PS5025G Search Results
PS5025G Datasheets (1)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| PS5025GT2-R50-T1 | SUSUMU | RF Power Dividers/Splitters, RF/IF and RFID, 50OHM RF POWER SPLITTER | Original | 1 |
PS5025G Price and Stock
Others PS5025GT2-R50-T1SPLITTER, 0MHZ MIN, 10000MHZ MAX |
|||||||||||
| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
|
PS5025GT2-R50-T1 | 203 |
|
Buy Now | |||||||
PS5025G Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Chip Power Splitter PS Series Specification subject to change - Please call factory. 1.0 Description A high frequency component using thin film technology to derive a power splitter. The surface mount package is ideal where low noise and low parasitic capacitance and inductance are required. The “G” Series |
Original |
ps1608gps2012gps3216gdc-10+3 | |
TO10 package
Abstract: PS3216G ps5025g
|
Original |
ps1608gps2010gps2012gto10ghz+7 | |
|
Contextual Info: High Precision Power Splitter PS Series Power splitter with excellent high frequency characteristics for applications from DCϳ20GHz Bit error is restrained by keeping high frequency digital signal stable Offer standard type with ground and custom type designed to customer' specification. |
Original |
20ghzps1608ps3216ps5025+5 | |
1005 0603 ,metricContextual Info: PS02M720.00 - Rev A - Page 1 of 2 Product Family: High Precision Chip Power Splitter Part Number Series: PS Series Construction: Features: • High Purity Alumina Substrate Ni alloy thin-film resistive elements Wrap around electrodes |
Original |
ps02m72020ghzps502510ghz+3 | |
PS3216G
Abstract: PS1608 ps2012 ps5025g
|
Original |
dc20ghzps1608ps2012ps3216+8 | |
s11 021t
Abstract: PCAA041B RG1005 1005 Series samyoung "Humidity Sensor" Susumu RG series part Marking ps1608G PCAA031 SUSUMU RP Susumu RL series part Marking CYNTEC 25201B
|
Original |
s11 021tpcaa041brg1005 1005 seriessamyoung "humidity sensor+6 | |
PS5025
Abstract: PS2012GT2R50 PS2012 PS1608 PS3216 PS2012G ps3216t PS1608-T2-R50-T1
|
Original |
20ghz125mw250mw500mw+11 | |
|
Contextual Info: PS02M720.00 - Rev C - Page 1 of 2 Construction: • High Purity Alumina Substrate Ni alloy thin-film resistive elements Wrap around electrodes Offered with and without ground 100% matte tin over Ni terminations RoHS compliant and Pb Free |
Original |
ps02m72020ghz125mw250mw+4 | |
ps1608G
Abstract: PS2012 PS5025G PS5025 PS1608 PS3216
|
Original |
dc20ghzps1608ps3216ps5025+8 | |
|
Contextual Info: Chip Power Splitter PS Series Specification subject to change - Please call factory. 1.0 Description A high frequency component using thin film technology to derive a power splitter. The surface mount package is ideal where low noise and low parasitic capacitance and inductance are required. The “G” Series |
Original |
ps1608gps2012gps3216gps5025g+2 | |
|
Contextual Info: Chip Power Splitter PS Series Specification subject to change - Please call factory. 1.0 Description A high frequency component using thin film technology to derive a power splitter. The surface mount package is ideal where low noise and low parasitic capacitance and inductance are required. The “G” Series |
Original |
ps1608gps2012gdc-101608g+2 | |
1608GContextual Info: Chip Power Splitter PS Series Specification subject to change - Please call factory. 1.0 Description A high frequency component using thin film technology to derive a power splitter. The surface mount package is ideal where low noise and low parasitic capacitance and inductance are required. The “G” Series |
Original |
ps1608gps2012gps3216gps5025g+2 | |
|
Contextual Info: Chip Power Splitter PS Series Specification subject to change - Please call factory. 1.0 Description A high frequency component using thin film technology to derive a power splitter. The surface mount package is ideal where low noise and low parasitic capacitance and inductance are required. The “G” Series |
Original |
ps1608gps2010gps2012gps3216gt2+4 | |
|
Contextual Info: Chip Power Splitter PS Series Specification subject to change - Please call factory. 1.0 Description A high frequency component using thin film technology to derive a power splitter. The surface mount package is ideal where low noise and low parasitic capacitance and inductance are required. The “G” Series |
Original |
ps1608gps2012gps3216gps5025g+2 | |
|
|
|||
english 1608
Abstract: PS2012GT2R50 land pattern 0805 recommended land pattern for 0402 PS5025GT2-R50-B
|
Original |
ps02m72020ghz100mw125mw+7 | |
|
Contextual Info: Chip Power Splitter PS Series Specification subject to change - Please call factory. 1.0 Description A high frequency component using thin film technology to derive a power splitter. The surface mount package is ideal where low noise and low parasitic capacitance and inductance are required. The “G” Series |
Original |
ps1608gps2012gdc-1010-max+3 | |
ps1608G
Abstract: RM2012 electronic passive components catalog RF Transceiver 1.9 ghz chip resistor 1206 RA1632 RS8A Chip Array Resistors RG1005 1005 Series PS5025 Susumu RG1608
|
Original |
iso9001iso14001ps1608grm2012+8 | |
Power Splitters
Abstract: PS5025G-T2-R50-B PS2012 PS2012GT2-R50-T5 PS3216 PS1608 ps5025g ps5025
|
Original |
ps02m72020ghz10ghz15ghz+10 | |
ps1608G
Abstract: PS1608 PS2012 PS3216 PS5025 RN1632F 0401 R246 PS3216G
|
Original |
dc20ghzps1608ps2012ps3216+10 | |