QFN 32 LAND PATTERN Search Results

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Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
Contextual Info: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These

qfn 32 land pattern

Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
Contextual Info: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance

24 leads qfn 5x5

Abstract: qfn 3X3 land pattern JESD47D 28 leads qfn 4x5 QFN 20 5x5 "recommended PCB Layout" JEDEC J-STD-033b marking 8206 Jedec jesd47d AN0017 qfn 5x5 thermal resistance
Contextual Info: AN0017 Application Note for Molded Plastic QFN Packages GaAs Monolithic Packaged Microwave IC 1. General considerations on plastic molded packages Surface Mount Device type packages SMD* for microwave applications are appearing more and more on the market. The use of such packages requires some

FOOTPRINT MO-229 2X3 SOLDERING

Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level

max17428

Abstract: MAX17401
Contextual Info:  MAX8796, MAX8797, MAX17401 1-Phase, Quick-PWM Intel IMVP-6/GMCH Controllers 1-Phase, Intel IMVP-6/6+ Controllers Ideal for Atom CPU and UMPC Designs Overview Technical Documents Ordering Info Related Products User Comments 0

ECS-200-CDX-0914

Abstract: LQM18FN GRM610C0G010B25K500 AYU1-1P-02676-120 ECS 327-12.5-34b SPI flash PCB LAYOUT GUIDE DUST Networks LQM18FN2R2m00d QH072AF2A wave guide
Contextual Info: Dust Networks Eterna Integration Guide Table of Contents About This Audience .3

AN4077

Contextual Info: Freescale Semiconductor Application Note Document Number: AN4077 Rev. 2, 10/2012 MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low-g consumer grade

s2083

Abstract: qfn 32 5x5 STENCIL rf 4 mm PQFN s2083 application PQFN jedec package MO-220 32 5x5 qfn 3X3 land pattern PDFN STQFN-14 MO-220
Contextual Info: Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Rev. V9 Introduction Via Design The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

AN4077

Abstract: Freescale MMA845xQ MMA8453Q AN4071 MMA8451 mma8452q MMA8451Q 78MG MMA845x MC9S08QE8
Contextual Info: AN4077 Rev 0, 09/2010 Freescale Semiconductor Application Note MMA845xQ Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA845xQ 3-axis low g consumer grade

MARKING T6C

Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
Contextual Info: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change

JEDEC Drawing MO-220 qfn

Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint 32-pin QFN PCB Layout guide MO-220 7x7 0.4 pitch qfn 44 PACKAGE footprint 7x7 DIe Size
Contextual Info: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the

Contextual Info: Adaptive Digital DC/DC Controller with Current Sharing ZL2004-01 Features The ZL2004-01 is specialized version of the ZL2004 DC/DC controller that has been optimized for high output accuracy within a given set of operating conditions. The ZL2004-01 is otherwise identical to the ZL2004 in features and functionality.

jedec footprint MO-220 VHHD-2

Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN0118 WAN_0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Contextual Info: w WAN_0118 Guidelines on How to Use QFN Packages and Create Associated PCB Footprints INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the

Si4705-D60-GU

Contextual Info: Si4704/05-D60 B ROADCAST F M R ADIO R ECEIVER WITH R D S / R B D S Features             Applications Ordering Information: See page 30. Pin Assignments Table and portable radios Mini/micro systems  CD/DVD and Blu-ray players

Contextual Info: Adaptive Digital DC/DC Controller with Current Sharing ZL2004-01 Features The ZL2004-01 is specialized version of the ZL2004 DC/DC controller that has been optimized for high output accuracy within a given set of operating conditions. The ZL2004-01 is otherwise identical to the ZL2004 in features and functionality.

marking 6-PIN PLASTIC TSON

Abstract: MARKING M53 MARKING CODE T5E RENESAS marking code 30SSOP Renesas 30SSOP marking code lga 1155 M33 TRANSISTOR Microwave Devices QFN-52 p5 6pin
Contextual Info: PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Common Information www.renesas.com Rev.2.00 Oct 2010 Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please

pcb design of zigbee

Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
Contextual Info: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor

Contextual Info: Si5322 P I N - P ROGRAMMABLE P R E C I S I O N C LOCK M U LT IP L I E R Features      Not recommended for new  designs. For alternatives, see the Si533x family of products. Selectable output frequencies  ranging from 19.44 to 1050 MHz

SI4734

Contextual Info: Si4730/31/34/35-D60 B ROADCAST AM/FM/SW/LW R ADIO R ECEIVER Features                 Ordering Information: See page 31. Pin Assignments Si473x-D60 QFN DFS   Seven selectable AM channel filters AM/FM/SW/LW digital tuning

CX93011

Abstract: CX93011 CSMxx CX93011-21Z CSM92 cx93011-21z transistor c828 bedding sleep 20548-A CX20548-11Z USG-201664
Contextual Info: CX93011-2x CSMxx V.92/V.34/V.32bis Controller Serial Modem with CX20548 SmartDAA Data Sheet DSH-201689E January 2011 Revision History Revision Date Description A June 11, 2008 Initial release B July 29, 2008 Revision B release C July 31, 2008 Revision C release

c828 transistor

Abstract: CX93011-23Z CX93011-21Z CX93011 c828 transistor datasheet CX93011-2x transistor c828 CX20588 CX20548-11Z CX20548
Contextual Info: CX93011-2x CSMxx V.92/V.34/V.32bis Controller Serial Modem with CX20548 SmartDAA Data Sheet DSH-201689D June 2009 Revision History Revision Date Description A June 11, 2008 Initial release B July 29, 2008 Revision B release C July 31, 2008 Revision C release

MMA845x

Abstract: mma8452 MMA8453 MMA8452 calibration mma8452 I2C mma8452q MMA8451 MMA845XQ MC9S08QE8 MMA8453Q
Contextual Info: AN3923 Rev 1, 02/2010 Freescale Semiconductor Application Note MMA8450Q Design Checklist and Board Mounting Guidelines by: Kimberly Tuck Applications Engineer 1.0 Introduction This document is intended to assist customers with the design-in of the MMA8450Q and/or other family derivatives.