QFP 208 PACKAGE Search Results

208-PIN

Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ (1.102±.012) 25.50(1.004)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01)

Contextual Info: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP FPT-208P-M04 208-pin plastic QFP (FPT-208P-M04) Lead pitch 0.50 mm Package width x package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method Plastic mold

FPT-208C-C02

Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-208C-C02 208-pin ceramic QFP (FPT-208C-C02)

nitride

Abstract: Aluminum nitride QFP method 208
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-208C-C03 208-pin ceramic QFP (FPT-208C-C03)

FPT-208C-C02

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-208C-C02 208-pin ceramic QFP

nitride

Abstract: Aluminum nitride QFP C1995
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C04 Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Aluminum nitride 208-pin ceramic QFP FPT-208C-C04 208-pin ceramic QFP (FPT-208C-C04)

QFP20

Abstract: QFP208-P-2828-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M01 EIAJ code : ∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-208P-M01 208-pin plastic QFP (FPT-208P-M01)

footprint plcc 208

Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Contextual Info: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC

IC198-208-2100

Abstract: IC198-208-2101
Contextual Info: IC198 Series SMT 208 Pins QFP - (52 x 52) 0.5 mm pitch Socket Dimensions Quad Flat Package (QFP) - 208 pins Specifications Current Rating: Rated Voltage: Contact Resistance: 0.3 A 50V DC 30mΩ max. at 10mA and 20mV max. Insulation Resistance: 500MΩ min. at 500V DC

footprint pga 208

Abstract: ASTM-B16-85 MIL-T-10727
Contextual Info: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

A2 diode

Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Contextual Info: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5

footprint pga 208

Abstract: ASTM-B16-85
Contextual Info: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

footprint pga 208

Contextual Info: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

footprint pga 208

Abstract: AMS-QQ-N-29
Contextual Info: P/N 96-208M50 QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adapter FEATURES • Convert surface-mount QFP packages to a 17x17 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,

ADV9505

Contextual Info: June 22, 1995 Dear Customer: Altera has established procedures to ship FLEX 8000 208-, 240-, and 304-pin Power Quad Flat Packs RQFP in dry pack immediately. Dry packing of other QFP packages will follow and a schedule will be published shortly. Dry packing enhances the current QFP shipping process by placing all QFP devices in

Contextual Info: P/N 96-208M50 QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adapter FEATURES • Convert surface-mount QFP packages to a 17x17 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,

823B

Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
Contextual Info: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP

QFP PACKAGE thermal resistance

Abstract: 208-PIN
Contextual Info: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type available FPT-208P-M04

208-PIN

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic