QUAD FLAT J-LEADED PACKAGE Search Results

Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS - XA Example: Philips 80C51 extended Architecture P51XA G3 7 K B A J Derivative Nam e- - — J ; Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) BD = Thin Quad Rat Pack (TQFP)

Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01

QFJ-32C-C01

Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01)

Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01

QFJ-44C-C01

Contextual Info: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01)

quad flat j-leaded package

Abstract: QFJ-44C-C01
Contextual Info: QUAD FLAT J-LEADED PACKAGE 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50mil Package width x package length 650 × 650mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01) 17.53±0.13SQ (.690±.005) +0.25

SM84PG-ACTEL

Abstract: A1240XL SM-10 SM68P-ACTEL SM160PQ-ACTEL SM132CQ-ACTEL A42MX36 1200XL SM176TQ-ACTEL A1010DXV
Contextual Info: Silicon Sculptor - Adapter Module Selector Guide Page 1 of 3 BACK Adapter Module Selector Guide Package Types: BG - Plastic Ball Grid Array CQ - Ceramic Quad Flat Pack PG - Ceramic Pin Grid Array PL - Plastic J-Leaded Chip Carrier Device Type A1010B A1010B

QFJ-32C-C01

Contextual Info: QUAD FLAT J-LEADED PACKAGE 32 PIN CERAMIC QFJ-32C-C01 Lead pitch 50mil Package width x package length 450 × 550mil Lead shape J bend Sealing method Cerdip 32-pin ceramic QFJ QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01) 3.44±0.35 (.135±.014) 2.11(.083)REF

Contextual Info: M _a cl t PIN N U M B ER REF. O N LY D E TA IL G / / 0.1 c 2.2 2.0 i /4\ | ^ | q.05Tc j FREESCALE SEMICONDUCTOR, ALL RIGHTS RESERVED. TITLE: n SEATING PLAN 0.05 DETAIL G INC. MECHANICAL OUTLINE POWER QUAD FLAT NON-LEADED PACKAGE PWR QFN 23 TERMINAL, 0.9 PITCH(1 2X12X2.1 )

52887

Abstract: 44 pins CQFPJ 81F64842B Qr Code young
Contextual Info: 28 pins CQFPJ Ceramic Quad Flat Pack J Leaded CQFPJ Package Outlines Code:QI Date: 17/04/97 Rev. B – 23-Aug-01 1 CQFLJ 44 pins CQFPJ Code:QL Date: 18/10/96 2 Rev. B – 23-Aug-01 52 pins CQFPJ Code:Q3 Date: 29/11/91 3 CQFLJ Rev. B – 23-Aug-01 CQFLJ 68 pins CQFPJ

p80c32

Abstract: p80c32 16 P80C52
Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P 8 X C X X X E B P N - T 0 = ROMLESS 5 = Bond-Out emulation 3 = ROM 7 = O T P -E P R O M 9 = FEEPROM (FLASH) J T T T , | | ] | j r Philips North America Package Code A = Plastic Leaded Chip Carrier (PLCC)

P80C32

Abstract: P80C52 ROMless P80C31 80C51 P-80C31 p80c32 16 p80c32 philips
Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line

Contextual Info: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: 5 3 7 9 = = = = = P8 X C X X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window)

footprint plcc 208

Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Contextual Info: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC

sqfp 14x20

Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
Contextual Info: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has

Contextual Info: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul­ tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.

motorola case 711-03

Contextual Info: General Release Specification — MC68HC05C4A Section 14. M echanical Specifications 14.1 Contents 14.2 Introduction. . 131 14.3 40-Pin Plastic Dual In-Line DIP Package (Case 711-03). . 132

Z8PE003PZ010SC

Abstract: 124 008r
Contextual Info: Packaging Product Specification PS007203-0101 ZiLOG Worldwide Headquarters • 910 E. Hamilton Avenue • Campbell, CA 95008 Telephone: 408.558.8500 • Fax: 408.558.8300 • www.ZiLOG.com This publication is subject to replacement by a later edition. To determine whether

Contextual Info: Sony Package Product Name . . Features P a c k a g e name D e s c r ip t io n Symbol Material* DUAL I I P «ifi* IN LI NK PACKAGE P 2. 54m m I10UMIL) C SINGLE IN L I N E S I P 2.54mm P ÍJ 0 0 M Í L ) PACKAGE 2.54mm ZIG ZAG Z Standard 1 P IN L I N E

16v8 PLD

Abstract: 48C101 7c63000a 7C128 2061A B1225 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 C = CMOS B = BiCMOS SUFFIX -45 D M B -70 S C -35 P C -15 J C -25 AS C -5 J C FAMILY CMOS SRAM - FAST

7C245

Abstract: b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128
Contextual Info: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW

p80c652ifp

Abstract: A11P p2U marking S87C652 p80c652
Contextual Info: Phlips Semiconductors Product spécification CMOS single-chip 8-bit microcontrollers PIN CONFIGURATIONS DESCRIPTION The P80C652/83C652 Single-Chip 8-Bit Microcontroller is manufactured in an advanced CMOS process and is a derivative of the 80C51 microcontroller family. The

LND150N8

Abstract: LND250K1 LNE150K1 MS-012AA H1 SOT-89 LND150
Contextual Info: Package Outlines 0.770 +0.005 –0.010 ΦD 0.285 ± 0.015 0.065 ± 0.015 F A Seating Plane 0.040 ± 0.002 0.450 ± 0.030 Φb L 0.500 ± 0.010 DIA. 0.215 ± 0.005 e1 S 0.173 ± 0.005 R TYP. G r2 2 Mounting Holes 0.156 ± 0.005 0.430 ± 0.005 r1 ΦP e 0.665 ± 0.005

NATIONAL SEMICONDUCTOR MARKING CODE sot

Abstract: national marking code NATIONAL SEMICONDUCTOR MARKING CODE DEVICE MARKING CODE table sot-23 MARKING CODE ZA On semiconductor date Code dpak YEAR A national top marking codes national marking date code national marking code sot sot23 mark code KS
Contextual Info: Device Marking Conventions National Semiconductor marks devices sold in order to provide device identification and manufacturing traceablility information. The method of presenting the information marked on the device is dependent on the size of the device package