RBA Q16 Search Results

RIA Q20

Contextual Info: resistors R X A isolated resistor networks EU features • • • • dimensions and construction Dimensions inches (mm) L W p .193 .236 .025 (4.90) (5.99) (0.635) .341 .236 .025 (8.66) (5.99) (0.635) Size Code Q16 L Bonding Wire Q20 Q24 .341 (8.66) .236

rba q16

Abstract: 12w sot-23 MIL-R-55342 sot-23 12w rba q20
Contextual Info: bussed resistor networks KOA’s thin film termination networks provide the ideal solution for demanding high speed/high frequency data applications by offering high performance while reducing cost and saving space. Compared to thick film networks, these thin film resistors provide reliability and stability

rba q16

Abstract: rba q20 sot 23 W16 rba sot 23 W16 sot 23
Contextual Info: bussed resistor networks KOA’s thin film termination networks provide the ideal solution for demanding high speed/high frequency data applications by offering high performance while reducing cost and saving space. Compared to thick film networks, these thin film resistors provide reliability and stability

Contextual Info: R X A resistors isolated resistor networks EU features • • • • Thin film on silicon Electrical and mechanical stability High integration (up to 12 terminating lines per package) Products with lead-free terminations meet EU RoHS and China RoHS requirements

Contextual Info: resistors R X A isolated resistor networks EU features • • • • dimensions and construction Q20 Dimensions inches (mm) L W p .193 .236 .025 (4.90) (5.99) (0.635) .341 .236 .025 (8.66) (5.99) (0.635) Q24 .341 (8.66) .236 (5.99) .025 (0.635) Q28 .39 (9.9)

W16 sot 23

Abstract: rza series 51 ria 40 rba sot 23 sot 23 W16 Q-16
Contextual Info: R X A resistors isolated resistor networks features • • • • Thin film on silicon Electrical and mechanical stability High integration (up to 12 terminating lines per package) Products with lead-free terminations meet RoHS requirements applications

RIA Q16

Contextual Info: R X A resistors isolated resistor networks features • • • • Thin film on silicon Electrical and mechanical stability High integration (up to 12 terminating lines per package) Products with lead-free terminations meet RoHS requirements applications

rba q16

Abstract: rza series
Contextual Info: resistors R X A isolated resistor networks EU features • • • • Thin film on silicon Electrical and mechanical stability High integration Products with lead-free terminations meet EU RoHS and China RoHS requirements applications • Series termination

RIA Q16

Abstract: RIA N08
Contextual Info: R X A resistors isolated resistor networks features • Thin film on silicon • Electrical and mechanical stability • High integration (up to 12 terminating lines per package) applications • Series termination • Pull-up/pull-down • Current limiting

Contextual Info: R X A resistors isolated resistor networks features • Thin film on silicon • Electrical and mechanical stability • High integration (up to 12 terminating lines per package) applications • Series termination • Pull-up/pull-down • Current limiting

rza series

Abstract: appendix T16 KOA A-1002B RIA Q16
Contextual Info: 1733 Reader's Spreads pg1-203:document 1/27/09 4:07 PM Page 80 R X A resistors isolated resistor networks EU features • • • • Thin film on silicon Electrical and mechanical stability High integration Products with lead-free terminations meet EU RoHS

Contextual Info: R X A resistors isolated resistor networks features • Thin film on silicon • Electrical and mechanical stability • High integration (up to 12 terminating lines per package) applications • Series termination • Pull-up/pull-down • Current limiting

rnx Q24

Contextual Info: RB X , RD(X), RT(X), RNX resistors integrated passive components EU features • Thin film (metal film) resistor array on silicon wafer • Excellent resistance matching, TCR tracking and stabilities • Custom circuits are available with flexible layout (Different

Contextual Info: NETWORKS KOA´S INTEGRATED PASSIVE COMPONENTS 3 THIN FILM ON SILICON TFOS KPC STRUCTURE 2 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 4 IDENTIFICATION Specifications given herein may be changed at any time without prior notice.

Contextual Info: RB X , RD(X), RT(X), RNX resistors integrated passive components EU features • Thin film (metal film) resistor array on silicon wafer • Excellent resistance matching, TCR tracking and stabilities • Custom circuits are available with flexible layout (Different

DNA 1002

Abstract: RNX W16 marking s14 sot23 KPC T16 DNA MARKING CODE KOA KPC T16 Packaging marking code 8 lead soic-n package analog devices MARKING W16 SOT23 CODE DIODE
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)

rnx w16

Abstract: 471j CAPACITOR w16 sot23 511j CAPACITOR KPC T16 12w SOT23-3 appendix T16 KOA KPC appendix KOA KPC T16
Contextual Info: 抵抗器 Resistors R/C NETWORKS KPC 表面実装形薄膜抵抗/コンデンサネットワーク KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire

DNA 1002

Abstract: rnx w16 dn5 marking packaging resistor MARKING W16 SOT23 rnx Q24 DN6 marking diode
Contextual Info: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)

TE-5001

Abstract: MARKING W16 SOT23 HBM W20 rnx w16 DNA 1002 TVC 2 HB IEEE resistor color code RDA Q20 W16 sot 23 acd marking code
Contextual Info: NETWORKS Resistors / capacitors / diodes 3 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC 2 1 STRUCTURE 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 4 IDENTIFICATION TYPE COATING COLOR MARKING

rnx w16

Contextual Info: KOA THIN FILM KOA's Integrated Passive Components SPEER ELECTRONICS, INC. General Description & Background Information These thin film passive components are designed for EMI/RFI filtering and impedance matching applications. The integrated passive components are produced using a silicon based technology that

Contextual Info: NETWORKS KPC EU RoHS 表面実装形薄膜抵抗ネットワークシリーズ KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire ③ ダイパッド Die pad

rnx Q24

Contextual Info: NETWORKS KPC EU RoHS 表面実装形薄膜抵抗ネットワークシリーズ KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire ③ ダイパッド Die pad

rnx Q24

Contextual Info: NETWORKS KPC EU RoHS 表面実装形薄膜抵抗ネットワークシリーズ KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire ③ ダイパッド Die pad

MD334

Abstract: quanta quanta computer hannstar quanta BL HSD150PK12 diode B8 ac2 cdi 100u 27p Z0301 470P-0402
Contextual Info: 5 D 4 Model REV ZW1L MB 3A 3 2 1 MODEL CHANGE LIST FIRST RELEASED. 3B Reference ECN E200305-3099 3C Reference ECN E200306-2080 ZW1L Page C B F ro m 1 3A 2 3A 3 3A 4 3A 5 3A 6 3A 7 3A 8 3A 9 3A 10 3A 11 3A 12 3A 13 3A 14 3A 15 3A 16 3A 17 3A 18 3A 19 3A 20