Q1250 Search Results

L9D3256M32SBG1

Contextual Info: L9D3256M32SBG1 L9D3512M32SBG1 8-16 Gb, DDR3, 256-512M x 32 Single Channel Memory Module Benefits FEATURES       Configuration: x/'06%*0HJ[[ 8 banks x/'06%*0HJ[[ 8 banks DDR3 Integrated Module [iMOD]: VDD=VDD4 999

APPLE A6 CHIP

Abstract: cf325 W07 sot 23 C-492-5 SMD M05 sot23 C4977 cf406 p66 apple c5297 I342
Contextual Info: 8 6 7 PDF CSA CONTENTS IMG5 17" REV E 11/01/05 SYNC MASTER DATE PDF CSA CONTENTS TABLE_TABLEOFCONTENTS_HEAD 2 System Block Diagram FINO-DD 06/20/2005 TABLE_TABLEOFCONTENTS_ITEM 3 4 Power Block Diagram FINO-PC 06/20/2005 5 Table Items FINO-M23 08/26/2005 6

LDM-1A

Contextual Info: PRELIMINARY INFORMATION L9D382G32BG2 L9D3162G32BG2 8-16 Gb, DDR3, 128M - 256M x 32 Dual Channel Integrated Module 8-16 Gb, DDR3, 128M - 256M x 64 Single Channel Integrated Module Benefits  %RDUGDUHDVDYLQJVZLWKVXUIDFH Z ZL PRXQWIULHQGO\SLWFK PP

L9D364M64SBG2

Contextual Info: L9D364M64SBG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: x9DD 9DD4 9”9 x9FHQWHUWHUPLQDWHGSXVKSXOO ,2  x3DFNDJHPP[PP[PP [PDWUL[ZEDOOV  x0DWUL[EDOOSLWFKPP

L9D3256M32DBG2

Contextual Info: PRELIMINARY INFORMATION L9D3256M32DBG2 L9D3512M32DBG2 16-32 Gb, DDR3, 256-512M x 32 Dual Channel Memory Module Benefits FEATURES DDR3 Integrated Module [iMOD]: x9DD 9DD4 999 x9FHQWHUWHUPLQDWHGSXVKSXOO ,2  x3DFNDJHPP[PP[PP

IRLM2402

Abstract: c4977 cf325 NEC c5292 VD357 C5292 nec NEC "C4305" cf406 C4934 C5248
Contextual Info: 8 6 7 2 3 4 5 CK APPD FINO M23 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 1 REV ZONE ECN ENG APPD DESCRIPTION OF CHANGE DATE 19 397409 ENGINEERING RELEASED

Contextual Info: PRELIMINARY INFORMATION L9D3256M72SBG2 L9D3256M80SBG2 18-20 Gb, DDR3, 256 M x 72/80 Integrated Module Benefits FEATURES DDR3 Integrated Module [iMOD]: x9DD 9DD4 9”9RU/2: 32: 59DD 9DD4 9”9  x9RU9FHQWHUWHUPLQDWHG push/pull output

Contextual Info: L9D340G64BG2 4.0 Gb, DDR3, 64 M x 64 Integrated Module IMOD Benefits FEATURES DDR3 Integrated Module [iMOD]: x9DD 9DD4 9”9 x9FHQWHUWHUPLQDWHGSXVKSXOO ,2  x3DFNDJHPP[PP[PP [PDWUL[ZEDOOV  x0DWUL[EDOOSLWFKPP

Contextual Info: PRELIMINARY INFORMATION L9D3256M72SBG2 L9D3256M80SBG2 18-20 Gb, DDR3, 256 M x 72/80 Integrated Module Benefits FEATURES DDR3 Integrated Module [iMOD]: x9DD 9DD4 9”9 x9FHQWHUWHUPLQDWHGSXVKSXOO ,2  x3DFNDJHPP[PP[PP

Contextual Info: PRELIMINARY INFORMATION L9D3256M32SBG1 L9D3512M32SBG1 8-16 Gb, DDR3, 256-512M x 32 Single Channel Memory Module Benefits FEATURES       Configuration: x/'06%*0HJ[[ 8 banks x/'06%*0HJ[[ 8 banks DDR3 Integrated Module [iMOD]:

L9D3256M72SBG2

Contextual Info: L9D3256M72SBG2 L9D3256M80SBG2 PRELIMINARY INFORMATION 18-20 Gb, DDR3, 256 M x 72/80 Integrated Module Benefits FEATURES DDR3 Integrated Module [iMOD]: x9DD 9DD4 9”9RU/2: 32: 59DD 9DD4 9”9  x9RU9FHQWHUWHUPLQDWHG push/pull output

ddr3 pinout

Contextual Info: ADVANCE INFORMATION L9D340G64BG5 L9D345G72BG5 L9D350G80BG5 L9D380G64BG5 L9D390G72BG5 L9D3100G80BG5 4.0-10.0 Gb, DDR3, 64 M [128 M] x 64/72/80 Memory Module FAST, LOW POWER, HIGH DENSITY, WIDE WORD MEMORY Benefits FEATURES L9D3xxxGxxBG5 Product Offerings: PART NUMBER:

cf325

Abstract: Broadcom EMI NEC c5292 UE401 c5885 CF-325 CE015 CF219 I1016 C1900 PCB
Contextual Info: 8 6 7 PDF CSA CONTENTS SYNC MASTER DATE PDF CSA CONTENTS 2 System Block Diagram FINO-M23 08/26/2005 4 Power Block Diagram FINO-M23 08/26/2005 5 Table Items FINO-M23 10/07/2005 6 FUNC TEST 1 OF 2 FINO-M23 08/26/2005 7 POWER CONN / ALIAS M33-PC 06/20/2005 8