R008 Search Results

qml-38535

Abstract: CLC404
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED In accordance with N.O.R. 5962-R232-92. 92-07-09 M. A. FRYE In accordance with N.O.R. 5962-R235-93. 93-11-08 M. A FRYE In accordance with N.O.R. 5962-R008-95. 94-10-18 M. A. FRYE Make changes to SSBW and GFR tests as specified under table I.

SMD MARKING CODE S5B

Abstract: 5962-89710013A s8b marking code smd marking S5B SMD MARKING CODE S8B 5962-8971001XA qml-38535 5962-8971001xa datasheet ADG526ATE/883B smd marking code S8-A
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes in accordance with NOR 5962-R008-92. 91-10-18 M. A. Frye B Changes in footnotes at end of table I. Editorial changes throughout. 92-10-29 M. A. Frye C Update drawing to current requirements. Editorial changes throughout. – drw

TVSP8

Contextual Info: PACKAGE DIMENSIONS TVSP8 0~10° 2.9±0.1 1 0.55±0.1 4.0±0.2 5 2.8±0.1 8 4 +0.05 0.127-0.03 0.65 0.1±0.05 1.0MAX 0.475±0.1 0.08 0.2±0.05 0.05 M GD-R00802A-3 UNIT : mm Ver.2008-04-10

F-1192

Abstract: qml-38535
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes in accordance with NOR 5962-R329-97. 97-10-22 Monica L. Poelking B Changes in accordance with NOR 5962-R008-99. 98-10-22 Raymond L. Monnin C Update boilerplate to MIL-PRF-38535 and updated appendix A. Editorial

qml-38535

Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes in accordance with NOR 5962-R329-97. 97-10-22 Monica L. Poelking B Changes in accordance with NOR 5962-R008-99. 98-10-22 Raymond L. Monnin C Update boilerplate to MIL-PRF-38535 and updated appendix A. Editorial

ADG526ATE/883B

Abstract: SMD MARKING CODE S5B 5962-8971001XX marking code s7b SMD Transistor S7B marking code smd marking S5B SMD MARKING CODE S8B smd marking s7 S5B smd
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes in accordance with NOR 5962-R008-92 91-10-18 M. A. Frye B Changes in footnotes at the end of table I. Editorial changes throughout. 92-10-29 M. A. Frye THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

Contextual Info: WIRE-WOUND CHIP INDUCTORS AISC-0603, -0805 SERIES STANDARD SPECIFICATIONS Part Number L1,2 mH 2 AISC-0603-R0018K AISC-0603-R0033K AISC-0603-R0047K AISC-0603-R0056K AISC-0603-R0068K AISC-0603-R0082K AISC-0603-R010K AISC-0603-R012K AISC-0603-R015K AISC-0603-R018K

TVSP8

Contextual Info: パッケージ外形図 TVSP8 0~10° 2.9±0.1 1 0.55±0.1 4.0±0.2 5 2.8±0.1 8 4 +0.05 0.127-0.03 0.65 0.1±0.05 1.0M AX 0.475±0.1 0.08 0.2±0.05 0.05 M GD-R00802A-3 単位 : mm Ver.2008-04-10

MAX9032AKA

Abstract: PRBS223-1 SN74AHC1G08DCKR TPS2031D mpo multi mode mpo mtp connector
Contextual Info: o-microGiGaCN 4-Channel Optical Transceiver FUJITSU COMPONENT LIMITED Copyright 2010 FUJITSU COMPONENT LIMITED o-microGiGaCN™ Datasheet 2010.04.01 Rev. 1.0 o-microGiGaCN™ 4-Channel Optical Transceiver Part Number of Module: FPD-10*R008-0E Figure 1: Over view

qml-38535

Abstract: GDFP1-F10 TLE2061AM TLE2061M TLE2061MLB
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Add case outline letter "H". Delete outline letter "G”. Make change to 1.2.4, 1.3, table I, and figure 1. Make change to table IIC. In accordance with N.O.R. 5962-R008-94. 93-10-19 M. A. FRYE B Make change to 1.3, and supply current test as specified under

sdwl1608c

Abstract: SDWL1608 R0051 R0027 82* smd code R42-R47
Contextual Info: SMD CERAMIC WIRE-WOUND CHIP INDUCTORS AISC-0603-xxx RoHS Compliant FEATURES: • Ceramic construction assures the utmost thermal stability & high SRF • Exceptionally high Q compared to non-wirewound inductors, especially at high frequencies • Inductance options from 1.6nH to 560nH

HD64400

Abstract: SOLID STATE d2n 102 bg
Contextual Info: ADE-202-034 O Oct. 1989 HD64400 (Graphic Data Processor) GDP 0 HITACHI Description The HD64400 is a graphic data processing chip with high-speed drawing functions and an extensive set of display functions. It can control a wide range of raster-scan CRT displays, ranging from low to high resolution, and

Contextual Info: Current Sense Ultra Low Resistors ULCR Series Features: • • • • • RoHS Compliant and Halogen Free TCR as low as ±50ppm High Current capabilities up to 44.7A Resistance Range: 0.5mΩ to 10mΩ Operating Temperature Range: -55˚C to 170˚C Part Number Structure

Contextual Info: Current Sensing Chip Resistors NCSS Series FEATURES • • • • • SURFACE MOUNTABLE 0805, 1206, 2010 AND 2512 CASE SIZE LOW RESISTANCE METAL STRIP CONSTRUCTION PRECISON TOLERANCE ±1% TAPED & REEL PACKAGING FOR EASY PICK AND PLACE REFLOW COMPATIBLE

Contextual Info: Current Sensing Chip Resistors NCSR Series FEATURES • • • • • RoHS Compliant SURFACE MOUNTABLE 2512 CASE SIZE LOW RESISTANCE & LOW INDUCTANCE METAL STRIP CONSTRUCTION PRECISON TOLERANCE ±1% AND TCR (±50PPM) TO +170°C TAPED & REEL PACKAGING FOR EASY PICK AND PLACE)

Resistor R0075

Abstract: R0075 RESISTOR RCD Components resistor marking codes
Contextual Info: PRECISION LOW-OHM METAL PLATE RESISTORS RESISTORS CAPACITORS COILS DELAY LINES RCD LV3 LV3 SERIES - MOLDED 3-WATT LOR SERIES - CERAMIC 3- & 5-WATT OPTIONS 1.25” Typ ↓ ↑d ← A → 2nd pair of leads applies to Opt. 4T only B X X → ← Resis. Measurement Point

Contextual Info: Recommended P.C.B Loyout Componend Side 12.SO 2.00 difl Ep (Lp n CD NOTE: A. 0 2 0 1 R008 S_Q 20Z X (2522A X - 08 G D T -T) 1 1 1. Selective plating ’S 1 (G1T) —0 5 u ” select gold in c o n ta c t/ Min. 100u” tin in solder area ’S2(G2T) —Gold flash in contact a re a /

ceag ghg 122 3121

Abstract: ceag ghg 534 ceag ghg 534 2506 crouse-hinds GHG 960 663 B0708 CEAG PTB 00 ATEX 3108 ceag ghg 412 ceag ghg 543 ceag GHG 543 2306 Ex-92
Contextual Info: C A T A L O G U E E X P L O S I O N P R O T E C T E D 3 1 0 P R O D U C T S The CEAG Sicherheitstechnik GmbH factory in Eberbach, Germany The CEAG Nortem SA Barcelona, Spain The factory in Sheerness, UK CEAG SICHERHEITSTECHNIK GMBH Essentials, Innovations and a few words about your money

Minolta* cm 2002

Contextual Info: Technical Document LCD Specification LCD Group LQ030B7UB02 LCD Module Product Specification December 2009 Wide-QVGA, LED-backlit Transflective Portraitmode panel featuring a symmetrical viewing cone of 160° reflective mode . Module has 10% reflectivity and 15:1 contrast (reflective)

nec tokin oe 128

Abstract: MS-17171 MCP51M NEC Tokin od 108 c113 pc 100 3p3 nvidia c51mv PC017 MS17171 Athlon Neo X2 CM1616
Contextual Info: 5 4 3 MS-17171 Ver : 2.0 2 Processor 1 DDR2 Sodimm 0 AMD S1 638 pin uFCPGA 638 socket Battery Charger Page 6 DDR2 400 / 533 / 667 MHz Page 31 DDR2 Sodimm 1 Page 2,3,4,5 Battery select Page 6 Page 32 D D 16 X 16 Bit HyperTransport Link DRAM Power Page 33 North Bridge

Contextual Info: T PL IA N M CO *R oH S Features Applications • Mn/Cu alloy resistor ■ Power supplies ■ Power rating at 70 °C: 2 W, 3 W ■ Stepper motor drives ■ Inductance less than 5 nH ■ Battery packs ■ Low EMF ■ White goods ■ RoHS compliant* ■ Input amplifiers

Contextual Info: T PL IA N M CO *R oH S Features Applications • Mn/Cu alloy resistor ■ Power supplies ■ Power rating at 70 °C: 2 W, 3 W ■ Stepper motor drives ■ Inductance less than 5 nH ■ Battery packs ■ Low EMF ■ White goods ■ RoHS compliant* CRE2512 - High Power Current Sense Chip Resistor

R0056

Abstract: R0087 JK250 r047 R0051 R0075 R-037 R05151 R0-33
Contextual Info: SMD CERAMIC WIRE-WOUND CHIP INDUCTORS AISC-0603-xxx Pb RoHS Compliant 1.6 x 0.76 x 0.97mm | | | | | | | | | | | | | | | FEATURES: • Ceramic construction assures the utmost thermal stability & high SRF • Exceptionally high Q compared to non-wirewound inductors, especially at high frequencies

Contextual Info: Current Sensing Chip Resistors NCSS Series FEATURES • • • • • SURFACE MOUNTABLE 0805, 1206, 2010 AND 2512 CASE SIZE LOW RESISTANCE METAL STRIP CONSTRUCTION PRECISON TOLERANCE ±1% TAPED & REEL PACKAGING FOR EASY PICK AND PLACE REFLOW COMPATIBLE