PPGA Search Results

pentium MOTHERBOARD CIRCUIT diagram

Abstract: T40 N03 am24 "pin compatible" processor cross reference intel pentium MMX simd 1997 z02 surface mounted transistor
Contextual Info: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)

PQFP chip size

Abstract: transistor ZR cqfp package outline FLATPACK ceramic package cerdip z PACKAGE J-Lead, plcc package on package chips
Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK CQFP SOJ

ppga package

Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter, to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA RTSOP SOIC W-CerPACK

Bulk Decoupling 430TX

Abstract: Socket-7 296 430TX Configuration 273232 SL Enhanced GC80503CSM66166 FV80503
Contextual Info: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)

Pentium Processors

Abstract: C 548 B 430TX 82430TX 296-Pin
Contextual Info: Low-Power Embedded Pentium Processors with MMX Technology PRODUCT HIGHLIGHTS • Low-power Pentium® processor with MMX™ technology for embedded applications: 166 and 266 MHz, PPGA and HL-PBGA packaging ■ Surface mount high thermal, low-profile Plastic Ball Grid Array

Contextual Info: MECHANICAL DATA MPPG001 – NOVEMBER 1995 GP S-PPGA-P168 PLASTIC PIN GRID ARRAY PACKAGE 1.765 (44,83) SQ 1.759 (44,68) 1.600 (40,64) TYP 0.100 (2,54) TYP S R Q P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Heat Spreader 0.120 (3,05)

design ideas

Abstract: Q002 CP21200 TRANSISTOR ARRAY CP21600
Contextual Info: PERFORMANCE SEMI CONDUCTOR SOE » • 7 G b 2 S cì 7 D0G23fcj7 ID b «PSC PERFORMANCE PROGRAMMABLE GATE ARRAY PPGA SERIES T^ÿé —{*?—}/ ¿4 -

PQFP 132 PACKAGE DIMENSION intel

Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

t3055el

Abstract: 82443zX hd Intel 440ZX-66 AGPset philips HD6 series 82443ZX foxconn t15 intel pentium 4 motherboard schematic diagram what is the state name for 74HC112 CRYSTAL 14.318MHZ 440ZX-66
Contextual Info: Intel Celeron Processor PPGA with the Intel® 440ZX-66 AGPset Design Guide March 1999 Order Number: 245126-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

BUW52

Abstract: transistor st z7 S877 transistor 026a N1010A Scans-007954 LC8a DQ26A
Contextual Info: 7^5^537 ppgaa?! M • S G S -T H O M S O N ■ [L d e T F G M O ! S G S - T HO MS ON B 3ÜE U W 5 2 D FAST SWITCHING POWER TRANSISTOR ■ FAST SW ITCHING TIMES ■ LOW SW ITCHING LOSSES ■ VERY LOW SATURATION VOLTAGE AND HIGH GAIN ABSOLUTE MAXIMUM RATINGS

apic - s03

Abstract: list 200 prise bond
Contextual Info: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • Support for M M X ™ Technology ■ Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 M Hz Core Supply for PPGA — 1.8 V (166 M Hz) or 2.0 V (266 M Hz)

88 lead cpga

Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

PPG-36F-5

Abstract: PPG-36F-6 PPG-36F-7 PPG-36F-8 PPG-36F-9 PPG-36F-1 PPG-36F-2 PPG-36F-3 PPG-36F-4
Contextual Info: =Fa s t Lo gic Programmable Pulse fip n p r a tn r s e r ie s : U C I I C ia iU I PPGa>36F 6 Bit TTL Interfaced Features: • Precise pulse width. ■ Inverted & non-inverted outputs. ■ 6-BIT address. ■ 1 ns to 10 ns incremental steps. ■ Rising-edge triggered.

Contextual Info: Data Sheet July 1998 group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNG A, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption, and significantly lower levels of EMI

BPNPA16P

Contextual Info: Data Sheet November 1997 microelectronics group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,

tucker

Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
Contextual Info: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or

NEC c317

Abstract: mov rdn 240 MOV RDN 240/ 12 txc 14.318MHZ PC MOTHERBOARD CIRCUIT diagram intel 810 c141 nec 1.5 KE 56 A c209 diode bjt transistor c243 nec c277 ftd-11
Contextual Info: 8 7 6 5 4 3 2 1 INTEL R CELERON(TM) PROCESSOR (PPGA)/INTEL(R) 810 CHIPSET UNIPROCESSOR CUSTOMER REFERENCE SCHEMATICS REVISION 1.3 D C B A D TITLE PAGE Cover Sheet Block Diagram 370-Pin Socket GTL Termination Clock Synthesizer GMCH Frame Buffer DIMM Sockets

Contextual Info: March 1997 DataSheet microelectronics group * r Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features Description • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,

dp1a

Contextual Info: Data Sheet August 1997 m ic r o e le c t r o n ic s group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,

Contextual Info: data delay W devices^inc. îF ast Logic Programmable Puise R p n p ra tn r series : U C I I C I a t U I PPGa36F 6 Bit T T L interfaced Features: • Precise pulse width. ■ Inverted & non-inverted outputs. ■ 6-BIT address. ■ 1 ns to 10 ns incremental steps.

LTS2801AWC

Abstract: MB90F352 LTS-2801AWC MAX3232CSE pin54 PIN21
Contextual Info: 5 4 3 2 1 D D Pin[1.64] 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 AVSS AVRH P62/AN2/PPG4 5 P63/AN3/PPG6(7) P64/AN4/PPG8(9) P65/AN5/PPGA(B) P66/AN6/PPGC(D) P67/AN7/PPGE(F) P50/AN8/SIN2 P51/AN9/SOT2 P52/AN10/SCK2 P53/AN11/TIN3 P54/AN12/TOT3 P55/AN13 P56/AN14

Contextual Info: PERFORMANCE SEMICONDUCTOR 70^25^7 □□□23b? 10b « P S C SOE » PERFORMANCE PROGRAMMABLE GATE ARRAY PPGA SERIES ¿4- High performance field programmable gate

cqfp package outline

Abstract: ceramic
Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK