Q 206 Search Results

card reader mtbf

Abstract: EE-55 CONTACTLESS SMART CARD READER credit card reader Thermal Credit Card Electronic couponing
Contextual Info: ICE 5500 fast, interactive POS terminal with integrated printer ICE 5500 Features: q q q q q q q q q Fast processing for all types of credit, debit and charge cards Small footprint, occupies minimal counterspace Fully smart card-ready and EMV-certified Intuitive touch-screen graphics quickly guides users through payment process

AA13

Abstract: AA19 AC11 AC13 AD12
Contextual Info: ispLSI 3320 In-System Programmable High Density PLD Functional Block Diagram J0 Output Routing Pool ORP G3 F3 G2 G1 G0 F2 F1 F0 E3 D Q D Q H1 E2 OR Array D Q E1 H2 H3 D Q D Q OR Array Twin GLB E0 D Q D3 D Q D2 I1 D Q I2 D1 I3 D0 C3 Global Routing Pool

Contextual Info: ispLSI 3320 In-System Programmable High Density PLD Functional Block Diagram J0 Output Routing Pool ORP G3 F3 G2 G1 G0 F2 F1 F0 E3 D Q D Q H1 E2 OR Array D Q E1 H2 H3 D Q D Q OR Array Twin GLB E0 D Q D3 D Q D2 I1 D Q I2 D1 I3 D0 C3 Global Routing Pool

AA13

Abstract: AA19 AC11 AC13 AD12
Contextual Info: ispLSI 3320 In-System Programmable High Density PLD Functional Block Diagram J0 Output Routing Pool ORP G3 F3 G2 G1 G0 F2 F1 F0 E3 D Q D Q H1 E2 OR Array D Q E1 H2 H3 D Q D Q OR Array Twin GLB E0 D Q D3 D Q D2 I1 D Q I2 D1 I3 D0 C3 Global Routing Pool

2064ve

Abstract: IspLSI 2064VE 2064ve100
Contextual Info: ispLSI 2064VE 3.3V In-System Programmable High Density SuperFAST PLD Features Functional Block Diagram • SuperFAST HIGH DENSITY PROGRAMMABLE LOGIC • • Global Routing Pool GRP Input Bus A0 A1 A2 B5 Logic Array B3 B2 D Q GLB B4 D Q B1 D Q D Q Input Bus

Contextual Info: ispLSI 2064VE 3.3V In-System Programmable High Density SuperFAST PLD Features Functional Block Diagram • SuperFAST HIGH DENSITY PROGRAMMABLE LOGIC • • Global Routing Pool GRP Input Bus A0 A1 A2 B5 Logic Array B3 B2 D Q GLB B4 D Q B1 D Q D Q Input Bus

AA13

Abstract: AA19 AC11 AC13 AD12
Contextual Info: ispLSI 3320 In-System Programmable High Density PLD Functional Block Diagram J0 Output Routing Pool ORP G3 F3 G2 G1 G0 F2 F1 F0 E3 D Q D Q H1 E2 OR Array D Q E1 H2 H3 D Q D Q OR Array Twin GLB E0 D Q D3 D Q D2 I1 D Q I2 D1 I3 D0 C3 Global Routing Pool

Contextual Info: ispLSI 2064V 3.3V High Density Programmable Logic Features Functional Block Diagram • HIGH DENSITY PROGRAMMABLE LOGIC • • Global Routing Pool GRP Input Bus A0 A1 A2 B5 Logic Array B3 B2 D Q GLB B4 D Q B1 D Q D Q Input Bus B6 B7 Output Routing Pool (ORP)

20041A

Abstract: 2064VE 2064VL
Contextual Info: ispLSI 2064VL Features Functional Block Diagram • SuperFAST HIGH DENSITY PROGRAMMABLE LOGIC • • • Input Bus Output Routing Pool ORP Input Bus A1 Logic Array B3 B2 D Q GLB B4 D Q B1 D Q D Q Input Bus Global Routing Pool (GRP) A0 A2 B5 Output Routing Pool (ORP)

LSC 132

Abstract: 3256E
Contextual Info: ispLSI and pLSI 3256E ® High Density Programmable Logic OR Array A2 A3 B1 D Q F2 D Q F1 Twin GLB F0 D Q E3 D Q E2 D Q B2 E1 Global Routing Pool B3 E0 C0 C1 ORP C2 C3 ORP ORP Boundary Scan F3 D Q Array G0 D Q D Q OR B0 ORP G1 D0 D1 ORP D2 ORP A1 G2 ORP

Contextual Info: F-206-1 2mm IDC CABLE STRIPS TCMD SERIES Mates with: SMM, MMS TRANSFER OPTION TYPE H NO. PINS • ■ END ■ ■ OVERALL S T R I P Q PER ROW Q Q P T I O n Q LENGTH OTHER OPTION SPECIFICATIONS For complete specifications see www.samtec.com?TCMD Insulator Material:

MAPLST0810-90CF

Abstract: MAPLST0810-090CF
Contextual Info: RF Power Field Effect Transistor LDMOS, 865 — 960 MHz, 90W, 26V 5/14/04 MAPLST0810-090CF Preliminary Features Q Q Q Q Q Q Package Style Designed for 865 to 960 MHz Broadband Commercial and Base Station Applications. Typical CW RF Performance at 960MHz, 26VDC:

AC30

Abstract: AD29 AG29 AG30 AK19
Contextual Info: ispLSI 3448 High-Density Programmable Logic J1 . J0 Output Routing Pool ORP H3 H2 K0 H1 H0 G3 D Q D Q K1 G2 OR Array D Q G1 AND Array K2 K3 D Q Twin GLB D Q OR Array G0 D Q D Q D Q D3 N0 D2 N1 Global Routing Pool (GRP) N2 D1 D0 N3 A0 A1 A2 A3 Output Routing Pool (ORP)

AA13

Abstract: AA19 AC11 AC13 AD12 bga 208 PACKAGE
Contextual Info: ispLSI 3320 High-Density Programmable Logic J0 F3 G2 G1 G0 F2 F1 F0 E3 D Q D Q H1 E2 OR Array D Q E1 AND Array H2 H3 D Q D Q OR Array Twin GLB E0 D Q D3 D Q D2 I1 D Q I2 D1 I3 D0 C3 Global Routing Pool GRP J1 C2 J2 C1 J3 C0 Output Routing Pool (ORP) I0

Contextual Info: ispLSI 2064V 3.3V High Density Programmable Logic Features Functional Block Diagram • HIGH DENSITY PROGRAMMABLE LOGIC • • Global Routing Pool GRP Input Bus A0 A1 A2 B5 Logic Array B3 B2 D Q GLB B4 D Q B1 D Q D Q Input Bus B6 B7 Output Routing Pool (ORP)

Contextual Info: F-206-1 Q F S -0 5 2 -0 1 -H -D -R T 1 Q F S -0 5 2 -0 1 -L -D -R F 1 COMBO Q2 SOCKETS OFl-RISErnE's^ SPECIFICATIONS For com plete specifications and recom m ended PCB layouts see w w w .sam tec.com ?Q FS-PC , w w w .sam tec.com ?Q FS-R F or w w w .sam tec.com ?Q FS-R T

AC30

Abstract: AD29 AG29 AG30 AK19 AJ-31 AJ22
Contextual Info: ispLSI 3448 Functional Block Diagram J3 J2 J1 . J0 Output Routing Pool ORP H3 Output Routing Pool (ORP) H1 H0 G3 D Q D Q K1 G2 OR Array D Q K2 G1 K3 D Q D Q OR Array Twin GLB G0 D Q . • ispLSI FEATURES: — 5V In-System Programmable (ISP ) Using Lattice

Contextual Info: F-206-1 0,635mm SMT HI-SPEED QTS, QSS SERIES SPECIFICATIONS M a t e s w ith : Q SS, QTS, S Q C D For com plete specifications and recom m ended PCB layouts see w w w .sam tec.com ?Q TS or w w w .sam tec.com ?Q SS Insulator M aterial: m Liquid C rystal Polym er

B272

Contextual Info: ispLSI 3160 In-System Programmable High Density PLD Features Functional Block Diagram ORP E3 E2 E1 E0 A0 ORP OR Array A3 AND Array D Q D2 D Q D Q D Q OR Array D Q Twin GLB D1 ORP ORP A2 D3 D Q A1 • HIGH PERFORMANCE E2CMOS® TECHNOLOGY — fmax = 125 MHz Maximum Operating Frequency

203d6

Abstract: B272
Contextual Info: ispLSI 3160 Features Functional Block Diagram ORP E3 E2 E1 E0 A0 ORP OR Array A3 AND Array D Q D2 D Q D Q D Q OR Array D Q Twin GLB D1 ORP ORP A2 D3 D Q A1 • HIGH PERFORMANCE E2CMOS® TECHNOLOGY — fmax = 125 MHz Maximum Operating Frequency — tpd = 7.5 ns Propagation Delay

B272

Contextual Info: ispLSI 3160 In-System Programmable High Density PLD Features Functional Block Diagram ORP E3 E2 E1 E0 A0 ORP OR Array A3 AND Array D Q D2 D Q D Q D Q OR Array D Q Twin GLB D1 ORP ORP A2 D3 D Q A1 • HIGH PERFORMANCE E2CMOS® TECHNOLOGY — fmax = 125 MHz Maximum Operating Frequency

B272

Abstract: BC470
Contextual Info: ispLSI 3160 In-System Programmable High Density PLD Features Functional Block Diagram ORP E3 E2 E1 E0 A0 ORP OR Array A3 AND Array D Q D2 D Q D Q D Q OR Array D Q Twin GLB D1 ORP ORP A2 D3 D Q A1 • HIGH PERFORMANCE E2CMOS® TECHNOLOGY — fmax = 125 MHz Maximum Operating Frequency

Contextual Info: ispLSI 3160 In-System Programmable High Density PLD Features Functional Block Diagram ORP E3 E2 E1 E0 A0 ORP OR Array A3 AND Array D Q D2 D Q D Q D Q OR Array D Q Twin GLB D1 ORP ORP A2 D3 D Q A1 • HIGH PERFORMANCE E2CMOS® TECHNOLOGY — fmax = 125 MHz Maximum Operating Frequency

AC30

Abstract: AD29 AG29 AG30 AK19 A11C12 90AG
Contextual Info: ispLSI 3448 In-System Programmable High Density PLD Functional Block Diagram J3 J2 J1 . J0 Output Routing Pool ORP H3 Output Routing Pool (ORP) H1 H0 G3 D Q D Q K1 G2 OR Array D Q K2 G1 K3 D Q D Q OR Array Twin GLB G0 D Q . • ispLSI FEATURES: — 5V In-System Programmable (ISP ) Using Lattice