QFN 64 TAPE CARRIER Search Results

EDSD-1L8MM-REEL

Abstract: QFn 64 tape carrier
Contextual Info: TAPE AND REEL TAPE AND REEL SPECIFICATIONS—SURFACE MOUNT Tape and Reel Packing Tape and reel packing is available for all SO, TSOT thin SOT23 , SOT-23 3L/4L, SOT-223, SSOP, TSSOP, QFN, DFN and DD packages in accordance with EIA Specification 481-D with the following exceptions: (DFN(DCB), TSOT and SC70

QFn 64 tape carrier

Abstract: Techwell 7x7x1 TB347 MO-169 1748 QFN
Contextual Info: Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with

tqfp 7X7X1.4mm

Abstract: 14x14x1.4mm wlcsp inspection MO-169 TB347 TQFP 48-1 PACKAGE
Contextual Info: Tape and Reel Specification for Integrated Circuits Technical Brief April 13, 2009 TB347.12 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged

EIA 481 QFN pin 1

Abstract: smd transistor 5c sot-23 TB347 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1
Contextual Info: Tape and Reel Specification for Integrated Circuits Technical Brief January 5, 2007 TB347.10 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged

ATMEL Tape and Reel drawing

Abstract: ATMEL Tape and Reel code JEDEC Drawing MO-220 qfn48 Atmel Moisture sensitivity level Moisture/ATMEL Tape and Reel QFN-64 ATSAMD21G18
Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

Contextual Info: Technical Brief 347 Tape and Reel Specification for Integrated Circuits Introduction Many Surface Mounted Devices SMDs are being packaged for shipment in embossed tape and wound onto reels. The Intersil tape and reel specifications are in compliance with

FTDI Devices T&R Dimensions

Abstract: FT232R LQFP Package tray SSOP-28 FTDI FT232RL
Contextual Info: Future Technology Devices International Ltd. Application Note AN_116 FTDI Devices T&R Dimensions Document Reference No.: FT_000154 Version 1.5 Issue Date: 2012-12-10 This document provides information on the tape and reel dimensions for FT232BL, FT245BL, FT232BQ,

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J ARM-Based Microcontroller PRELIMINARY DATASHEET SUMMARY Description The Atmel SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The

ATSAMd21g18

Abstract: JEDEC Drawing MO-220 qfn48
Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J ARM-Based Microcontroller PRELIMINARY DATASHEET SUMMARY Description The Atmel SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The

Contextual Info: Atmel SAM D20J / SAM D20G / SAM D20E ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel SAM D20 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

ATSAMD21G18

Contextual Info: Atmel SAM D21E / SAM D21G / SAM D21J SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel | SMART SAM D21 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and

marking cck

Contextual Info: SE2609L 2.4 GHz Power Amplifier with Power Detector Preliminary Information Applications ƒ ƒ ƒ Product Description The SE2609L is a 2.4 GHz power amplifier designed for use in the 2.4 GHz ISM band for wireless LAN applications. The device incorporates a power

mp 9141 es

Abstract: MC33662 MPXY8600 MPC5673F MPC56xx fet e300 MPC5606B MC33905 mpxy8500 MPC5643L
Contextual Info: Automotive Quarter 4, 2010 SG187Q42010 Rev 40 FREESCALE SEMICONDUCTOR ANALOG AND MIXED SIGNAL PRODUCTS The product categories range from Power Actuation and Network Transceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation covers a broad range of

SE2608L

Abstract: QAD-00044 QAD00045
Contextual Info: SE2608L 2.4 GHz Power Amplifier with Power Detector Preliminary Information Applications ƒ ƒ ƒ Product Description The SE2608L is a 2.4 GHz power amplifier designed for use in the 2.4 GHz ISM band for wireless LAN applications. The device incorporates a power

Contextual Info: DATA SHEET SE2609L: 2.4 GHz Power Amplifier with Power Detector Applications Product Description • • The SE2609L is a 2.4 GHz power amplifier designed for use in the 2.4 GHz ISM band for wireless LAN applications. The device incorporates a power detector for closed loop monitoring of the output

ofdm signal

Abstract: SE2609L-R
Contextual Info: DATA SHEET SE2609L: 2.4 GHz Power Amplifier with Power Detector Applications • •  Product Description DSSS 2.4 GHz WLAN IEEE802.11b OFDM 2.4 GHz WLAN (IEEE802.11g or IEEE802.11n) Access Points, PCMCIA, PC cards Features       

PE4304

Abstract: 4304 PE4304-EK 20 pins qfn 4x4 footprint
Contextual Info: Product Specification PE4304 75 Ω RF Digital Attenuator 6-bit, 31.5 dB, DC – 2.0 GHz Product Description Features • 75 Ω impedance • Attenuation: 0.5 dB steps to 31.5 dB • Low distortion for CATV and multi-carrier applications • Flexible parallel and serial programming

FT232HQ

Abstract: FT2232HL QFN-48 pin 49 ft232hl FT245BL FT4232HQ FT4232HL FTDI FT232RL FT2232HQ ft-232hl
Contextual Info: Future Technology Devices International Ltd. Application Note AN_116 FTDI Devices T&R Dimensions Document Reference No.: FT_000154 Version 1.4 Issue Date: 2011-11-07 This document provides information on the tape and reel dimensions for FT232BL, FT245BL, FT232BQ,

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

soic 8 marking part number

Abstract: marking code G qfn
Contextual Info: GENERAL ORDERING INFORMATION I. ORDERING INFORMATION Contact the sales office or distributor in your area for ordering information. Visit www.linear.com/contact for a complete list. Apply for credit and purchase through Linear Express at www.linear.com/purchase or buy directly on-line with a

QFN-64 footprint

Contextual Info: Transition Socket Specification 2008 Microchip Technology Inc. DS51194Q Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •

DS51140

Abstract: PIC32 PICC-18 XLT28QFN4 DS51298
Contextual Info: Transition Socket Specification  2009 Microchip Technology Inc. DS51194R Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •

DS51140

Abstract: DS51298 PIC32 PICC-18 44-pin plcc pcb mount footprint 44L PLCC socket XLT18SO-1
Contextual Info: Transition Socket Specification  2010 Microchip Technology Inc. DS51194S Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. •