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54122-809201650TLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch |
PDF
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54122-809201650LF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch |
PDF
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54242-808201650LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10127720-165GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, 160u\\ Matte Tin over 50u\\ Nickel plating, GW Compatible LCP, With Pegs, Tray Packing. |
PDF
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10127720-165GRLF
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Amphenol Communications Solutions
|
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, 160u\\ Matte Tin over 50u\\ Nickel plating, GW Compatible LCP, With Pegs, Tape and Reel. |
PDF
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