QFP 100 PACKAGE Search Results

mask rom

Abstract: FP-100A Hitachi DSAUTAZ006
Contextual Info: B. Product Lineup Product H8S/2282 H8S/2281 Type Name Model Marking Package Code F-ZTAT version HD64F2282 HD64F2282 100-pin QFP (FP-100A) Mask ROM version HD6432282 HD6432282(*) 100-pin QFP (FP-100A) Mask ROM version HD6432281 HD6432281(*) 100-pin QFP (FP-100A)

processor

Abstract: KS0118B KA9401 KA9413 SOP42 KA9421 servo rc KA9420 digital video signal processor KA9430
Contextual Info: FUNCTION GUIDE LINEAR ICs M. LDP APPLICATION PACKAGE KA9410 KA9412 KA9413 KA9414D KA9420 KA9421 KA9430 KA9431 KA9401 KA9490 KS0118B 42 SDIP 42 SDIP 100 QFP 30 SOP 42 SDIP 100 QFP 42 SDIP 48 SDIP 80 QFP 9 SIP 80 QFP FUNCTION Video Signal Processor NTSC / PAL Video Signal Processor

PALM LCD

Abstract: KS0084 KS0083 single chip computer lcd scientific calculator
Contextual Info: LCD PRODUCTS DEVICE KS0083 PACKAGE 100 QFP or Bare chip FUNCTION Dot matrix LCD common/segment driver with 80 channel output KS0084 100 QFP or Bare chip KS0086 100 QFP or Bare Chip Dot matrix LCD common/segment driver with 80 channel output Dot Matrix LCD

100P6S-A

Abstract: 100p6s PCA4687A 100-PIN
Contextual Info: PCA4687A Converter for Connecting 100-pin 0.65mm-pitch QFP to 100-pin 0.65mm-pitch LCC Function The PCA4687A is a board for converting 100-pin 0.65mm-pitch QFP 100P6S-A to 100-pin 0.65mm-pitch LCC (100D0). Application Solder an MCU housed in the 100-pin 0.65mm-pitch QFP

2648f

Abstract: IC BOSCH QFP Hitachi DSA0076 16x16-bit H8S/2638f Hitachi motor stepper Lauterbach SH7047F QFP-100 QFP-128
Contextual Info: HCAN Microcontrollers The Embedded CAN solution ❚ Overview Dashboard/Gateway Body/EPS/Motor Control Dashboard/Metering SH7047F 256KB/12KB QFP-100 SH7049M 128KB/8KB QFP-100 SMD x 4 HCAN x 2 H8S/2638F/39F 256KB/16KB QFP-128 H8S/2636F, M 128KB/4KB QFP-128 H8S/2648F

Z80182

Abstract: S180 Z8018216FSC Z87200 Z8720045FSC Z80180 technical manual
Contextual Info: WIRELESS SUPPORT PRODUCT 1 Z8720000ZCO 1 EVALUATION KIT HARDWARE FEATURES • Supported Devices ■ Intermediate Frequency and Baseband Inputs/Outputs Packages Emulation Programming ■ 16550 MIMIC Interface 100-pin QFP 100-pin QFP Z8720045FSC Z8018216FSC

S180

Abstract: Z87200 Z8720045FSC IBM schematics Z8720000ZCO
Contextual Info: Z8720000ZCO CP95WRL0601 CUSTOMER PROCUREMENT SPECIFICATION Z8720000ZCO Z87200 EVALUATION KIT FEATURES • Supported Devices Packages 100-Pin QFP 100-Pin QFP Evaluation Programming/Emulation Z8720045FSC N/A Z8720116FSC N/A ■ I.F. and Baseband Inputs/Outputs

samsung lcd monitor power board schematic

Abstract: KM29N040 Z89175 Z8917500ZCO Z89176 Z89C6501ZEM dtmf Encoding code c65
Contextual Info: CUSTOMER PROCUREMENT SPECIFICATION 1 Z8917500ZCO 1 Z89175/176 VOICE PROCESSING EVALUATION KIT FEATURES • Supported Devices: Packages Emulation 100-Pin QFP 100-Pin QFP Z89175 Z89176 ■ Fully Digital Answering Machine Capability ■ Caller ID Support ■

A2 diode

Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Contextual Info: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC To Top / Package Lineup / Package Index FPT-100C-A02 100-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal FPT-100C-A02 100-pin ceramic QFP (FPT-100C-A02)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC FPT-100C-A02 100-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal FPT-100C-A02 100-pin ceramic QFP (FPT-100C-A02) 0.51(.020) TYP 8.89(.350)DIA TYP

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC To Top / Package Lineup / Package Index FPT-100C-A01 100-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal FPT-100C-A01 100-pin ceramic QFP (FPT-100C-A01)

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

samsung lcd monitor power board schematic

Abstract: KM29N040 Z89175 Z8917500ZCO Z89176 Z89C6501ZEM lcd monitor board schematic dtmf Encoding
Contextual Info: Z8917500ZCO Z89175/176 VOICE PROCESSING EVALUATION KIT FEATURES • ■ Supported Devices: Packages Emulation 100-Pin QFP 100-Pin QFP Z89175 Z89176 Fully Digital Answering Machine Capability ■ Caller ID Support ■ Date and Time Stamping ■ High-Quality Voice

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

100-PGM13069-30

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Abstract: MIL-T-10727 QQN-290
Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Abstract: MIL-T-10727
Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.