PREHEAT Search Results

Ignition Driver IC

Abstract: programmable ignition control PT5615 ptc fluorescent ballast HALF-BRIDGE DRIVER PT5615-S high frequency ignition
Contextual Info: PT5615 Ballast Control IC DESCRIPTION The PT5615 is a ballast control IC, with the 650V half-bridge driver and full protections, designed to drive all types of fluorescent lamps. The features such as programmable preheat time and frequency, programmable and precise run frequency, self-adapting

V23071-A1010-A132

Abstract: V23071-A1009-A132 V23071 v23071-a1010 Tyco V23071 2150A1
Contextual Info: Automotive Relays PCB Single Relays Power Relay K-S n n Very low voltage drop Wide voltage range Typical applications ABS control, blower fans, cooling fan, engine control, glow plug, heated rear screen, ignition, main switch/supply relay, preheating system, valves, wiper

"Rectifier Tube" 575a

Abstract: rectifier tube 575 Amperex FULL WAVE RECTIFIER CIRCUITS
Contextual Info: A M P E R E X MERCURY V A P O R RECTIFIER 5 75 -A FILAMENT A.C. V o l t a g e . 5.0 Current a m p e r e s .10.0 Preheating Period ( S e c o n d s ) * . 30

Rectifier Tubes

Abstract: FULL WAVE RECTIFIER CIRCUITS application Amperex 857-B "Rectifier Tubes" FULL WAVE RECTIFIER CIRCUITS
Contextual Info: AMPEREX MERCURY VAPOR RECTIFIER 857-B FILAMENT A.C. V o l t a g e .5.0 Current a m p e r e s .30.0 Preheating Period ( S e c o n d s ) * .300

dimension 1210 case

Contextual Info: 10/25/99 70 Maxess Road ! Melville, New York 11747 631 936-7500 ! Fax (631) 396-7575 RECOMMENDED SOLDERING PROFILES NVS series, SMT Multilayer Tranisent Voltage Suppressors Reflow Soldering +250° +220° Max. +200° TEMP ( °C ) +150° +130° Preheat +100°

PTC 100 thermistors

Abstract: ptc fluorescent ballast thermistor ptc 300 ptc 820 ptc 75 307C LIGHTING THERMISTORS 307C1414 PTC 300 thermistors 307C 307C1171
Contextual Info: 307C Lighting Thermistors Vishay Cera-Mite PTC Thermistors For Electronic Fluorescent Ballasts FEATURES • Electrode preheat thermistors for use in compact fluorescent lamps CFL and electronic ballasts. • Current limiting, time-delayed start-up extends lamp life.

GP1S33

Contextual Info: GP1S33 GP1S33 Subminiature, Reflow Soldering Type Photointerrupter • Features ■ Outline Dimensions 1. Ultra-compact package 2. PWB mounting type 3. High sensing accuracy Slit width : 0.3mm 4. Applying to reflow soldering Preheat : 160˚C within 120 seconds

Fairchild taping

Contextual Info: PLCC-2 DETECTOR RECOMMENDED PRINTED CIRCUIT BOARD PATTERN 0.063 [1.60] 0.095 [2.41] 0.071 [1.80] 2X RECOMMENDED IR REFLOW SOLDERING PROFILE 5 sec MAX soldering time 240°C MAX +5°C/s MAX -5°C/s MAX 60–120 sec Preheating 120–150°C MAX 2002 Fairchild Semiconductor Corporation

Infrared Emitting Diode

Abstract: PLCC2 diode
Contextual Info: PLCC-2 DIODE RECOMMENDED PRINTED CIRCUIT BOARD PATTERN 0.063 [1.60] 0.095 [2.41] 0.071 [1.80] 2X RECOMMENDED IR REFLOW SOLDERING PROFILE 5 sec MAX soldering time 240°C MAX +5°C/s MAX -5°C/s MAX 60–120 sec Preheating 120–150°C MAX 2002 Fairchild Semiconductor Corporation

rph3

Abstract: igbt ignition ignition IGBTS drivers electronic ballast ignition IGBTS ignition timing IR21571 Sd pcb variable oscillator Zener 5.1V
Contextual Info: ADVANCE INFORMATION Data Sheet PD No. 60179 IR21571 FULLY INTEGRATED BALLAST CONTROL IC Features • • • • • • • • Programmable preheat time & frequency • Programmable ignition ramp • Protection from failure-to-strike • Lamp filament sensing & protection

ILSB-0805

Abstract: 0049
Contextual Info: ILSB-0805 Vishay Dale Monolithic Chip Inductors FEATURES • • • • MECHANICAL SPECIFICATIONS Solderability: 90 % coverage after 5 second dip in 235 °C solder following 60 second preheat at 120 °C to 150 °C and type R flux dip Resistance To Solder Heat: 10 seconds in 260 °C solder

Contextual Info: Choke Coils Soldering Conditions Temperature °C • Reflow soldering conditions T3 T2 T1 t2 t1 Time ● Pb free solder recommended temperature profile Preheat Soldering Peak Temperature Products Item Power Inductors / Wire Wound type T1 [°C] t1 [s] T2 [°C]

Contextual Info: Weller Digital Preheating Plate, 200 W, 120 V Product Details Catalog No. WHP200 UPC Code 037103229649 Fits Station WHA3000PS Wattage 200 W Temperature 150° F to 850° F Range Voltage 120 V Supplied None Tip s Iron Stand None Packaging Industrial Box/Carton

ILC0805ER1N5S

Abstract: ILC0805ER1N8S ILC0805ER2N2S ILC0805ER2N7S ILC0805ER3N3S ILC0805ER3N9S ILC0805ER4N7S ILC0805ER5N6S ILC0805ER6N8J
Contextual Info: ILC-0805 Vishay Dale Surface Mount, Multilayer High Frequency Ceramic Inductors FEATURES • • • • MECHANICAL SPECIFICATIONS Solderability: 90 % coverage after 5 s dip in 235 °C solder following 60 s preheat at 120 °C and type R flux dip Resistance to Solder Heat: 10 s in 260 °C solder, after

Contextual Info: ILC-0805 Vishay Dale Surface Mount, Multilayer High Frequency Ceramic Inductors FEATURES MECHANICAL SPECIFICATIONS Solderability: 90 % coverage after 5 s dip in 235 °C solder following 60 s preheat at 120 °C and type R flux dip Resistance to Solder Heat: 10 s in 260 °C solder, after

Pb and Pb-free Reflow Soldering Temperature Profiles

Abstract: TB493 JEP-140
Contextual Info: Technical Brief 493 Sn/Pb and Pb-free Reflow Soldering Temperature Profiles TABLE 1. REFLOW PROFILES PROFILE FEATURE SN-PB EUTECTIC ASSEMBLY PB-FREE ASSEMBLY Temperature Min TSMIN 100°C 150°C Temperature Max (TSMAX) 150°C 200°C Preheat/Soak Time (tS) from (TSMIN to TSMAX)

Contextual Info: BSI IR Profile 連邦科技股份有限公司 Brilliance Semiconductor Inc. Temp BSI Tp tp Ramp-up TL tL Tsmax Ramp-down Tsmin Ts preheat Time T 25dc to peak IR Profile 2006/5/5 P1 BSI 連邦科技股份有限公司 Brilliance Semiconductor Inc. BSI IR Profile

J-STD-020-C

Abstract: J-STD-020C JEDEC J-STD-020c 020C reflow profile JSTD020C JEDEC wave reflow profile 245
Contextual Info: Lead-Free Reflow Profile Recommendation IPC/JEDEC J-STD-020C Reflow Parameter Minimum preheat temperature (TsMIN) Maximum preheat temperature (TsMAX) Preheat time TsMAX to TL ramp-up rate Time above temperature TL (tL ) Peak temperature (TP) Time 25 °C to TP

Contextual Info: Reliability Tests Report Product Name: TC74LVX32FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC245FK Package Name: US20 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74LVX04FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74LCX00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC157FT Package Name: TSSOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s

Contextual Info: Reliability Tests Report Product Name: TC7PB54FK Package Name: US8 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s