QFP 20X20 PACKAGE Search Results

TQFP IC-Socket

Abstract: ICP-080-5 qfp 20x20 Package ICP-080-3 ICP-080-4 ICP-080-6 ICP-080-7 TQFP 80 socket
Contextual Info: IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):

ICP-080-3

Abstract: ICP-080-4 ICP-080-5 ICP-080-6 ICP-080-7 qfp 20x20 Package
Contextual Info: IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):

qfp 20x20 Package

Abstract: 128 QFP 20x20 SF-QFE128SF-L-01
Contextual Info: Emulates QFP package 20x20 mm body size 22x22 mm tip to tip PAD DETAIL 20.98mm [0.826"] sqr. 0.508mm 0.020" Ø 0.25mm [Ø 0.010"] 0.305mm 0.012" 19.20mm [0.756"] sqr. 0.50mm typ. [0.020"] Top View A 15.50mm [0.610"] 0.46mm [0.018"] compatible target board

ICP-080-6

Abstract: ICP-080-7 qfp 20x20
Contextual Info: CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles:

IC149-80-117-B5

Abstract: ICP-080-6 ICP-080-4 21-B5 80151
Contextual Info: Click here to go back to socket part number overview IC149 Series SMT QFP/TQFP - 80 Pins (20x20) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.:

FPQ 208 0.5 10

Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
Contextual Info: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch

1.27mm pitch zif socket 3M 21X21

Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
Contextual Info: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •

AK32D300-QFP5X5

Abstract: AK32D600-QFP5X5 AK32D300-QFP7X7 AK32D600-QFP7X7 AK32D600-QFP7X7-A1-1 AK44D600-QFP .65mm AK44D600-QFP .8mm 10x10 AK44D900-QFP 1.0mm AK48D600-QFP .5mm 7x7 AK48D900-QFP .8mm 12x12
Contextual Info: ACCUTEK Quad Flat Package QFP DIP or PGA Adapters MICROCIRCUIT CORPORATION DIP or PGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface

Contextual Info: Quad Flat Package QFP DIP or PGA Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP or PGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek QFP Adapter Modules converts surface

QFP JEDEC tray

Abstract: JEDEC TRAY QFP QFP 144 tray QFP 144 package tray
Contextual Info: HEAT PROOF 23.4 A' 17.55 25.2 MQFP 20x20 2.7mm A PPE 7 100.8 135.9 UNIT : mm 23.4 25.4 17.8 279.4 315 322.6 SECTION A – A' 23.4 3.92 6.35 7.62 19.55 Applied Package Quantity pcs 144-pin Plastic QFP (Fine Pitch)(2.7mm thick) MAX. 60 Tray Material Heat Proof Temp.

fcBGA PACKAGE thermal resistance

Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Contextual Info: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America

68HC11L6

Abstract: 68hc11ka4 68HC11PH8 68HC11a1 527 MOSFET TRANSISTOR motorola D65C 68HC05N4 nippon denso 68HC05B6 128 QFP 14x20
Contextual Info: CMRQS/D REV 10 MOTOROLA MICROCONTROLLER TECHNOLOGIES GROUP RELIABILITY AND QUALITY MONITOR REPORT Quarter 1, 1997 Semiconductor Product Sector Test results contained herein are for information only. This report does not alter MotorolaÕs standard warranty or product speciÞcations.

68hc11pa8

Abstract: 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4
Contextual Info: MCTG RELIABILITY AND QUALITY 1996 ANNUAL REPORT MRQSY96/D Microcontroller Technologies Group Reliability and Quality 1996 Annual Report To Our Valued Customers: Thank you for selecting Motorola as your preferred supplier of Microcontroller products. We in Motorola’s

HLQFP 176 Package

Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Contextual Info: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)

Contextual Info: Q.F.P. SMT YAM AICHIIC149 Series SPECIFICATIONS • Better for Emulation probe purposes • Footprint designed for socket, can accept QFP packages without board design change CHARACTERISTICS Insulation Resistance Breakdown Voltage Contact Resistance Operating Temp. Range

789104a

Abstract: nec 44 pin LQFP 78F9116A 78f9136a 78F9418AGC 789124A 30-pin nec 78F9468 78F9328 30PIN
Contextual Info: HOME SOLUTIONS PRODUCTS TECHNOLOGY HIGHLIGHTS SUPPORT COMPANY PROFILE NEWS AND EVENTS MICROCOMPUTER Microcomputer HOME Product Overview 8bit 78K0S Series : Development Environment NEC Electronics Tools Programming Environment Product Lineup Development Environment

MO-069

Contextual Info: YAMAICHI Q.F.P., P.QJ1R & L.C.C Test & Burn-In • SPECIFICATIONS • Any kind ofSMT type or IC package type SOP & QFP available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pilch IC packages.

Contextual Info: !C PACKAGES ip * yjjj TCP Tape Carrier Package /COB (Chip on Board)/CDF ( • TCP Keeping with the trend toward smaller and lighter equipment incorporating even more advanced functions, surface-mount 1C packages have recently come to the forefront with the aim of achieving higher pin counts, finer pin pitches, and reduced dimensions. TCP (Tape

ADV0217

Abstract: ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING
Contextual Info: Revision: 1.1.0 CUSTOMER ADVISORY ADV0217 UPDATE FULL LASER MARKING INTRODUCTION Change Description This is an update to ADV0217. See the revision history table for information specific to this update. In January 2003, Altera introduced a full topside laser mark on all Altera plastic body packages.

FPQ-208-0.5-10

Abstract: qfp 20x20 package P1112A IC51-2084-1052-4 fpq-208-0.5-02 IC51-2084-1052 FPQ Package P1114A FPQ-208 FPQ-208-0.5-06
Contextual Info: 0.250" 0.175" P1112A 0.250" P1114A QF XMG/20PGA240 SB 2.050" 1993 I.E. © 1993 I.E. 0.100" typ. 0.033" 2.508" Top View Bottom View 2.400" DUT Adaptor Part # 0.972" 0.757" DT-QFE208SA1-P-Z-01 0.080" 1 DT-QFE208SB1-P-Z-01 DT-QFE208SC1-P-Z-01 0.124" ZIF socket used*

ICP-100-4

Contextual Info: YAMAICHI ELECTRONICS INC bflE D m clcm S 5 3 b D0DDS7t 765 • Q.F.P. sm d _ YAMAICHI IC149 Series SPECIFICATIONS • Better for Emulation probe purposes • Footprint designed for socket, can accept QFP packages without board design change CHARACTERISTICS

V850E/IA1

Abstract: uPD70F3235 nomenclatura uPD70F3157 uPD70F3237 uPD70F3231 NEC V850 FG2 UPD703128GJ V853A uPD70F3233
Contextual Info: V850 32-bit Microcontroller Issue 1/2003 – Devices Device Nickname V853A V850/SA1 V850/SB1 V850/SF1 AVALON V850/SC3 V850ES/SA2 V850ES/SA3 V850ES/KF1 V850ES/KG1 V850ES/KJ1 VENUS V850ES/PM1 V850ES/FE2 V850ES/FF2 V850ES/FG2 V850ES/FJ2 V850ES/SG2 V850ES/SJ2

68hc26

Abstract: 68HC05C4 68hc705p9 68HC05B6 JPC3400 68hc805b6 68705r3 68HC05C12 68HC705B5 68HC68SE
Contextual Info: CSIC Microcontroller Division Reliability and Quality Quarter 2, 1996 Report MOTOROLA INC., 1996 CSIC MICROCONTROLLER DIVISION RELIABILITY AND QUALITY REPORT TECHNICAL INFORMATION . 1-1 RELIABILITY DATA BY TECHNOLOGY. 2-1

0 280 130 069

Contextual Info: YA MA IC HI E L E C T R O N I C S INC bfiE D • T ì M S S B b 0 0 0 G S5 7 D^b PQFP / TQFP MATCHm oPÁCKm um zü l*KOf fins Body Sue Pitch A B C » IC51-0324-805 IC51-0324-1498 IC51-0444-1195-3 32 32 44 5x5 7X 7 10x10 7.0 9.0 12.6 7.0 9.0 12.6 5.0 7.0 10.0