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    QFN PCB LAYOUT GUIDE Search Results

    QFN PCB LAYOUT GUIDE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10035667-002LF
    		Amphenol Communications Solutions Board Guiding PDF
    66527-535LF
    		Amphenol Communications Solutions GUIDE PIN CARD CONNECTOR PDF
    66527-555LF
    		Amphenol Communications Solutions GUIDE PIN CARD CONNECTOR PDF
    66527-518LF
    		Amphenol Communications Solutions GUIDE PIN CARD CONNECTOR PDF
    85451-001LF
    		Amphenol Communications Solutions Din Accessory Guide PDF

    QFN PCB LAYOUT GUIDE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Contextual Info: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


    Original     		AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline PDF

    thermal pcb guidelines

    Abstract: 36pin qfn qfn stencil smsc 2112 pcb design
    Contextual Info: AN 18.15 PCB Design Guidelines for QFN and DQFN Packages 1 Introduction This application note provides information on general printed circuit board layout considerations for the SMSC products using QFN and DQFN packages. 1.1 Audience This application note is written for a reader that is familiar with PCB design, including signal integrity


    Original     		PDF

    QFN-48 LAND PATTERN

    Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
    Contextual Info: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when


    Original     		PDF

    SAC305

    Abstract: 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance
    Contextual Info: Freescale Semiconductor Application Note AN3778 Rev. 0, 2/2010 PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation By: Quan Li, Lu Li, Richard Rowan, and Mahesh Shah PURPOSE This document provides guidelines for printed circuit board


    Original     		AN3778 SAC305 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance PDF

    s2083

    Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
    Contextual Info: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder


    Original     		S2083 s2083 qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220 PDF

    EP5382QI

    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5382QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5382QI power converter packages are designed with a plastic leadframe


    Original     		EP5382QI PDF

    EN5394QI

    Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394
    Contextual Info: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5394QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5394QI power converter packages are designed with a plastic leadframe


    Original     		EN5394QI QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394 PDF

    IPC-7095B

    Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
    Contextual Info: Enpirion, Inc. EN5312QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5312QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		EN5312QI IPC-7095B IPC-7095 7095B IPC 7095B en5312 qfn stencil PDF

    EN5311Qi

    Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
    Contextual Info: Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copper leadframes and mold caps with System in Package SiP construction to form a Quad Flat No-lead (QFN) package. QFN package


    Original     		EN5311QI EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil PDF

    EN5364QI

    Contextual Info: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5364QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5364QI power converter packages are designed with a plastic leadframe


    Original     		EN5364QI PDF

    en5337qi

    Abstract: EN5337 qfn 32 stencil smd be
    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5337QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 2/3/2009 1.0 INTRODUCTION Enpirion’s EN5337QI power converter packages are designed with a plastic leadframe


    Original     		EN5337QI EN5337 qfn 32 stencil smd be PDF

    EP5352QI

    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5352QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5352QI power converter packages are designed with a plastic leadframe


    Original     		EP5352QI PDF

    EN5335QI

    Abstract: qfn stencil EN5335Q qfn 32 stencil Thermal vias
    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5335QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5335QI power converter packages are designed with a plastic leadframe


    Original     		EN5335QI qfn stencil EN5335Q qfn 32 stencil Thermal vias PDF

    QFN leadframe

    Abstract: smt pcb ipc standard
    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5362QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5362QI power converter packages are designed with a plastic leadframe


    Original     		EP5362QI QFN leadframe smt pcb ipc standard PDF

    EN5366QI

    Abstract: en5366 stencil qfn stencil
    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5366QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5366QI power converter packages are designed with a plastic leadframe


    Original     		EN5366QI en5366 stencil qfn stencil PDF

    qfn 44 PACKAGE footprint

    Abstract: EN5365QI EN5365 QFN PACKAGE thermal resistance
    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5365QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5365QI power converter packages are designed with a plastic leadframe


    Original     		EN5365QI qfn 44 PACKAGE footprint EN5365 QFN PACKAGE thermal resistance PDF

    qfn 32 land pattern

    Abstract: EN5396QI QFN footprint QFN leadframe qfn 32 stencil
    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5396QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 6/18/2008 1.0 INTRODUCTION Enpirion’s EN5396QI power converter packages are designed with a plastic leadframe


    Original     		EN5396QI qfn 32 land pattern QFN footprint QFN leadframe qfn 32 stencil PDF

    EN5336QI

    Abstract: stencil qfn stencil
    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5336QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EN5336QI power converter packages are designed with a plastic leadframe


    Original     		EN5336QI stencil qfn stencil PDF

    EP5368QI

    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5368QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 9/27/2007 1.0 INTRODUCTION Enpirion’s EP5368QI power converter package is designed with a plastic leadframe


    Original     		EP5368QI PDF

    en5322qi

    Abstract: EN5322 QFN PACKAGE thermal resistance qfn 32 land pattern EN5322Q qfn Package qfn density
    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EN5322QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 9/27/2007 1.0 INTRODUCTION Enpirion’s EN5322QI power converter package is designed with a plastic leadframe


    Original     		EN5322QI EN5322 QFN PACKAGE thermal resistance qfn 32 land pattern EN5322Q qfn Package qfn density PDF

    QFN PACKAGE thermal resistance

    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53XXXUI QFN Package Soldering Guidelines John D. Weld, Ph.D. 11/4/2008 1.0 INTRODUCTION Enpirion’s EP53XXXUI power converter packages are designed with a plastic leadframe


    Original     		EP53XXXUI QFN PACKAGE thermal resistance PDF

    EP53F8QI

    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53F8QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP53F8QI power converter packages are designed with a plastic leadframe


    Original     		EP53F8QI PDF

    pcb fabrication process

    Abstract: EP53
    Contextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53XXXQI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP53XXXQI power converter packages are designed with a plastic leadframe


    Original     		EP53XXXQI pcb fabrication process EP53 PDF

    TEXAS INSTRUMENTS, Mold Compound QFN

    Abstract: SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance
    Contextual Info: Application Report SLOA122 – July 2006 QFN Layout Guidelines Yang Boon Quek . HPL Audio Power Amplifiers 1 Introduction Board layout and stencil information for most Texas Instruments TI Quad Flat No-Lead (QFN) devices is


    Original     		SLOA122 TEXAS INSTRUMENTS, Mold Compound QFN SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance PDF