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    PV1051F Search Results

    PV1051F Datasheets Context Search

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    pv101

    Abstract: PV76 PV221-8I PV510-8I
    Contextual Info: PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries


    Original
    m83446m83446/17pv160-8ipv250-8i+7pv510-8ipv760-8ipv101-8imil-std-202pv101pv76pv221-8i PDF

    srf 1714

    Abstract: PV22-3
    Contextual Info: El PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries for flip chip bonding. The core is slide tuned and may be fixed


    OCR Scan
    m83446m83446/17mil-std-202srf 1714+1pv22-3 PDF

    Contextual Info: PV SERIES Piconics PV series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate geometries for flip chip bonding. The core is slide tuned and may be fixed


    OCR Scan
    m83446m83446/17pv16arometricmil-std-202 PDF

    PV221-8I

    Contextual Info: Untitled Document Page 1 of 3 Tunables and Transformers PV Series Data Sheet Piconics PV Series has gold plated contact areas for bonding interconnecting leads. The bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substrate. Please note that the PV series can be made with special substrate


    Original
    m83446m83446/1720division/ttpv1051f+1pv221-8i PDF