 245°C Eight transformers in a low profile surface mount package Includes IC Side Protection Circuit on each channel to suppress low voltage transients

Capacitors

Contextual Info: Surface Mount Aluminum Electrolytic Capacitors FEATURES • • • • NAWR Series SAC Alloy Compatible 245°C CYLINDRICAL V-CHIP CONSTRUCTION FOR SURFACE MOUNTING LOW PROFILE 4.6MM HEIGHT LOAD LIFE 2,000 ~ 3,000 HOURS @ +105°C DESIGNED FOR AUTOMATIC MOUNTING AND REFLOW SOLDERING

transforme

Abstract: IC MANUFACTURERS CHINA T5008NL
Contextual Info: ISDN S-Interface Low Profile Dual SMT Transformers RoHS peak reflow temperature rating 245�C Meets pulse waveform template of CCITT I.430 when recommended transformer and chip pair are used Excellent longitudinal balance 2 kVrms isolation voltage Available in Tape & Reel or tube packaging

J-STD-020E

Contextual Info: VLMP23. www.vishay.com Vishay Semiconductors Mini SMD LED FEATURES • SMD LEDs with exceptional brightness • Luminous intensity categorized • Compatible with automatic placement equipment • IR reflow soldering • Available in 8 mm tape • Low profile package

EIA-481-A

Abstract: DHS8S MIL-STD-202f 213B g11 epoxy glass dhs4s DHS10 UL94Vo
Contextual Info: DHS SERIES 1/2 PITCH SPST SURFACE MOUNT DIP SWITCHES FEATURES Ultra-compact low-profile size. .050" 1.27mm terminal spacing. Self-cleaning twin point contacts. Auto-insertable and reflow solderable. Process compatible with std'd. tape seal. GENERAL SPECIFICATIONS

E55361

Abstract: HCPL-0452 HCPL-0453 HCPL-4502 HCPL-4503 HCPL-M452 HCPL-M453 MO-155
Contextual Info: Small Outline, 5 Lead, High Speed Optocouplers Technical Data HCPL-M452 HCPL-M453 Features Description • Surface Mountable • Very Small, Low Profile JEDEC Registered Package Outline • Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes

Contextual Info: VLME2302 Vishay Semiconductors Standard Mini SMD LED FEATURES • SMD LEDs with exceptional brightness • Luminous intensity categorized • Compatible with automatic placement equipment • IR reflow soldering • Available in 8 mm tape • Low profile package

VISHAY Bar code label

Contextual Info: VLME2302 Vishay Semiconductors Standard Mini SMD LED FEATURES • SMD LEDs with exceptional brightness • Luminous intensity categorized • Compatible with automatic placement equipment • IR reflow soldering • Available in 8 mm tape • Low profile package